Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/1993
10/23/1993CA2094460A1 Sensor unit for controlling a passenger restraint system in a vehicle
10/20/1993EP0566360A1 Process for the production of substrate for printed wiring
10/20/1993EP0566286A1 Photoresist stripping method
10/20/1993EP0566206A1 Electrical connection device
10/20/1993EP0566043A2 Method of producing boards for printed wiring
10/20/1993EP0565908A2 Apparatus and method for injection molding solder and application thereof
10/20/1993EP0565858A1 Radiation-sensitive compositions
10/20/1993EP0495035A4 Method of applying metallized contacts to a solar cell
10/20/1993EP0423184B1 Device for rapid applying of pastes and adhesives at discrete points, especially for surface mounting of components at circuit cards
10/20/1993EP0258452B1 Process for producing copper-clad laminate
10/20/1993CN2144392Y Wave crest dip soldering machine
10/20/1993CN1022511C Isothermal Termination block having multi-layer thermal conductor
10/19/1993US5255159 Circuit board spacer
10/19/1993US5255155 Structure of electric circuit panel for instrument panel of automobile and method for forming the same
10/19/1993US5254871 Very large scale integrated circuit package, integrated circuit carrier and resultant interconnection board
10/19/1993US5254811 Hybrid microchip bonding article
10/19/1993US5254493 Method of fabricating integrated resistors in high density substrates
10/19/1993US5254435 Method of patterning resist
10/19/1993US5254362 Applying solder paste through stencil with squeegee which is moved in planar direction and vibrated in circular motion for uniform deposition
10/19/1993US5254361 Method for producing printed circuit boards
10/19/1993US5254191 Method for reducing shrinkage during firing of ceramic bodies
10/19/1993US5254156 Aqueous solution for activation accelerating treatment
10/19/1993US5253559 Device and system for piercing printed circuits
10/14/1993WO1993020674A1 Process for applying a plastic coating and device for implementing it
10/14/1993WO1993020673A1 Circuit board connections
10/14/1993WO1993020562A1 Conductor-filled thermosetting resin
10/14/1993WO1993020560A1 High-density double-sided multi-string memory module
10/14/1993WO1993020519A1 Future bus bus termination network
10/14/1993WO1993020263A1 Method of metallizing non-conducting surfaces, in particular circuit boards
10/14/1993WO1993020123A1 A high performance epoxy based laminating adhesive
10/14/1993WO1993019887A1 Methods of manufacturing perforated foils
10/14/1993WO1993019857A1 Layered chip structure
10/14/1993DE4311266A1 Electroless solder plated circuit board mfg. process - avoids copper@ layer attack by solder plating soln.
10/14/1993DE4243912A1 Light sensitive transfer material - has thermoplastic resin as release coat between temporary film base and intermediate coat, to prevent flaws and soiling on laminating light-sensitive resin coat to permanent substrate
10/14/1993DE4211882A1 Conducting pathway layer structure for PCBs - comprising electrically conducting metallic conducting layers sepd. by metallic diffusion barrier layer
10/14/1993DE4211342A1 Verfahren zum Aufbringen einer Kunststoffschutzschicht sowie Vorrichtung zur Durchführung des Verfahrens A method for applying a protective plastic layer, and device for carrying out the method
10/14/1993DE4211241A1 Desoldering surface mounted device components - melting solder in steam of fluid or by spraying hotter fluid onto solder points
10/14/1993DE4210900A1 Verfahren zur Herstellung eines haftfesten Verbundes zwischen Kupferschichten und Keramik A process for the preparation of a firmly adhesive bonding between the copper layers and ceramic
10/14/1993DE4207166C1 Transportvorrichtung und -verfahren für eine Dampfphasenlötanlage Transport apparatus and method for a vapor phase reflow
10/14/1993CA2133839A1 A high performance epoxy based laminating adhesive
10/14/1993CA2132842A1 Circuit board connections
10/14/1993CA2132747A1 Layered chip structure
10/13/1993EP0565427A1 Device for transferring printed circuit boards for an installation for thermal treatment by convection and installation therefor
10/13/1993EP0565341A2 Method for treating small holes in substrate material
10/13/1993EP0565233A1 Photosensitive laminate having dual intermediate layers
10/13/1993EP0565151A2 Manufacture of multi-layer ceramic interconnect structures
10/13/1993EP0565033A1 Method for fabricating a ceramic multi-layer substrate
10/13/1993EP0564780A1 Methods and apparatus for maintaining electroless plating solutions
10/13/1993EP0564693A1 Film carrier type substrate and method of manufacturing the same
10/13/1993EP0564652A1 Manufacture of multilayer ceramic part, and multilayer ceramic part
10/13/1993EP0329782B1 Digitizing tablet
10/13/1993EP0258451B1 Method of producing conductor circuit boards
10/12/1993US5253145 Compliant cantilever surface mount lead
10/12/1993US5253144 Device housing having an integrated circuit board
10/12/1993US5252858 Glass frit fired with metal oxide filler and binder
10/12/1993US5252855 Lead frame having an anodic oxide film coating
10/12/1993US5252784 Electronic-parts mounting board and electronic-parts mounting board frame
10/12/1993US5252781 Substrate member having electric lines and apertured insulating film
10/12/1993US5252703 Polyimidosiloxane resin and composition thereof and method of applying same
10/12/1993US5252700 Polyamic acid or polyimide endblocked with aromatic dicarboxylic anhydrides
10/12/1993US5252694 Curable epoxy-acrylate mixture, catalyst system, peroxide, and alcohol
10/12/1993US5252519 Multilayered ceramic substrate and method of manufacturing the same
10/12/1993US5252503 Techniques for forming isolation structures
10/12/1993US5252383 Metallized fluororesin with hydrophilic macromolecular film adhered
10/12/1993US5252355 Reducing the copper oxide obtained by oxidized a copper foil with a reducing gas
10/12/1993US5252195 Process for producing a printed wiring board
10/12/1993US5251806 Method of forming dual height solder interconnections
10/12/1993CA2029818C Surface-mount filter
10/12/1993CA2024383C Hermetic package for an electronic device and method of manufacturing same
10/12/1993CA2013378C Technique for object orientation detection using a feed-forward neural network
10/07/1993DE4211355A1 Circuit board component mounting system - has adhesive between circuit component and circuit board section having rupture line allowing easy subsequent removal
10/07/1993DE4211253A1 Electroplating appts. for plate-like parts esp. PCB
10/07/1993DE4205721A1 Conductor shrouding - uses a deposited plastics to give a semi=finished circuit ribbon or circuit board
10/06/1993EP0564335A1 Process for assembling a connector provided with bent contact elements
10/06/1993EP0564117A2 Method and apparatus for replacing electronic components on a printed circuit board
10/06/1993EP0564096A1 Soldering apparatus
10/06/1993EP0564080A2 Aligning a substrate with orifices in an ink jet printhead
10/06/1993EP0564072A2 Efficient conductor routing for inkjet printhead
10/06/1993EP0564019A2 Multilayer thermoplastic electronic package and method of making same
10/06/1993EP0563829A2 Device for inspecting printed cream solder
10/06/1993EP0563668A2 Cooling device for bare integrated components assembled as a flat structure
10/06/1993EP0563257A1 A method of cloning printed wiring boards.
10/06/1993EP0563247A1 Photodefinable interlevel dielectrics
10/06/1993EP0491020B1 Etching solution
10/06/1993EP0364479B1 Gold compression bonding
10/06/1993EP0316452B1 Process for preparing thin film of base metal and application of the same
10/06/1993EP0312607B1 Power circuit board and manufacturing method
10/06/1993EP0242369B1 Surface mountable integrated circuit packages having solder bearing leads
10/06/1993EP0231384B1 A method for preparing a printed wiring board for installation in an ic card
10/06/1993EP0145725B1 Method of and apparatus for real-time high-speed inspection of objects for identifying or recognizing known and unknown portions thereof, including defects and the like
10/06/1993CN1022361C Multi-pulse laser beam generation method and device
10/05/1993US5251108 Laminated electronic device with staggered holes in the conductors
10/05/1993US5250848 For semiconductors, stability, durability
10/05/1993US5250781 Laser bonding apparatus
10/05/1993US5250759 Surface mount component pads
10/05/1993US5250758 Methods and systems of preparing extended length flexible harnesses
10/05/1993US5250757 Printed wiring board having a connecting terminal
10/05/1993US5250591 Comprising an acrylated prepolymer, an unsaturated reactive diluent, polymerization initiator and a spherical and flaky inorganic filler; fixing chip resistors and capacitors to circuit boards for subsequent soldering
10/05/1993US5250470 Method for manufacturing a semiconductor device with corrosion resistant leads
10/05/1993US5250469 IC mounting circuit substrate and process for mounting the IC