| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 11/16/1993 | US5261158 Forming an electrical connector component |
| 11/16/1993 | US5261155 Method for bonding flexible circuit to circuitized substrate to provide electrical connection therebetween using different solders |
| 11/16/1993 | US5261154 Process for fabricating multilayer printed circuits |
| 11/16/1993 | US5261153 In situ method for forming a capacitive PCB |
| 11/16/1993 | CA2028951C Separating sheet provided with a plurality of plating layers, excellent in strippability and having a high hardness |
| 11/16/1993 | CA1324338C Catalytic deposition of metals in solid matrices |
| 11/11/1993 | WO1993022795A1 Interconnection system for high performance electronic hybrids |
| 11/11/1993 | WO1993022774A1 Electromagnetic shielding materials |
| 11/11/1993 | WO1993022475A1 Solder bumping of integrated circuit die |
| 11/11/1993 | WO1993022352A1 Concentration of fluoropolymer dispersions using acrylic polymers of high acid content |
| 11/11/1993 | WO1993022139A1 Process for producing plastic laminates with metal laminae, especially for printed circuits |
| 11/10/1993 | EP0569166A1 Gold-tin solder suitable for self-aligning applications |
| 11/10/1993 | EP0568963A2 Chassis for television receiver |
| 11/10/1993 | EP0568930A2 Method of manufacturing organic substrate used for printed circuits |
| 11/10/1993 | EP0568853A1 Photoenhanced diffusion patterning for organic polymer films |
| 11/10/1993 | EP0568841A1 Process of photoimaging using ink jet printing |
| 11/10/1993 | EP0568827A2 Photoimageable compositions |
| 11/10/1993 | EP0568733A2 Low profile copper foil and process and apparatus for making bondable metal foils |
| 11/10/1993 | EP0568728A2 Process and apparatus for electroplating perforated articles |
| 11/10/1993 | EP0568715A1 Circuit board |
| 11/10/1993 | EP0424522A4 Interconnect device and method of manufacture thereof |
| 11/10/1993 | CN1078186A Multi pulse laser beam generation method and device and laser beam machining method and apparatus using multi pulse laser beam |
| 11/10/1993 | CN1022719C Electrical connector assembly including pressure exerting member |
| 11/09/1993 | US5260779 Method and apparatus for inspecting a printed circuit board |
| 11/09/1993 | US5260601 Edge-mounted, surface-mount package for semiconductor integrated circuit devices |
| 11/09/1993 | US5260519 Multilayer ceramic substrate with graded vias |
| 11/09/1993 | US5260518 Multilayer circuit board for mounting ICs and method of manufacturing the same |
| 11/09/1993 | US5260407 Stretching, pyromellitic acid and 4,4'-bis(3-aminophenoxy) biphenyl |
| 11/09/1993 | US5260170 Applying photodefinable resin containing electroless plating catalyst to substrate, developing image in resin, exposing part of substrate, applying second resin, developing second coincident image therein, selectively depositing conductor |
| 11/09/1993 | US5260168 Application specific tape automated bonding |
| 11/09/1993 | US5260163 Photoenhanced diffusion patterning for organic polymer films |
| 11/09/1993 | US5260130 Adhesive layer containing epoxy resin, nitrile rubber containing carboxy groups, curing agent and curing accelerator |
| 11/09/1993 | US5260108 Selective seeding of Pd by excimer laser radiation through the liquid |
| 11/09/1993 | US5260098 Method and apparatus for tinning tinnable areas on an electronic component package |
| 11/09/1993 | US5259926 Method of manufacturing a thin-film pattern on a substrate |
| 11/09/1993 | US5259920 Involving an indicator layer of metal formed on surface of monitor substrate |
| 11/09/1993 | US5259767 Connector for a plated or soldered hole |
| 11/09/1993 | US5259546 Procedure and arrangement for reflow-soldering electronic components onto a printed board |
| 11/09/1993 | US5259436 Fabrication of metal matrix composites by vacuum die casting |
| 11/09/1993 | US5259111 Method of producing terminal for base board |
| 11/09/1993 | US5259110 Method for forming a multilayer microelectronic wiring module |
| 11/09/1993 | CA2016851C Method of manufacturing thick-film devices |
| 11/04/1993 | DE4313980A1 Integrated hybrid circuit avoiding electrical disturbances - comprises conductor frame electrically connected to electronic components by silver paste with electroless plated coating on frame |
| 11/03/1993 | EP0568496A2 Photoresist materials based on polystyrene |
| 11/03/1993 | EP0568392A2 Assembly structure and assembling method of flat type display device and apparatus and method for supplying and curing resin therefor |
| 11/03/1993 | EP0568364A2 Plated printed circuit |
| 11/03/1993 | EP0568313A2 A method of manufacturing a multilayer printed wiring board |
| 11/03/1993 | EP0568311A2 A method of manufacturing a multilayer printed wiring board |
| 11/03/1993 | EP0568224A2 Method of metallizing halogenated polyimide substrates |
| 11/03/1993 | EP0568223A2 Metallized halogenated polyimide substrates |
| 11/03/1993 | EP0568222A2 Method of producing modified polyimide layer having improved adhesion to metal |
| 11/03/1993 | EP0568087A2 Reflow mounting of electronic component on mounting board |
| 11/03/1993 | EP0567814A1 Printed circuit board for mounting semiconductors and other electronic components |
| 11/03/1993 | CN1078088A Method of fabricating an internal composite layer composed of an electrically insulating substrate with a copper layer formed thereon and a film of a coupling agent covering the copper layer for...... |
| 11/02/1993 | US5258887 Electrical device cooling system using a heat sink attached to a circuit board containing heat conductive layers and channels |
| 11/02/1993 | US5258866 Method of connecting liquid crystal display and circuit board with thermal expansion compensation |
| 11/02/1993 | US5258808 Exposure apparatus for forming image |
| 11/02/1993 | US5258698 Method and device for controlling the working depth for a numerically controlled machine tool |
| 11/02/1993 | US5258649 Semiconductor device and electronic apparatus using semiconductor device |
| 11/02/1993 | US5258648 Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery |
| 11/02/1993 | US5258577 Method of forming an electronic device |
| 11/02/1993 | US5258522 Imidazole-silane compounds and metal surface finishing agent containing the same |
| 11/02/1993 | US5258236 Multi-layer thin film structure and parallel processing method for fabricating same |
| 11/02/1993 | US5258218 Laser scored |
| 11/02/1993 | US5258200 Copper complexes and reducing agents for depositing copper with germanium and silicates |
| 11/02/1993 | US5258098 Aircraft |
| 11/02/1993 | US5258094 Method for producing multilayer printed wiring boards |
| 11/02/1993 | US5257718 Method of bending and soldering corners of a folding printed-circuit board |
| 11/02/1993 | US5257531 Apparatus for monitoring machining state of drill |
| 11/02/1993 | US5257452 Methods of recovering a multi-layer printed circuit board |
| 11/02/1993 | CA1323750C Method of manufacturing ceramic laminate |
| 10/31/1993 | CA2094752A1 Plated printed circuit |
| 10/28/1993 | WO1993021750A1 Multilayer interconnect system for an area array interconnection using solid state diffusion |
| 10/28/1993 | DE4312409A1 Electronic component or adjustable capacitor mfg. system - has concave section formed by burning off spaced films in thickness of ceramic laminate to form spaced thin layers which are then collapsed |
| 10/28/1993 | DE4213578A1 Mounting for fixing electrical or electronic component on carrier - has radially projecting legs that engage in slots in carrier and are locked by applying torsion load |
| 10/27/1993 | EP0567306A2 A multilayer printed circuit board and method for its manufacture |
| 10/27/1993 | EP0567209A2 Liquid crystal panel module and tape carrier package for liquid crystal driver IC |
| 10/27/1993 | EP0567196A1 Method of manufacturing an electrical connector and a body surrounding the connector pins |
| 10/27/1993 | EP0567016A2 Multi layered wiring board and method for manufacturing the same |
| 10/27/1993 | EP0566758A1 Detector unit for controlling a passenger protection system of a vehicle |
| 10/27/1993 | EP0566712A1 Method and system for removing contaminants. |
| 10/27/1993 | EP0426665B1 Method for manufacturing printed circuit boards |
| 10/27/1993 | EP0380545B1 Improved circuit board material and electroplating bath for the production thereof |
| 10/26/1993 | US5257166 Configurable electronic circuit board adapter therefor, and designing method of electronic circuit using the same board |
| 10/26/1993 | US5257165 Pin grid array adaptor mounting hardware |
| 10/26/1993 | US5257067 Apparatus for placing film mask in contact with object |
| 10/26/1993 | US5256900 Package for semiconductor device with at least one through hole |
| 10/26/1993 | US5256506 Support, coating comprising release agent, contrast agent, laser absorber, sensitizer |
| 10/26/1993 | US5256474 Method of and apparatus for manufacturing printed circuit boards |
| 10/26/1993 | US5256443 Method of producing metallic thin film sensors |
| 10/26/1993 | US5256442 Forming emulsion pattern, applying photosensitive ink |
| 10/26/1993 | US5256441 Controlling concentration of iron or chromium sources |
| 10/26/1993 | US5256235 Method for forming long thin flexible laminates |
| 10/26/1993 | US5256209 Using mixture of glycol ether, nonionic surfactant, anionic phosphate surfactant |
| 10/26/1993 | US5255840 Fluxless solder coating and joining |
| 10/26/1993 | US5255839 Method for solder application and reflow |
| 10/26/1993 | US5255431 Method of using frozen epoxy for placing pin-mounted components in a circuit module |
| 10/26/1993 | CA1323707C Ink-on-glass digitizer tablet and method of construction |
| 10/26/1993 | CA1323595C Dielectric block plating process and a plating apparatus for carrying out the same |
| 10/26/1993 | CA1323529C Multilayer ceramic coatings from metal oxides and hydrogen silsesquioxane resin ceramified in ammonia |