Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
---|
10/23/1993 | CA2094460A1 Sensor unit for controlling a passenger restraint system in a vehicle |
10/20/1993 | EP0566360A1 Process for the production of substrate for printed wiring |
10/20/1993 | EP0566286A1 Photoresist stripping method |
10/20/1993 | EP0566206A1 Electrical connection device |
10/20/1993 | EP0566043A2 Method of producing boards for printed wiring |
10/20/1993 | EP0565908A2 Apparatus and method for injection molding solder and application thereof |
10/20/1993 | EP0565858A1 Radiation-sensitive compositions |
10/20/1993 | EP0495035A4 Method of applying metallized contacts to a solar cell |
10/20/1993 | EP0423184B1 Device for rapid applying of pastes and adhesives at discrete points, especially for surface mounting of components at circuit cards |
10/20/1993 | EP0258452B1 Process for producing copper-clad laminate |
10/20/1993 | CN2144392Y Wave crest dip soldering machine |
10/20/1993 | CN1022511C Isothermal Termination block having multi-layer thermal conductor |
10/19/1993 | US5255159 Circuit board spacer |
10/19/1993 | US5255155 Structure of electric circuit panel for instrument panel of automobile and method for forming the same |
10/19/1993 | US5254871 Very large scale integrated circuit package, integrated circuit carrier and resultant interconnection board |
10/19/1993 | US5254811 Hybrid microchip bonding article |
10/19/1993 | US5254493 Method of fabricating integrated resistors in high density substrates |
10/19/1993 | US5254435 Method of patterning resist |
10/19/1993 | US5254362 Applying solder paste through stencil with squeegee which is moved in planar direction and vibrated in circular motion for uniform deposition |
10/19/1993 | US5254361 Method for producing printed circuit boards |
10/19/1993 | US5254191 Method for reducing shrinkage during firing of ceramic bodies |
10/19/1993 | US5254156 Aqueous solution for activation accelerating treatment |
10/19/1993 | US5253559 Device and system for piercing printed circuits |
10/14/1993 | WO1993020674A1 Process for applying a plastic coating and device for implementing it |
10/14/1993 | WO1993020673A1 Circuit board connections |
10/14/1993 | WO1993020562A1 Conductor-filled thermosetting resin |
10/14/1993 | WO1993020560A1 High-density double-sided multi-string memory module |
10/14/1993 | WO1993020519A1 Future bus bus termination network |
10/14/1993 | WO1993020263A1 Method of metallizing non-conducting surfaces, in particular circuit boards |
10/14/1993 | WO1993020123A1 A high performance epoxy based laminating adhesive |
10/14/1993 | WO1993019887A1 Methods of manufacturing perforated foils |
10/14/1993 | WO1993019857A1 Layered chip structure |
10/14/1993 | DE4311266A1 Electroless solder plated circuit board mfg. process - avoids copper@ layer attack by solder plating soln. |
10/14/1993 | DE4243912A1 Light sensitive transfer material - has thermoplastic resin as release coat between temporary film base and intermediate coat, to prevent flaws and soiling on laminating light-sensitive resin coat to permanent substrate |
10/14/1993 | DE4211882A1 Conducting pathway layer structure for PCBs - comprising electrically conducting metallic conducting layers sepd. by metallic diffusion barrier layer |
10/14/1993 | DE4211342A1 Verfahren zum Aufbringen einer Kunststoffschutzschicht sowie Vorrichtung zur Durchführung des Verfahrens A method for applying a protective plastic layer, and device for carrying out the method |
10/14/1993 | DE4211241A1 Desoldering surface mounted device components - melting solder in steam of fluid or by spraying hotter fluid onto solder points |
10/14/1993 | DE4210900A1 Verfahren zur Herstellung eines haftfesten Verbundes zwischen Kupferschichten und Keramik A process for the preparation of a firmly adhesive bonding between the copper layers and ceramic |
10/14/1993 | DE4207166C1 Transportvorrichtung und -verfahren für eine Dampfphasenlötanlage Transport apparatus and method for a vapor phase reflow |
10/14/1993 | CA2133839A1 A high performance epoxy based laminating adhesive |
10/14/1993 | CA2132842A1 Circuit board connections |
10/14/1993 | CA2132747A1 Layered chip structure |
10/13/1993 | EP0565427A1 Device for transferring printed circuit boards for an installation for thermal treatment by convection and installation therefor |
10/13/1993 | EP0565341A2 Method for treating small holes in substrate material |
10/13/1993 | EP0565233A1 Photosensitive laminate having dual intermediate layers |
10/13/1993 | EP0565151A2 Manufacture of multi-layer ceramic interconnect structures |
10/13/1993 | EP0565033A1 Method for fabricating a ceramic multi-layer substrate |
10/13/1993 | EP0564780A1 Methods and apparatus for maintaining electroless plating solutions |
10/13/1993 | EP0564693A1 Film carrier type substrate and method of manufacturing the same |
10/13/1993 | EP0564652A1 Manufacture of multilayer ceramic part, and multilayer ceramic part |
10/13/1993 | EP0329782B1 Digitizing tablet |
10/13/1993 | EP0258451B1 Method of producing conductor circuit boards |
10/12/1993 | US5253145 Compliant cantilever surface mount lead |
10/12/1993 | US5253144 Device housing having an integrated circuit board |
10/12/1993 | US5252858 Glass frit fired with metal oxide filler and binder |
10/12/1993 | US5252855 Lead frame having an anodic oxide film coating |
10/12/1993 | US5252784 Electronic-parts mounting board and electronic-parts mounting board frame |
10/12/1993 | US5252781 Substrate member having electric lines and apertured insulating film |
10/12/1993 | US5252703 Polyimidosiloxane resin and composition thereof and method of applying same |
10/12/1993 | US5252700 Polyamic acid or polyimide endblocked with aromatic dicarboxylic anhydrides |
10/12/1993 | US5252694 Curable epoxy-acrylate mixture, catalyst system, peroxide, and alcohol |
10/12/1993 | US5252519 Multilayered ceramic substrate and method of manufacturing the same |
10/12/1993 | US5252503 Techniques for forming isolation structures |
10/12/1993 | US5252383 Metallized fluororesin with hydrophilic macromolecular film adhered |
10/12/1993 | US5252355 Reducing the copper oxide obtained by oxidized a copper foil with a reducing gas |
10/12/1993 | US5252195 Process for producing a printed wiring board |
10/12/1993 | US5251806 Method of forming dual height solder interconnections |
10/12/1993 | CA2029818C Surface-mount filter |
10/12/1993 | CA2024383C Hermetic package for an electronic device and method of manufacturing same |
10/12/1993 | CA2013378C Technique for object orientation detection using a feed-forward neural network |
10/07/1993 | DE4211355A1 Circuit board component mounting system - has adhesive between circuit component and circuit board section having rupture line allowing easy subsequent removal |
10/07/1993 | DE4211253A1 Electroplating appts. for plate-like parts esp. PCB |
10/07/1993 | DE4205721A1 Conductor shrouding - uses a deposited plastics to give a semi=finished circuit ribbon or circuit board |
10/06/1993 | EP0564335A1 Process for assembling a connector provided with bent contact elements |
10/06/1993 | EP0564117A2 Method and apparatus for replacing electronic components on a printed circuit board |
10/06/1993 | EP0564096A1 Soldering apparatus |
10/06/1993 | EP0564080A2 Aligning a substrate with orifices in an ink jet printhead |
10/06/1993 | EP0564072A2 Efficient conductor routing for inkjet printhead |
10/06/1993 | EP0564019A2 Multilayer thermoplastic electronic package and method of making same |
10/06/1993 | EP0563829A2 Device for inspecting printed cream solder |
10/06/1993 | EP0563668A2 Cooling device for bare integrated components assembled as a flat structure |
10/06/1993 | EP0563257A1 A method of cloning printed wiring boards. |
10/06/1993 | EP0563247A1 Photodefinable interlevel dielectrics |
10/06/1993 | EP0491020B1 Etching solution |
10/06/1993 | EP0364479B1 Gold compression bonding |
10/06/1993 | EP0316452B1 Process for preparing thin film of base metal and application of the same |
10/06/1993 | EP0312607B1 Power circuit board and manufacturing method |
10/06/1993 | EP0242369B1 Surface mountable integrated circuit packages having solder bearing leads |
10/06/1993 | EP0231384B1 A method for preparing a printed wiring board for installation in an ic card |
10/06/1993 | EP0145725B1 Method of and apparatus for real-time high-speed inspection of objects for identifying or recognizing known and unknown portions thereof, including defects and the like |
10/06/1993 | CN1022361C Multi-pulse laser beam generation method and device |
10/05/1993 | US5251108 Laminated electronic device with staggered holes in the conductors |
10/05/1993 | US5250848 For semiconductors, stability, durability |
10/05/1993 | US5250781 Laser bonding apparatus |
10/05/1993 | US5250759 Surface mount component pads |
10/05/1993 | US5250758 Methods and systems of preparing extended length flexible harnesses |
10/05/1993 | US5250757 Printed wiring board having a connecting terminal |
10/05/1993 | US5250591 Comprising an acrylated prepolymer, an unsaturated reactive diluent, polymerization initiator and a spherical and flaky inorganic filler; fixing chip resistors and capacitors to circuit boards for subsequent soldering |
10/05/1993 | US5250470 Method for manufacturing a semiconductor device with corrosion resistant leads |
10/05/1993 | US5250469 IC mounting circuit substrate and process for mounting the IC |