| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/13/1994 | EP0591174A1 Reworkable adhesive for electronic applications. |
| 04/13/1994 | EP0591126A1 Process for making noble metal coated metallic particles, and resulting conductive materials |
| 04/13/1994 | CN1085343A Via fill compositions |
| 04/13/1994 | CN1085156A A method of manufacturing a composite laminate comprising unidirectional reinforcing fibres, for use in printed wire boards |
| 04/13/1994 | CN1024237C Dielectric filter and mounting seat assembly |
| 04/12/1994 | US5303123 Retainer for removable circuit board components |
| 04/12/1994 | US5303121 Multi-chip module board |
| 04/12/1994 | US5303119 Interconnection system for integrated circuits |
| 04/12/1994 | US5302891 For testing a semiconductor device in die form |
| 04/12/1994 | US5302854 Packaging structure of a semiconductor device |
| 04/12/1994 | US5302801 Laser bonding apparatus |
| 04/12/1994 | US5302798 Method of forming a hole with a laser and an apparatus for forming a hole with a laser |
| 04/12/1994 | US5302725 Aryl triflate compounds and radiologically acid producing agents thereof |
| 04/12/1994 | US5302627 For polysiloxanes |
| 04/12/1994 | US5302562 Method of controlling the densification behavior of a metallic feature in a ceramic material |
| 04/12/1994 | US5302547 Systems for patterning dielectrics by laser ablation |
| 04/12/1994 | US5302494 Electroless plating |
| 04/12/1994 | US5302492 Laminated metal foil, deactivation, electroless chemical metal deposition |
| 04/12/1994 | US5302489 Positive photoresist compositions containing base polymer which is substantially insoluble at pH between 7 and 10, quinonediazide acid generator and silanol solubility enhancer |
| 04/12/1994 | US5302467 Halogenated polyimide composition having improved adhesion characteristic and articles obtained therefrom |
| 04/12/1994 | US5302456 Anisotropic conductive material and method for connecting integrated circuit element by using the anisotropic conductive material |
| 04/12/1994 | US5302256 Immersion tin/lead alloy plating bath |
| 04/12/1994 | US5302219 Method for obtaining via patterns in ceramic sheets |
| 04/12/1994 | US5302166 Tool changer |
| 04/12/1994 | US5302134 Article locating and centering means |
| 04/12/1994 | US5301420 Method for manufacturing a light weight circuit module |
| 04/10/1994 | CA2108048A1 Radiation polymerisable mixture and method for manufacture of a solder mask |
| 04/07/1994 | DE4233403A1 Prodn. of multilayer hybrids - comprising green ceramic foils having conducting pathways and through-contacts with electrical connections between them |
| 04/07/1994 | DE4233073A1 Semiconductor modular structure prodn. - by convexly shaping and bonding in single hot pressing operation |
| 04/07/1994 | DE4232651A1 Tinning process and appts. for metallised conductor track as preparation for fluxless terminal soldering - whereby tin in pastry condition is applied to the conductor surface by rubbing with oscillating motion |
| 04/06/1994 | EP0590975A1 Low viscosity and solvent-free one-component type epoxy resin adhesive composition |
| 04/06/1994 | EP0590644A1 Method for overmoulding of a leadframe |
| 04/06/1994 | EP0590643A2 Large-current circuit board and method therefor |
| 04/06/1994 | EP0590635A1 A method for producing a multi-layered printed wiring board |
| 04/06/1994 | EP0590628A1 Process for soldering components on printed circuit board and printed circuit board |
| 04/06/1994 | EP0590512A1 Method of soldering a heat sensitive component, e.g a display, to a printed circuit board |
| 04/06/1994 | EP0590354A1 Device with a board, a heat sink and at least one power component |
| 04/06/1994 | EP0590324A1 Power and signal distribution in electronic packaging |
| 04/06/1994 | EP0590092A1 Nitrosation of homocysteine as a method for treating homocysteinemia |
| 04/06/1994 | EP0590046A1 Mildly basic accelerating solutions for direct electroplating |
| 04/06/1994 | EP0253892B1 Transfer material for printed circuit board and printed circuit board prepared using said transfer material and process for preparation thereof |
| 04/06/1994 | CN1085012A Method and apparatus for removing an electronic component from a board |
| 04/06/1994 | CN1084874A Oil based composition clean up method and composition for use therein |
| 04/05/1994 | US5300959 Efficient conductor routing for inkjet printhead |
| 04/05/1994 | US5300917 Junction box having integrally formed shunt |
| 04/05/1994 | US5300810 Electronic circuit and method with thermal management |
| 04/05/1994 | US5300755 Structure for welding electrical connecting portions to each other using laser light beam |
| 04/05/1994 | US5300735 Interconnected multilayer boards and fabrication processes thereof |
| 04/05/1994 | US5300620 Heat-resistant adhesive and method of adhesion by using adhesive |
| 04/05/1994 | US5300402 Cationically polymerizable epoxy based coating, solvent, thixotropic agent |
| 04/05/1994 | US5300401 Photopolymerizable resin material and process for preparing print circuit using the material |
| 04/05/1994 | US5300364 Metal-clad laminates and method for producing same |
| 04/05/1994 | US5300340 Equiax particles individually positioned in adhesive layer in pattern; with pressure particles penetrate elements forming connection |
| 04/05/1994 | US5300208 Fabrication of printed circuit boards using conducting polymer |
| 04/05/1994 | US5300163 Process for fabricating a multilayer ceramic circuit board |
| 04/05/1994 | US5300158 Protective coating having adhesion improving characteristics |
| 04/05/1994 | US5300154 Mixture of non-polar aromatic hydrocarbons and organic polar component |
| 04/05/1994 | US5300140 Hydroprimer for metallising substrate surfaces |
| 04/05/1994 | US5299730 Method and apparatus for isolation of flux materials in flip-chip manufacturing |
| 04/05/1994 | CA1328323C Method of producing polymer article having metallized surface |
| 03/31/1994 | WO1994007349A1 Magnetic vias within multi-layer, 3-dimensional structures/substrates |
| 03/31/1994 | WO1994007347A1 Field control and stability enhancement in multilayer, 3-dimensional structures |
| 03/31/1994 | WO1994006873A1 Ink composition and method of making, using and recovering such composition |
| 03/31/1994 | WO1994006718A1 Method of cleaning waste water and recovery of contaminants therefrom |
| 03/31/1994 | WO1994006585A1 Method for making a ceramic metal composite |
| 03/31/1994 | WO1994006573A1 Oil based composition clean up method and composition for use therein |
| 03/31/1994 | DE4232844A1 Exposure method for optical projection lithography used in integrated circuit mfr. - applying imaged structure to non-planar surface of exposure mask to increase image sharpness |
| 03/31/1994 | DE4232622C1 Kontaktiervorrichtung zum Anschluß einer mehrere Kontaktleiterbahnen aufweisenden Leiterfolie Contactor for connecting a plurality of contact strip conductors having conductive foil |
| 03/31/1994 | DE4231180A1 Producing adjustment structure for PCB - providing structured window in solder stop mark overlying metal zone applied to circuit board surface |
| 03/31/1994 | CA2145161A1 Method for making a ceramic metal composite |
| 03/31/1994 | CA2144778A1 Method of cleaning waste water and recovery of contaminants therefrom |
| 03/31/1994 | CA2144777A1 Oil based composition clean up method and composition for use therein |
| 03/31/1994 | CA2144776A1 Ink composition and method of making, using and recovering such composition |
| 03/30/1994 | EP0589813A1 Multilayer ceramic substrate with graded vias |
| 03/30/1994 | EP0589802A1 Dispenser |
| 03/30/1994 | EP0589602A2 Potted electrical components and methods of making the same |
| 03/30/1994 | EP0589241A2 Photosensitive dielectric sheet composition and multilayer interconnect circuits |
| 03/30/1994 | EP0589109A1 Crosslinking curable resin composition |
| 03/30/1994 | EP0588978A1 A composition and a process for removing rosin solder flux with terpene and hydrocarbons |
| 03/30/1994 | EP0588834A1 Electrical connectors. |
| 03/30/1994 | EP0454873B1 Drying method and apparatus therefor |
| 03/30/1994 | CN1084676A Connector for electrical components |
| 03/30/1994 | CA2079377A1 Crosslinking curable resin composition |
| 03/29/1994 | US5299096 LED mounting holder and device for mounting LED using it |
| 03/29/1994 | US5299094 IC card including multiple substrates bearing electronic components |
| 03/29/1994 | US5299091 Packaged semiconductor device having heat dissipation/electrical connection bumps and method of manufacturing same |
| 03/29/1994 | US5298719 Laser beam heating method and apparatus |
| 03/29/1994 | US5298715 Lasersonic soldering of fine insulated wires to heat-sensitive substrates |
| 03/29/1994 | US5298687 High-density multilayer interconnection system on a ceramic substrate for high current applications and method of manufacture |
| 03/29/1994 | US5298686 System and method for implementing wiring changes in a solderless printed wiring board module |
| 03/29/1994 | US5298685 Interconnection method and structure for organic circuit boards |
| 03/29/1994 | US5298684 Circuit board having a lateral conductive pattern and shielded regions as well as a method of manufacturing such a board |
| 03/29/1994 | US5298460 Substrate for packaging a semiconductor device |
| 03/29/1994 | US5298331 Metal clad laminates for printed circuits and tape automated bonding |
| 03/29/1994 | US5298288 Coating a heat curable liquid dielectric on a substrate |
| 03/29/1994 | US5298279 Method for connecting terminals of heat seal film substrate |
| 03/29/1994 | US5298194 An adhesive consists of blend of fusible particulate thermoplastic resin and metal particles |
| 03/29/1994 | US5298117 Metallic electrical interconnectors of multilayer elements using hydrogen fluoride, cupric chloride and chloride salt as etchant |
| 03/29/1994 | US5298114 Thin film circuit substrate and process for the manufacture thereof |
| 03/29/1994 | US5298110 Trench planarization techniques |