Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
12/1993
12/23/1993DE4229001C1 Selectively metallising monolithic ceramic microwave filter - by electroplating, using ceramic foil as mask
12/23/1993DE4220097A1 Photolithographic mask mfr. for multilayer printed circuit - involves deep-drawing of combined plastic film for laser irradiation of carbon black areas confined to thinner constituent
12/23/1993CA2114954A1 Process for producing printed circuit boards using a semi-finished product with extremely dense wiring for signal conduction
12/22/1993EP0575292A1 Process for manufacturing substrates with through-holes
12/22/1993EP0575092A1 Electrical connector having contacts with board retention feature
12/22/1993EP0574956A1 Metallized circuit substrate comprising nitride type ceramics
12/22/1993EP0574934A1 Method for forming a patterned polyimide coating film on a substrate
12/22/1993EP0574858A1 Inorganic oxidant compositions for removing contaminants
12/22/1993EP0574767A1 Improvement in or relating to the terminal element of a surface-applied type electric connector
12/22/1993EP0574715A1 Method of forming a conductive end portion on a flexible circuit member
12/22/1993EP0574459A1 Registration system
12/22/1993EP0455658B1 Method and device for fastening an electronic circuit substrate onto a support
12/22/1993CN1079827A Photoenhanced diffusion patterning for organic polymer films
12/21/1993USRE34484 Gold-plated electronic components
12/21/1993US5272762 Method of and apparatus for inspecting wiring pattern on printed board
12/21/1993US5272761 Method and apparatus for inspecting line width on printed board
12/21/1993US5272597 Attachment for surface-mounting a resonator crystal on a circuit board
12/21/1993US5272596 Personal data card fabricated from a polymer thick-film circuit
12/21/1993US5272310 Soldering method
12/21/1993US5272307 Method and apparatus for laser soldering of microelectronic lead-pad assemblies on ceramic substrates
12/21/1993US5272292 Irreversible arrangement for interrupting the functioning of an apparatus controlled by an electronic system
12/21/1993US5272245 Chemically etchable adhesives
12/21/1993US5272186 Concentration of fluoropolymer dispersions using acrylic polymers of high acid content
12/21/1993US5272007 Solder powder coated with parylene
12/21/1993US5271993 Method of manufacturing insulation substrate for semiconductor device and metal pattern plate used therefor
12/21/1993US5271953 System for performing work on workpieces
12/21/1993US5271887 Method of fabricating complex micro-circuit boards, substrates and microcircuits and the substrates and microcircuits
12/21/1993US5271861 Fluorochlorohydrocarbon-free cleaning compositions
12/21/1993US5271822 Methods and apparatus for electroplating electrical contacts
12/21/1993US5271549 Multiple-lead element soldering method using sheet solder
12/21/1993US5271548 Method for applying solder to and mounting components on printed circuit boards
12/21/1993US5271325 Screen wiper assembly for a printing screen
12/21/1993US5271150 Method for fabricating a ceramic multi-layer substrate
12/21/1993US5271147 Outer bonding tool for tape carrier and method of producing semiconductor device
12/21/1993CA2004796C Inhibited composition and method for stripping tin, lead or tin-lead alloy from copper surfaces
12/20/1993CA2096452A1 Inorganic oxidant compositions for removing contaminants
12/16/1993WO1993026144A1 Process for producing subsequently conditionable contact points on circuit substrates and circuit substrates with such contact points
12/16/1993DE4238319C1 Pin connector between SMD and PCB - has metallised surfaces between contacts soldered to PCB conductor paths
12/16/1993DE4219554A1 Thermosicherung und Verfahren zu ihrer Aktivierung Thermal fuse and method for its activation
12/16/1993CA2114792A1 Process for producing subsequently conditionable contact points on circuit substrates and circuit substrates with such contact points
12/16/1993CA2098411A1 Method for producing substrates with passages
12/15/1993EP0574286A1 Method for assembling hybrid circuits by vacuum bonding and assemblies produced by this method
12/15/1993EP0574218A1 Soldering method and soldering apparatus
12/15/1993EP0574207A2 Multilayer printed circuit board and method for manufacturing the same
12/15/1993EP0574206A2 Multilayer printed circuit board and method for manufacturing the same
12/15/1993EP0574178A2 Dry process coating method and apparatus therefor
12/15/1993EP0574161A1 A method of bonding a metal by solder
12/15/1993EP0573609A1 Photosensitive compositions containing comb polymer binders
12/15/1993EP0573534A1 Powder coating method for producing circuit board laminae and the like
12/15/1993EP0573511A1 Process and arrangement for electroplating of perforated workpieces
12/14/1993US5270964 Single in-line memory module
12/14/1993US5270903 Printed circuit board manufacturing method accommodates wave soldering and press fitting of components
12/14/1993US5270848 Liquid crystal ITO connector having a metal layer
12/14/1993US5270847 Liquid crystal display panel assembly with resilient display panel support
12/14/1993US5270673 Surface mount microcircuit hybrid
12/14/1993US5270639 Time of use register for use with a utility meter
12/14/1993US5270493 Printed circuit board having electromagnetic wave shield layer and self-contained printed resistor
12/14/1993US5270492 Structure of lead terminal of electronic device
12/14/1993US5270425 Storage stabililty
12/14/1993US5270368 Acrylate resin
12/14/1993US5270146 Photosensitive laminate having dual intermediate layers
12/14/1993US5270117 Preflux coating composition for copper
12/14/1993US5270078 Method for preparing high resolution wash-off images
12/14/1993US5269873 Apparatus for peeling-off a film laminated on a carrier material
12/14/1993US5269850 Nontoxic products
12/14/1993US5269453 Low temperature method for forming solder bump interconnections to a plated circuit trace
12/09/1993WO1993025061A1 Improved stencil or mask for applying solder to circuit boards and support frame therefor
12/09/1993WO1993025060A1 Solder-precoated wiring board and method for manufacturing the same
12/09/1993WO1993024939A1 Laminated conductive material, multiple conductor cables and methods of manufacturing such cables
12/09/1993DE4219045A1 Verfahren und Vorrichtung zur Kühlung von Mikrobohrern Method and apparatus for cooling of micro drills
12/09/1993DE4218793A1 Plug-in contact part with chip and magnet for motor vehicle - has contacts extended into surfaces for attachment and fixing of integrated circuit chip and other components
12/09/1993DE4218367A1 Electronic device with large number of leads - has ends of leads fixed to strip of electrically insulating material, e.g. epoxy resin or polyamide
12/08/1993EP0573146A1 Fine pitch solder application
12/08/1993EP0573053A1 Photo-curable and thermosetting coating composition and method for formation of solder resist pattern
12/08/1993EP0573031A2 Method for forming patterned solder mask
12/08/1993EP0572925A1 Recording medium cassette and a recording/reproducing apparatus
12/08/1993EP0572815A2 Circuit card interconnecting structure
12/08/1993EP0572540A1 Arrangement for driving a rotary tool.
12/08/1993EP0572445A1 Piston-based ventilator design and operation.
12/08/1993EP0463098B1 A fluxless soldering process
12/08/1993CN1079235A Concentration of fluoropolymer dispersions using acrylic polymers of high acid content
12/07/1993US5268820 Mother board assembly
12/07/1993US5268819 Circuit board assembly
12/07/1993US5268815 High density, high performance memory circuit package
12/07/1993US5268813 Flexible printed circuit package and flexible printed circuit for incorporating in such a package
12/07/1993US5268536 Method of connecting a lead of a mounting part with a land of a circuit substrate
12/07/1993US5268535 Printed wiring board
12/07/1993US5268260 Photoresist develop and strip solvent compositions and method for their use
12/07/1993US5268255 Photo-setting resist composition, a process for producing a printed circuit board by using the composition, and a printed circuit board obtained by using the composition
12/07/1993US5268194 Method of packing filler into through-holes in a printed circuit board
12/07/1993US5268121 Compositions based on 1,1,1,3,3-pentafluorobutane and methanol for the cleaning and/or drying of solid surfaces
12/07/1993US5268120 Azeotropic mixture
12/07/1993US5268088 Simplified method for direct electroplating of acrylic or epoxy containing dielectric substrates
12/07/1993US5268068 High aspect ratio molybdenum composite mask method
12/07/1993US5268064 Copper clad epoxy printed circuit board suitable for microwave frequencies encountered in GPS receivers
12/07/1993US5267825 Carrier device
12/07/1993US5267818 Arrangement for providing planar movement of a machine tool
12/07/1993US5267379 Method of fabricating surface mountable clock oscillator module
12/02/1993DE4317719A1 Prodn. of laminated electronic constructional element - by sintering ceramic layers and inner electrodes in mixed gas contg. carbon di:oxide and mon:oxide
12/02/1993DE4217752A1 Paste dispenser for thick-film circuit-printing machine - has elastic blade deformed by pressure of set-screw at centre to conform to sag of underlying screen