| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 10/05/1993 | US5250394 Screen printing thick film paste in pattern; drying; firing to form conductive layer; repeating with metallorganic conductive noble metal paste |
| 10/05/1993 | US5250371 Weldless surface mounted interconnect |
| 10/05/1993 | US5250363 Chromium-zinc anti-tarnish coating for copper foil having a dark color |
| 10/05/1993 | US5250329 Method of depositing conductive lines on a dielectric |
| 10/05/1993 | US5250319 Embedding polymerization catalyst in grooves in substrate, contacting with monomer to form electroconductive polymer oriented in longitudinal direction of grooves |
| 10/05/1993 | US5250229 A mixture of finely divided particle of oxides of bismuth, copper, lead, zinc and transition metal; thick films |
| 10/05/1993 | US5250105 Selective process for printing circuit board manufacturing |
| 10/05/1993 | US5249973 Card type junction box |
| 10/05/1993 | US5249520 Caused by separation of perforated sheet from surface after screening |
| 10/05/1993 | US5249355 Method of fabricating a multilayer electrical circuit structure |
| 10/05/1993 | US5249348 Pressure foot insert changer |
| 10/05/1993 | CA2022400C Method for improving insulation resistance of printed circuits |
| 10/03/1993 | WO1993020255A1 Process for producing and adhesive bond between copper layers and ceramics |
| 09/30/1993 | WO1993019576A1 Method and apparatus for connecting fine pitch leaded electronic components to printed circuit boards |
| 09/30/1993 | WO1993019575A1 Process for soldering printed circuit boards under low pressure |
| 09/30/1993 | WO1993019488A1 Surface mountable integrated circuit package |
| 09/30/1993 | WO1993019483A1 Process for fabricating an active matrix circuit |
| 09/30/1993 | WO1993019153A1 Method of cleaning epoxy articles |
| 09/30/1993 | DE4309167A1 Schaltungssubstratvorrichtung Circuit substrate device |
| 09/30/1993 | DE4305399A1 Leiterplattenverstärkung PCB gain |
| 09/30/1993 | DE4210275A1 Electrical component contact arrangement esp. in motor vehicle - includes sharp points in upwardly curved portions of contact springs compressed by fixing of component on circuit board to housing |
| 09/30/1993 | DE4209466A1 Press-loading layout for production of PCB laminates - in which circulating system builds up stacks of prepreg plus top and bottom copper@ foils, cauls and press cushions and loads into multi-daylight press |
| 09/29/1993 | EP0562727A2 Post retention arrangement |
| 09/29/1993 | EP0562670A1 Method of manufacturing a plate of electrically insulating material having a pattern of apertures and/or cavities |
| 09/29/1993 | EP0562579A1 Electrical contact with anti-solder wicking tab |
| 09/29/1993 | EP0562571A2 Printed circuit module |
| 09/29/1993 | EP0562569A2 Anisotropic adhesive for fixing an electronic component to a printed circuit module |
| 09/29/1993 | EP0562438A1 SDM type thermal protector |
| 09/29/1993 | EP0562393A1 Process for improving the adhesion of electrolessly deposited metal coatings |
| 09/29/1993 | EP0562340A2 Dimple interconnect for flat cables and printed wiring boards |
| 09/29/1993 | EP0562308A2 Charge plate connectors and method of making |
| 09/29/1993 | EP0562243A1 Solder wave-protecting rails for printed circuits |
| 09/29/1993 | EP0562187A1 Process for production of copper through-hole printed wiring boards |
| 09/29/1993 | EP0561806A1 Electrical device, in particular a switching and control device for motor vehicles. |
| 09/29/1993 | EP0561794A1 Shield gas wave soldering. |
| 09/28/1993 | US5248853 Semiconductor element-mounting printed board |
| 09/28/1993 | US5248852 Resin circuit substrate and manufacturing method therefor |
| 09/28/1993 | US5248752 Improved moisture resistance, inks, coatings, sealants, adhesives |
| 09/28/1993 | US5248625 Techniques for forming isolation structures |
| 09/28/1993 | US5248527 On copper, measuring concentration of copper ions |
| 09/28/1993 | US5248383 Process for producing cutting dies |
| 09/28/1993 | US5248382 Removing copper in form copper oxide with ammonium salts, regeneration of solution |
| 09/28/1993 | US5248028 Apparatus for firing printed matter onto substrates |
| 09/28/1993 | US5247953 Welled sump for use in chemical process machinery |
| 09/28/1993 | US5247735 Electrical wire deletion |
| 09/28/1993 | CA1322624C Polyimide film and its manufacturing method |
| 09/23/1993 | DE4225378A1 Verfahren zum verloeten von leiterplatten unter niederdruck Method for soldering circuit boards under low pressure |
| 09/23/1993 | DE4209072A1 Stress free liquid crystal display system - embeds connections from conductors to printed circuit board leads in e.g. epoxy] resin which is cured in UV and unheated |
| 09/23/1993 | DE4208988A1 Method for determining the quality of solder pastes - measures the force exerted on a probe dipped into a paste sample subjected to heating |
| 09/22/1993 | EP0561620A2 Wiring sheet assemblies, and forming electrical connections thereof |
| 09/22/1993 | EP0561527A1 Solder application to a circuit board |
| 09/22/1993 | EP0561486A1 Substrate tilt-type exposure apparatus |
| 09/22/1993 | EP0561352A1 Acrylic adhesive composition and organoboron initiator system |
| 09/22/1993 | EP0561184A1 Device for treating objects, especially electroplating device for circuit boards |
| 09/22/1993 | EP0561052A1 Heat resistant electrolaminates, preparation and use thereof |
| 09/22/1993 | EP0561048A2 Superior thermal transfer adhesive |
| 09/22/1993 | EP0560861A1 Tacking agent |
| 09/22/1993 | EP0552252A4 Saturated linear polyfluorohydrocarbons, processes for their production, and their use in cleaning compositions |
| 09/21/1993 | US5247455 Method of verifying wiring layout |
| 09/21/1993 | US5247351 High definition television system compatible with NTSC system |
| 09/21/1993 | US5247291 Display with improved frame surrounding display element |
| 09/21/1993 | US5247248 Burn-in apparatus and method of use thereof |
| 09/21/1993 | US5246979 Acrylamide-functional, metal carboxylate stabilizer, photosensitizer |
| 09/21/1993 | US5246817 Method for manufacture of multilayer circuit board |
| 09/21/1993 | US5246813 Method of exposing printed wiring boards having through holes |
| 09/21/1993 | US5246745 Laser-induced chemical vapor deposition of thin-film conductors |
| 09/21/1993 | US5246732 Applying a metal, etching, activation with lead salts and electroless plating copper |
| 09/21/1993 | US5246731 Method of and apparatus for depositing solder on the terminal pads of printed circuit boards |
| 09/21/1993 | US5246730 Process for conformal coating of printed circuit boards |
| 09/21/1993 | US5246617 Azeotropic compositions of 1,1-dichloro-1-fluoroethane and methanol/ethanol |
| 09/21/1993 | US5246564 Method of manufacturing copper-polyimide substrate |
| 09/21/1993 | US5246538 Adhesive bonding of poly(arylene sulfide) surfaces |
| 09/21/1993 | US5246391 Solder-bearing lead |
| 09/21/1993 | US5246316 Work table orientation apparatus and method |
| 09/21/1993 | US5246024 Cleaning device with a combustible solvent |
| 09/21/1993 | US5246023 Method and apparatus to clean and cleanliness test printed circuit boards |
| 09/21/1993 | US5245751 Array connector |
| 09/21/1993 | US5245750 Method of connecting a spaced ic chip to a conductor and the article thereby obtained |
| 09/21/1993 | CA2019615C Wire scribed circuit boards and methods of their manufacture |
| 09/21/1993 | CA1322271C Carrier tape for electronic circuit elements and method of manufacturing an electronic circuit element series |
| 09/20/1993 | CA2063461A1 Photo-mask for three-dimensional objects |
| 09/18/1993 | CA2091701A1 Acrylic adhesive composition and organoboron initiator system |
| 09/16/1993 | WO1993018440A1 Method for preparing and using a screen printing stencil having raised edges |
| 09/16/1993 | WO1993017824A1 Transport device and process for a vapour-phase soldering installation |
| 09/16/1993 | DE4307600A1 Ceramic compsn. based on borosilicate glass, used in ceramic circuit board - contg. alumina filler and cordierite to control sintering temp., thermal expansion, dielectric constant and flexural strength |
| 09/16/1993 | DE4216940A1 Metallisation of the inside of holes in plastic (esp. PTFE) circuit boards - by 2 stage metallising, comprising initial deposition by sputtering, followed by electrolytic deposition as usual |
| 09/16/1993 | DE4206700A1 Contacting device for conductor paths arranged on carrier and flexible conductor sheet - has carrier and flexible sheet positioned so as to overlap each other and conductor paths respectively parallel to each other can be connected conducting with each other |
| 09/15/1993 | EP0560718A2 Electronic read-only memory |
| 09/15/1993 | EP0560442A1 Method of manufacturing an electrically conductive pattern of tin-doped indium oxide (ITO) on a substrate |
| 09/15/1993 | EP0560384A1 Elastomeric metallized fabric and process of making same |
| 09/15/1993 | EP0560380A1 Elastic metallized film and process for making same |
| 09/15/1993 | EP0560077A2 Multichip module substrate and method of manufacture thereof |
| 09/15/1993 | EP0560072A2 Anisotropic electrically conductive adhesive film and connection structure using the same |
| 09/15/1993 | EP0559863A1 Method for forming solder bump interconnections to a solder-plated circuit trace |
| 09/15/1993 | EP0559855A1 Flat module. |
| 09/15/1993 | EP0559777A1 A process and composition for cleaning contaminants with terpene and monobasic ester |
| 09/15/1993 | EP0552286A4 Ternary azeotropic compositions of 43-10mee (cf 3?chfchfcf 2?cf 3?) and trans 1,2-dichloroethylene with methanol or ethanol |
| 09/14/1993 | US5245509 Printed circuit board arrangement with surface-mounted connector strip and a method for manufacturing the arrangement |
| 09/14/1993 | US5245248 Micro-emitter-based low-contact-force interconnection device |
| 09/14/1993 | US5245135 Stackable high density interconnection mechanism (SHIM) |