| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 06/08/1994 | EP0600538A1 Compositions containing a fluorinated ether and use thereof |
| 06/08/1994 | EP0600488A2 Lead frame capacitor and capacitively-coupled isolator circuit using same |
| 06/08/1994 | EP0600262A2 Aqueous processable, multilayer photoimageable permanent coatings for printed circuits |
| 06/08/1994 | EP0600153A1 Contact sleeve |
| 06/08/1994 | EP0600052A1 Process for producing subsequently conditionable contact points on circuit substrates and circuit substrates with such contact points. |
| 06/08/1994 | EP0600051A1 Process for producing printed circuit boards using a semi-finished product with extremely dense wiring for signal conduction |
| 06/08/1994 | EP0599989A1 Infra-red direct write imaging media. |
| 06/08/1994 | EP0599984A1 Azeotrope-like compositions of 2-trifluoromethyl-1,1,1,2-tetrafluorobutane and methanol, ethanol or isopropanol |
| 06/08/1994 | EP0599843A1 Reciprocally shuttled double sided screener with tiltable print squeegee. |
| 06/08/1994 | EP0526455B1 Process for applying a protective plastic film, and a device for carrying out the process |
| 06/08/1994 | CN1024981C Adhesion method of copper to resin |
| 06/08/1994 | CN1024980C Non-photographic method for patterning organic polymer films |
| 06/08/1994 | CN1024911C Polymer film with metal-plating and its manufacturing method |
| 06/07/1994 | US5319525 Circuit assembly |
| 06/07/1994 | US5319523 Card edge interconnect apparatus for printed circuit boards |
| 06/07/1994 | US5319522 Encapsulated product and method of manufacture |
| 06/07/1994 | US5319244 Triazine thin film adhesives |
| 06/07/1994 | US5319183 Method and apparatus for cutting patterns of printed wiring boards and method and apparatus for cleaning printed wiring boards |
| 06/07/1994 | US5319159 Double-sided printed wiring board and method of manufacture thereof |
| 06/07/1994 | US5318803 Conditioning of a substrate for electroless plating thereon |
| 06/07/1994 | US5318744 Process for producing ceramic sintered body having metallized via hole |
| 06/07/1994 | US5318716 Cleaning solvents, refrigerants and foam blowing agents; air pollution control |
| 06/07/1994 | US5318662 Masking copper layer, introducing halogen radical, activating with non-pulsed light, converting copper to halide product, washing to remove |
| 06/07/1994 | US5318651 Applying light-sensitive adhesive, selectively exposing, removing portions, heat treating to impact bond, thermo compressing to form single circuit board |
| 06/07/1994 | US5317801 Method of manufacture of multilayer circuit board |
| 06/07/1994 | CA1330020C Process for treating the surface of polyimides to improve properties to receive metal layer |
| 06/01/1994 | EP0599689A2 Propellant-containing thermal transfer donor elements |
| 06/01/1994 | EP0599595A2 Ceramic electronic device and method of producing the same |
| 06/01/1994 | EP0599532A2 One-part curable organosiloxane compositions |
| 06/01/1994 | EP0599476A1 A connection device for a printed wiring board |
| 06/01/1994 | EP0599416A1 Electroplating plant with opposed electrolitic cells and continuous feed of the surfaces to be treated |
| 06/01/1994 | EP0599308A1 Surface treatment method of electrodeposition type photosensitive resin layer |
| 06/01/1994 | EP0599194A1 Flat-card-shaped electronic module |
| 06/01/1994 | EP0599122A1 Process for producing plated through-hole printed circuit boards having very small solder lands or no solder lands |
| 06/01/1994 | EP0599121A1 Process for producing plated through-hole printed circuit boards having very small solder lands or no solder lands |
| 06/01/1994 | EP0599075A1 Photosensitive resin composition or photosensitive heat curing resin composition and photosolder resist composition using the same |
| 06/01/1994 | EP0599017A1 Lamp holder for an electric assembly |
| 06/01/1994 | EP0598914A1 Three-dimensional printed circuit board, electronic circuit package using this board, and method for manufacturing this board |
| 06/01/1994 | EP0404891B1 Process for the manufacture of electrically conductive structures |
| 06/01/1994 | EP0298104B1 Dual row connector for low profile package |
| 06/01/1994 | EP0270672B1 Flexible copper-clad circuit board |
| 06/01/1994 | DE4240997C1 Production of mounted circuit boards for fine raster pattern of SMD devices - having boards subjected to series of masking exposure and soldering operations |
| 06/01/1994 | DE4240141A1 Photoresist compsn. for making resist and registration mark for e.g. PCB's - contg leuco dyestuff, hexa:aryl:bis:imidazole initiator sensitised to visible and/or IR light and UV-sensitive photopolymerisation initiator |
| 06/01/1994 | DE4239995A1 Gerät und Verfahren zum Bedrucken eines Schaltungsträgers Apparatus and method for printing on a circuit carrier |
| 06/01/1994 | DE4239879A1 Separating appts for prescribed circuit boards - has pairs of cutting wheels arranged one above other on parallel shafts, held exchangeably with shaft by side bearings |
| 06/01/1994 | DE4239761A1 Electronic hybrid circuit with treated substrate layer - has contacting bases in region of cover hermetically sealed with conductive or dielectric paste |
| 06/01/1994 | CN1087366A Low viscosity and solvent-free one-component type epoxy resin adhesive composition |
| 05/31/1994 | US5317479 Plated compliant lead |
| 05/31/1994 | US5317438 Liquid crystal display device and method of producing the same having an improved connection between a flexible film substrate and a drive circuit substrate |
| 05/31/1994 | US5317342 High-density print head |
| 05/31/1994 | US5317255 Electric inspection unit using anisotropically electroconductive sheet |
| 05/31/1994 | US5317081 Microwave processing |
| 05/31/1994 | US5316894 Method of making printed wiring boards |
| 05/31/1994 | US5316867 Method for adhering metal coatings to thermoplastic addition polymers |
| 05/31/1994 | US5316803 Method for forming electrical interconnections in laminated vias |
| 05/31/1994 | US5316788 Applying solder to high density substrates |
| 05/31/1994 | US5316787 Forming integrated circuits by lamination and forming apertures, hydrolysis and baking |
| 05/31/1994 | US5316786 Mechanically pre-stressing circuit board to provide desired, controlled curvature of board, coating and firing |
| 05/31/1994 | US5316698 Copper paste for internal conductor of multilayer ceramic electronic component |
| 05/31/1994 | US5316610 Bonding apparatus |
| 05/31/1994 | US5316602 Method for manufacturing ceramic green sheet laminate for an electronic component |
| 05/31/1994 | US5316591 Cleaning with liquid carbon dioxide, nitrous oxide, sulfur hexafluoride or xenon plastic substrates |
| 05/31/1994 | US5316579 Using rotating turbibe blades |
| 05/31/1994 | US5316219 Coating apparatus with pattern width control |
| 05/31/1994 | US5316205 Method for forming gold bump connection using tin-bismuth solder |
| 05/31/1994 | US5315793 System for precision cleaning by jet spray |
| 05/31/1994 | CA2051174C Polyimide adhesion on reactive metals |
| 05/31/1994 | CA1329952C Multi-layer superconducting circuit substrate and process for manufacturing same |
| 05/31/1994 | CA1329930C Universal platen holddown apparatus |
| 05/26/1994 | WO1994012008A1 Process for production of printed circuit boards and use thereby |
| 05/26/1994 | WO1994011924A1 Coaxial high-frequency plug-type connector for multiple coaxial lines |
| 05/26/1994 | WO1994011743A1 Printed circuit board testing device with foil adapter |
| 05/26/1994 | WO1994011148A1 No-clean soldering flux and method using the same |
| 05/26/1994 | DE4238930A1 Positional change or movement detector for detonating mine or triggering alarm - has closed chamber into which project edge-contacts of double-sided PCB, and detects breaking and re-making of contacts caused by conductive sphere rolling within chamber |
| 05/26/1994 | DE4236580A1 Solvents for cleaning electronic components e.g. PCB - comprise n-butanol, propylene glycol 1-methyl ether and opt. water |
| 05/26/1994 | CA2109678A1 Surface treatment method of electrodeposition type photosensitive resin layer |
| 05/25/1994 | EP0598522A1 Memory module |
| 05/25/1994 | EP0598273A1 Method for treatment of circuit boards by dipping in chemical mediums |
| 05/25/1994 | EP0598182A1 Method and apparatus for rapid dispensing of minute quantities of viscous materials |
| 05/25/1994 | EP0598143A1 A cleaning, wetting agent and solvent |
| 05/25/1994 | EP0598006A1 Solder plate reflow method for forming a solder bump on a circuit trace. |
| 05/25/1994 | EP0577779A4 Multichip integrated circuit module and method of fabrication |
| 05/25/1994 | EP0577754A4 Three-dimensional multichip module systems and methods of fabrication |
| 05/25/1994 | EP0364551B1 Thermal expansion mismatch forgivable printed wiring board for ceramic leadless chip carrier |
| 05/25/1994 | CN2166579Y Automatic integral tin soldering apparatus for PC plate |
| 05/24/1994 | USRE34615 Video probe aligning of object to be acted upon |
| 05/24/1994 | US5315535 Automatic router capable of searching for a new wiring with reference to connection failures |
| 05/24/1994 | US5315484 Printed circuit board and method for attaching movable switch thereto |
| 05/24/1994 | US5315482 Semiconductor apparatus of module installing type |
| 05/24/1994 | US5315480 Conformal heat sink for electronic module |
| 05/24/1994 | US5315072 Printed wiring board having blind holes |
| 05/24/1994 | US5315070 Printed wiring board to which solder has been applied |
| 05/24/1994 | US5314842 Resin-sealed type semiconductor device and method for manufacturing the same |
| 05/24/1994 | US5314789 Method of forming a relief image comprising amphoteric compositions |
| 05/24/1994 | US5314788 Matrix printed board and process of forming the same |
| 05/24/1994 | US5314764 Flexible welding board for battery pack |
| 05/24/1994 | US5314725 Photo-plating process |
| 05/24/1994 | US5314711 Method and apparatus for printing green-tape foil circuits |
| 05/24/1994 | US5314709 Unzippable polymer mask for screening operations |
| 05/24/1994 | US5314346 Flexible circuit applique patch customization for generic programmable cable assemblies |