| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 02/01/1994 | US5282565 Solder bump interconnection formed using spaced solder deposit and consumable path |
| 02/01/1994 | US5282416 Solder paste apparatus |
| 02/01/1994 | US5282312 Multi-layer circuit construction methods with customization features |
| 01/31/1994 | CA2101038A1 Printed circuit board and assembly module for connection of screened conductors for distribution boards and distribution systems in light-current systems engineering |
| 01/27/1994 | DE4309005A1 Multilayer hybrid integrated circuit mfr. from ceramic green sheets - providing contacts between conductive tracks via feedthrough(s) in holes through interposed ceramic plate which prevents shrinkage |
| 01/27/1994 | DE4302976A1 Vorrichtung und Verfahren zum Auflöten von Bauelementen auf Platinen Apparatus and method for soldering components onto boards |
| 01/27/1994 | DE4224122A1 Shrinkage-absorbing potted PCB holding electronic components - has cushioning layer of e.g. polyurethane foam bonded to e.g. polycarbonate film embedded between PCB and outer casing to absorb stresses |
| 01/27/1994 | DE4206680C1 Verfahren zur Metallisierung von Nichtleiteroberflächen und die Verwendung von Hydroxymethansulfinsäure im Verfahren A process for the metallization of non-conductive surfaces and the use of hydroxymethanesulfinic acid in the process |
| 01/26/1994 | EP0580408A1 Excimer laser processing method and apparatus |
| 01/26/1994 | EP0580381A1 Sealing porous electronic substrates |
| 01/26/1994 | EP0580313A2 Surface mount microcircuit hybrid |
| 01/26/1994 | EP0580050A1 Process for making a polymer/metal or a polymer/semi-conductor band |
| 01/26/1994 | EP0579852A1 A porous fluororesin material plated with a metal |
| 01/26/1994 | EP0579701A1 Process for the metallization of non-conductors, in particular circuit boards, and the use of nitrogen-containing quaternary salts in the process. |
| 01/26/1994 | EP0579644A1 Protective coatings |
| 01/26/1994 | EP0579610A1 Novel demetallizing procedure |
| 01/26/1994 | CN1081297A Component module |
| 01/26/1994 | CN1081189A Copolymer for use in preparing prepregs, printed circuit wiring boards prepared from such prepregs, and processes for preparing such printed circuit wiring boards |
| 01/25/1994 | US5282112 Backplane having a jumper plug to connect socket connections to a bus line |
| 01/25/1994 | US5281942 Bobbin for an electrical winding and method of manufacture |
| 01/25/1994 | US5281851 Integrated circuit packaging with reinforced leads |
| 01/25/1994 | US5281772 Electrical connector having energy-formed solder stops and methods of making and using the same |
| 01/25/1994 | US5281771 Multilayer wiring board, interlevel connector, and method for making same |
| 01/25/1994 | US5281770 Printed circuit board apparatus |
| 01/25/1994 | US5281765 Wiring assembly for equipment and a method for producing the same |
| 01/25/1994 | US5281684 Solder bumping of integrated circuit die |
| 01/25/1994 | US5281466 Adhesive for laminating layers of a multilayer circuit, alkali resistance |
| 01/25/1994 | US5281449 Coating and curing then development with alkali |
| 01/25/1994 | US5281447 Applying oxalate of group 8 element on substrate which can be decomposed on exposure to energy, exposing in a pattern to obtain metal |
| 01/25/1994 | US5281326 Coating ceramic body with layer of electroconductive silver or copper paste, electrolytically growing electroconductive silver, copper, tin, or lead-tin layer on coating |
| 01/25/1994 | US5281325 Covering cathode with one electrically non-conductive apertured mask to direct electric current through plating solution onto target cathode, the mask being spaced from surface of cathode, while covering anode with mask |
| 01/25/1994 | US5281281 No-clean, low-residue, volatile organic compound free soldering flux and method of use |
| 01/25/1994 | US5281171 To be mounted to a printed circuit board |
| 01/25/1994 | US5281152 Surface-mounted electronic component |
| 01/25/1994 | US5280850 Method of manufacturing circuit board |
| 01/21/1994 | CA2100277A1 Sealing porous electronic substrates |
| 01/21/1994 | CA2091286A1 Direct imaging process for forming resist pattern on a surface, and use thereof in fabricating printed boards |
| 01/20/1994 | WO1994001987A1 Component module |
| 01/20/1994 | WO1994001985A1 Treatment of substrates |
| 01/20/1994 | WO1994001984A1 Interconnection method and structure for organic circuit boards |
| 01/20/1994 | WO1994001889A1 Fitting unit for multilayer hybrid circuit with power components |
| 01/20/1994 | WO1994001888A1 Multiple wiring arrangement for multichip modules |
| 01/20/1994 | WO1994001876A1 Electrical devices |
| 01/20/1994 | WO1994001377A1 Ceramic green sheet |
| 01/20/1994 | WO1994001263A1 Process for producing plastic laminates from continuously fed bands |
| 01/20/1994 | WO1994001240A1 Use of fresnel zone plates for material processing |
| 01/20/1994 | DE4230142C1 Verwendung einer Übertragungsfolie Using a transfer film |
| 01/20/1994 | DE4228461C1 Reinigungsmediumzusammensetzung Cleaning medium composition |
| 01/20/1994 | DE4223542A1 Circuit board processing appts. with processing liq. - has nozzle sticks carrying processing fluid with distributor tube connected to multiple nozzle bodies with slit-shaped openings |
| 01/20/1994 | DE4223541A1 Multilayer-inner layers flexible circuit producing appts. - has inner roller pairs at intervals between edge pairs, with those on adjacent axes staggered w.r.t. each other |
| 01/20/1994 | DE4223371A1 Electronic component mounting method for circuit board assembly - with openings in cover layer overlapping each component receiving conductive paste providing required electrical connections |
| 01/19/1994 | EP0579417A1 Robot manipulated spray gun |
| 01/19/1994 | EP0579012A1 Apparatus and methods for applying discrete coatings |
| 01/19/1994 | EP0578881A1 Circuit board edge connector |
| 01/19/1994 | EP0578816A1 Method of inspecting articles |
| 01/19/1994 | EP0578737A1 Contact device for an electrical or electronic component. |
| 01/19/1994 | CN2153925Y Non-soldering tin circuit board |
| 01/19/1994 | CN2153411Y Horizontal screen spraying device |
| 01/18/1994 | US5280414 Au-Sn transient liquid bonding in high performance laminates |
| 01/18/1994 | US5280301 Thermal head |
| 01/18/1994 | US5280262 Thermal overlaod fuse of surface mount compatible construction |
| 01/18/1994 | US5280257 Filter insert for connectors and cable |
| 01/18/1994 | US5280193 Repairable semiconductor multi-package module having individualized package bodies on a PC board substrate |
| 01/18/1994 | US5280139 Multilayer; dielectric, adhesive and electroconductive layer |
| 01/18/1994 | US5279923 Generating an acid when exposured to actinic radiation |
| 01/18/1994 | US5279850 Removal impurties from metallic layer to increase bonding sites |
| 01/18/1994 | US5279711 Chip attach and sealing method |
| 01/18/1994 | US5279706 Forming metal layer, applying photoresist, exposure to radiation |
| 01/18/1994 | US5279702 Anisotropic liquid phase photochemical copper etch |
| 01/18/1994 | US5279699 Sticking apparatus |
| 01/18/1994 | US5279694 Chip mounting techniques for display apparatus |
| 01/18/1994 | US5279028 Method of making a pin grid array and terminal for use therein |
| 01/18/1994 | CA1326320C Aromatic polysulfone resin composition having excellent plating characteristics |
| 01/17/1994 | CA2097388A1 Topographical selective patterns |
| 01/13/1994 | DE4222474A1 Montageeinheit für Mehrlagenhybrid mit Leistungsbauelementen Mounting unit for multilayer hybrid with power devices |
| 01/13/1994 | DE4222402A1 Anordnung für die Mehrfachverdrahtung von Mulichipmodulen Arrangement for multiple wiring Mulichipmodulen |
| 01/13/1994 | DE4221564A1 Solder connection method for joining e.g. LED chip and flat copper component - preheating solder, positioning chip, melting solder by short-term temp. increase and lowering chip into position before cooling |
| 01/12/1994 | EP0578551A1 Screen printer |
| 01/12/1994 | EP0578487A1 Electrical pin field |
| 01/12/1994 | EP0578469A2 Improvements in and relating to applying coatings |
| 01/12/1994 | EP0578420A1 Connector for a plated or soldered hole |
| 01/12/1994 | EP0578061A1 Device to withdraw, superimpose and anchor foils for green-tape circuits |
| 01/12/1994 | EP0578040A2 Fluid treatment apparatus and method |
| 01/12/1994 | EP0577779A1 Multichip integrated circuit module and method of fabrication |
| 01/12/1994 | EP0577754A1 Three-dimensional multichip module systems and methods of fabrication |
| 01/12/1994 | EP0577743A1 Photodefinable interlevel dielectrics |
| 01/12/1994 | EP0470957B1 Etchant solution for photoresist-patterned metal layers |
| 01/12/1994 | EP0414804B1 Azeotrope-like compositions of 1,1-dichloro-1-fluoroethane, methanol and nitromethane |
| 01/12/1994 | CN1023542C Printed circuit board, method of its fabrication and of attaching electronic elements thereto |
| 01/11/1994 | US5278938 Infrared heater array for IC soldering reflective members |
| 01/11/1994 | US5278728 Diode mounting |
| 01/11/1994 | US5278727 High density electrical interconnection device and method therefor |
| 01/11/1994 | US5278724 Electronic package and method of making same |
| 01/11/1994 | US5278535 Electrical overstress pulse protection |
| 01/11/1994 | US5278524 Multi-layered printed circuit board with transmission line capabilities |
| 01/11/1994 | US5278442 Electronic packages and smart structures formed by thermal spray deposition |
| 01/11/1994 | US5278385 Method of producing flexible printed circuits, printed circuit produced by this method and device for carrying out this method |
| 01/11/1994 | US5278023 Propellant-containing thermal transfer donor elements |
| 01/11/1994 | US5278012 Method for producing thin film multilayer substrate, and method and apparatus for detecting circuit conductor pattern of the substrate |
| 01/11/1994 | US5277980 Mass of fine particles of inorganic material and a film of the fine inorganic particles |