| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/17/1994 | WO1994003921A2 Planarizing bumps for interconnecting matching arrays of electrodes |
| 02/17/1994 | WO1994003913A1 Thermal cut-out and process for activating it |
| 02/17/1994 | WO1994003655A1 Process for the electrolytic processing especially of flat items and arrangement for implementing the process |
| 02/17/1994 | WO1994003352A1 Add-on control device |
| 02/17/1994 | DE4226590A1 Verfahren zur Verringerung des Flächenbedarfs eines Stromversorgungsnetzes auf einem Schaltungsträger, welches Stromverbraucher und Stromversorger verbindet Process for reducing the space requirements of an electricity supply system on a circuit board that conducts electricity consumers and electricity suppliers connects |
| 02/17/1994 | CA2139314A1 Planarizing bumps for interconnecting matching arrays of electrodes |
| 02/16/1994 | EP0582920A2 Fluid treatment apparatus and method |
| 02/16/1994 | EP0582881A1 Multilayer electronic component, method of manufacturing the same and method of measuring characteristics thereof |
| 02/16/1994 | EP0463105B1 High capacitance laminates |
| 02/16/1994 | EP0449969B1 Photoresist compositions containing cobalt (iii) compound and redox transfer ligand |
| 02/16/1994 | EP0339020B1 Method of patterning resist for printed wiring board |
| 02/16/1994 | CN1082306A Printed circuit board with internal capacitor |
| 02/16/1994 | CN1082227A Connection using zebra strip |
| 02/15/1994 | US5287208 Liquid crystal device with benzocyclobutene alignment layer and protective coating for electrodes |
| 02/15/1994 | US5286927 Insulating substrate having groove, conductor pattern formed in groove containing electroconductive metal of copper, silver or gold and fine particles having thermal expansion coefficient different from the metal |
| 02/15/1994 | US5286821 Acrylic adhesive composition and organoboron initiator system |
| 02/15/1994 | US5286611 Photoresist |
| 02/15/1994 | US5286530 Method for providing adherent metal coatings on cyanate ester polymer surfaces |
| 02/15/1994 | US5286417 Fusible electroconductive adhesive |
| 02/15/1994 | US5286330 Method of producing copper-clad laminated board |
| 02/15/1994 | US5286209 IC socket |
| 02/15/1994 | US5285619 Self tooling, molded electronics packaging |
| 02/15/1994 | CA2103863A1 Method for preparing high resolution wash-off images and non-photosensitive elements for use therein |
| 02/12/1994 | CA2101902A1 Fluid treatment apparatus and method |
| 02/11/1994 | CA2101142A1 Cleaning by cavitation in liquefied gas |
| 02/10/1994 | DE4326206A1 Electroless tin@-lead@ solder plating bath - contains trivalent titanium based reductant and complexing agent |
| 02/10/1994 | DE4313797A1 Conductor for bonding in semiconductor chip - has perforated end section through conducting layer for connection to contact bumps on semiconductor chip |
| 02/10/1994 | DE4234024C1 Computer-generated layout of tracks on printed wiring board - involves broadening of tracks in conventionally plotted layout until single-track-width sepn. lines are available for tool programming |
| 02/10/1994 | DE4226168A1 Electronic module mfr. using heat-conductive adhesive - making holes through pref. copper@-plated area of PCB for injection of adhesive after satisfactory in-situ functional test |
| 02/10/1994 | DE4225961A1 Appts. for electroplating copper@ plating flat, plate or arcuate components - has voltage source including at least one adjustable rectangular pulse generator |
| 02/09/1994 | EP0582425A2 Metal coating of polypyromellitimides |
| 02/09/1994 | EP0582411A2 Electroless metal coatings |
| 02/09/1994 | EP0582375A1 Solder particle deposition |
| 02/09/1994 | EP0582336A2 Improved electroless copper deposition |
| 02/09/1994 | EP0582313A2 Positive photosensitive resin composition |
| 02/09/1994 | EP0582207A1 Heat-resisting cushion material |
| 02/09/1994 | EP0582052A1 Low profile overmolded semiconductor device and method for making the same |
| 02/09/1994 | EP0581823A1 Means for the selective formation of a thin oxidising layer. |
| 02/09/1994 | EP0581816A1 Method for selectively coating non-conductors with carbon particles and use of copper containing solutions therein |
| 02/08/1994 | US5285398 Flexible wearable computer |
| 02/08/1994 | US5285018 Power and signal distribution in electronic packaging |
| 02/08/1994 | US5285016 Wiring board provided with a heat bypass layer |
| 02/08/1994 | US5285015 Patterned circuitry with foraminous substrate and method of making |
| 02/08/1994 | US5285010 Electrical control device with metal-coated plastic housing |
| 02/08/1994 | US5284912 Thermoset resin with polyunsaturated monomer-grafted seed particles |
| 02/08/1994 | US5284796 Mating solder bumps on semiconductor chip and corresponding solder bumps on circuit board, heating and breaking away outer peripheral portion |
| 02/08/1994 | US5284736 Flame-resistant photo-curable resin composition |
| 02/08/1994 | US5284734 Radiation-sensitive mixture and use thereof |
| 02/08/1994 | US5284725 Photo-mask for manufacture of two-layer tab |
| 02/08/1994 | US5284554 Electrochemical micromachining tool and process for through-mask patterning of thin metallic films supported by non-conducting or poorly conducting surfaces |
| 02/08/1994 | US5284548 Process for producing electrical circuits with precision surface features |
| 02/08/1994 | US5284520 Electroless plating tank for holding solution, workpiece holder, draft pipe for blowing air into solution to produce bubbles, and shield plate having perforations of dimensions whereby bubbles cannot pass through |
| 02/08/1994 | US5284287 Method for attaching conductive balls to a substrate |
| 02/08/1994 | US5284189 Conductive ink packaging for printed circuit board screen printing operations |
| 02/08/1994 | US5283949 Method of producing a printed circuit board having a conductive pattern thereon |
| 02/08/1994 | US5283948 Interlocking structure allows greater height |
| 02/08/1994 | US5283947 Method of mounting electronic components on a circuit board |
| 02/08/1994 | CA1326789C Method of making multilayered ceramic structures having an internal distribution of copper-based conductors |
| 02/05/1994 | CA2101881A1 Electroless copper deposition |
| 02/04/1994 | CA2101827A1 Adhesion of metal coatings to polypyromellitimides |
| 02/03/1994 | WO1994003038A1 Packaging electrical components |
| 02/03/1994 | WO1994003036A1 Semiconductor connection components and methods with releasable lead support |
| 02/03/1994 | WO1994002974A1 Anisotropic electrical connection |
| 02/03/1994 | WO1994002970A1 Rf waveguide signal transition apparatus |
| 02/03/1994 | WO1994002807A1 Double-sided circuit board exposure machine and method with optical registration and sag compensation |
| 02/03/1994 | WO1994002540A1 Highly filled polymeric compositions |
| 02/03/1994 | WO1994002310A1 Printed circuit board with internal capacitor |
| 02/03/1994 | WO1994002306A1 A method of manufacturing a ud-reinforced pwb laminate |
| 02/03/1994 | WO1994002284A1 Method and apparatus for tool management |
| 02/03/1994 | WO1994002279A1 Apparatus and process for soldering component onto boards |
| 02/03/1994 | DE4325668A1 Multi-level wiring ceramic substrate for multi-chip module carrier - consists of central region contg. two wiring layers and vertical conductors connected between lower wiring plane and surface, and second conductors coupled between upper wiring plane and surface |
| 02/03/1994 | DE4324330A1 Verfahren zum elektrolytischen Behandeln von insbesondere flachem Behandlungsgut, sowie Anordnung, insbesondere zur Durchführung des Verfahrens A method for the electrolytic treatment in particular of flat material to be treated, as well as arrangement, in particular for performing the method |
| 02/03/1994 | DE4228442C1 Electroless nickel@ coating of metallised ceramic - using treatment to activate only the metallised areas and avoid unwanted coating of ceramic areas |
| 02/03/1994 | DE4225358A1 Anbausteuergerät Attached control unit |
| 02/03/1994 | DE4224925A1 Multilayer circuit board with printed components |
| 02/03/1994 | CA2140756A1 A method of manufacturing a ud-reinforced pwb laminate |
| 02/02/1994 | EP0581712A2 MLC conductor pattern off-set design to eliminate line to via cracking |
| 02/02/1994 | EP0581669A1 Process and device for mounting components with bended terminals |
| 02/02/1994 | EP0581536A1 Epoxy group-containing resin composition |
| 02/02/1994 | EP0581445A1 Method and apparatus for the computer-controlled manufacture of three-dimensional objects from computer data |
| 02/02/1994 | EP0581428A1 Card type fuse and method of producing the same |
| 02/02/1994 | EP0581411A2 Drilling method and apparatus using variable dwell times |
| 02/02/1994 | EP0581298A2 Ink jet recording head, ink jet recording head cartridge, recording apparatus using the same and method of manufacturing the head |
| 02/02/1994 | EP0581294A2 Process for producing a circuit substrate |
| 02/02/1994 | EP0581284A2 Non-contact IC card and manufacturing and testing methods of the same |
| 02/02/1994 | EP0581206A2 Low-temperature-cofired-ceramic (LTCC) tape structures including cofired ferromagnetic elements, drop-in components and multi-layer transformer |
| 02/02/1994 | EP0580886A1 Portable transmitter providing remote control of a locking means, in particular adapted to an automobile |
| 02/02/1994 | EP0580809A1 A system and method for manufacturing copper clad, glass fibre reinforced epoxy resin laminates. |
| 02/02/1994 | EP0517767B1 A device for applying a solder paste, a glue or the like in patches on a substrate |
| 02/02/1994 | EP0494975B1 Azeotrope-like compositions of 1,3-dichloro-1,1,2,2,3-pentafluoropropane and 2-methyl-2-propanol |
| 02/02/1994 | CN1081557A Method for forming tin solder durable figures with photosensitive thermosetting resin composition |
| 02/02/1994 | CN1081401A Low-bridging soldring process |
| 02/01/1994 | US5283716 Electrical component support structure |
| 02/01/1994 | US5283677 Liquid crystal display with ground regions between terminal groups |
| 02/01/1994 | US5283108 Process for producing defect free multilayer printed circuit boards |
| 02/01/1994 | US5283107 Modular multilayer interwiring structure |
| 02/01/1994 | US5283104 Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates |
| 02/01/1994 | US5283081 Applying photoresist to multilayer ceramic substrate, exposing to light, developing to form mask pattern, plating; printing with photosetting paste for dielectric, drying, forming via hole pattern, burying and sintering conductor paste in holes |
| 02/01/1994 | US5282953 Polyoxyalklene compounds terminated with ketone groups for use as surfactants in alkanesulfonic acid based solder plating baths |
| 02/01/1994 | US5282751 Connector apparatus |