| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/03/1994 | US5308686 Substrate having a multiple metal protected conductive layer and method of manufacturing the same |
| 05/03/1994 | US5308684 Burning pattern sheet |
| 05/03/1994 | US5308658 Process and apparatus for efficient spray coating |
| 05/03/1994 | US5308645 Method and apparatus for through hole substrate printing |
| 05/03/1994 | US5308644 Method for manufacturing a printed wiring board having a shield layer |
| 05/03/1994 | US5308528 Cleaning composition based on 1,1-dichloro-1-fluoroethane and methyl formate |
| 05/03/1994 | US5308464 Low temperature tin-bismuth electroplating system |
| 05/03/1994 | US5308390 Ink composition and method of making and using such composition |
| 05/03/1994 | US5308387 Pre-etch treatment of a plastic substrate |
| 05/03/1994 | US5308241 Surface shaping and finshing apparatus and method |
| 05/03/1994 | US5308198 Method and apparatus for drill length compensation |
| 05/03/1994 | US5307983 Method of making an article comprising solder bump bonding |
| 05/03/1994 | US5307980 Solder pad configuration for wave soldering |
| 05/03/1994 | US5307561 Method for making 3-D electrical circuitry |
| 05/03/1994 | CA2043359C Line termination adaptor convecting device |
| 05/03/1994 | CA2018623C Structure of connection between bus bar and press-connecting branch terminal in electric connection box |
| 05/03/1994 | CA1329106C Azeotrope-like compositions of 1,1-dichloro-1- fluoroethane and methanol |
| 05/01/1994 | CA2091232A1 Soldering process of at least one electronic component to the surface of a substrat |
| 05/01/1994 | CA2081803A1 Cleaning, wetting agent and solvent |
| 04/28/1994 | WO1994009182A1 Metal powder composition for metallization and metallized substrate |
| 04/28/1994 | WO1994009181A1 Electroless deposition of metal employing thermally stable carrier polymer |
| 04/28/1994 | WO1994009013A1 Dual curing conformal coatings |
| 04/28/1994 | WO1994008731A1 Method of forming printed circuit assembly |
| 04/28/1994 | DE4235919A1 Thin film circuit manufacturing method - gilding remaining copper surfaces after removal of exposed parts of first relatively thin copper layer |
| 04/27/1994 | EP0594427A2 A printed circuit board mounted with electric elements thereon |
| 04/27/1994 | EP0594409A1 A connection device for a printed wiring board |
| 04/27/1994 | EP0594408A1 A connection device for a printed wiring board |
| 04/27/1994 | EP0594367A1 A display device |
| 04/27/1994 | EP0594146A2 System and method for automatic optical inspection |
| 04/27/1994 | EP0594041A1 Fastening of a shield to a PCB |
| 04/27/1994 | EP0593938A1 Method and apparatus for uniform deposition of solder paste on a pcb |
| 04/27/1994 | EP0593584A1 Electrical connection system. |
| 04/27/1994 | EP0513034B1 Gas curtain additives and zoned tunnel for soldering |
| 04/27/1994 | CN1085925A Ink composition and method of making, using and recovering such composition |
| 04/27/1994 | CN1085878A Partially crystallizable low melting glass |
| 04/27/1994 | CN1024341C Method for producing thin film patterns on glass substrate |
| 04/26/1994 | US5307519 Circuit with built-in heat sink |
| 04/26/1994 | US5307503 Shielded circuit module with terminal pins arrayed on four sides for connection to a computer board |
| 04/26/1994 | US5307241 Electronic circuit board arrangements including main auxiliary circuit boards |
| 04/26/1994 | US5306961 Low-power integrated circuit with selectable battery modes |
| 04/26/1994 | US5306949 Transistor module having external lead terminal with transient voltage suppression |
| 04/26/1994 | US5306898 Heater for sheet material |
| 04/26/1994 | US5306874 Electrical interconnect and method of its manufacture |
| 04/26/1994 | US5306872 Structures for electrically conductive decals filled with organic insulator material |
| 04/26/1994 | US5306756 Method and compositions for diffusion patterning |
| 04/26/1994 | US5306602 Multistep process; press heat bonding an electrically insulative bonding suspension paint |
| 04/26/1994 | US5306546 Multi chip module substrate |
| 04/26/1994 | US5306541 Printed circuit board and terminal board with staggered conductive pads |
| 04/26/1994 | US5306389 Method of protecting aluminum nitride circuit substrates during electroless plating using a surface oxidation treatment |
| 04/26/1994 | US5306162 Clamp connector apparatus for removably coupling a flexible ribbon cable to a printed circuit board |
| 04/26/1994 | US5305948 Method of bonding a metal by solder |
| 04/26/1994 | US5305941 Desoldering wick |
| 04/26/1994 | US5305601 Solid fuel rocket motor assembly, and method of making the same |
| 04/26/1994 | US5305523 Method of direct transferring of electrically conductive elements into a substrate |
| 04/26/1994 | CA1328783C Method for applying a moistureproof coating to printed circuit boards using triangular or dovetail shaped liquid film emitted from a flat-pattern nozzle |
| 04/21/1994 | DE4335800A1 Assembly of thick-film microcircuit package to printed circuit board - involves interposition of solder plate between indium coatings on respective earth planes of corresp. dimensions |
| 04/21/1994 | DE4333956A1 Verfahren zur Anbringung von integrierten Schaltungschips mit TAB-Struktur auf ein Substrat Method of mounting the integrated circuit chip with TAB structure on a substrate |
| 04/21/1994 | DE4316382C1 Coded-switch mounted on PCB - has rotor axis extending parallel to surface of PCB within switch housing attached to latter via strap element |
| 04/20/1994 | EP0593199A2 Method and apparatus for fabricating a metal interconnection pattern for an integrated circuit module |
| 04/20/1994 | EP0593175A2 Structure and method for preventing ink shorting of conductors connected to a printhead |
| 04/20/1994 | EP0593155A1 Parts installation structure and method of manufacturing parts installation structure |
| 04/20/1994 | EP0592938A1 Process for mounting and contacting electronic components on an insulating support |
| 04/20/1994 | EP0592937A2 Tracking resistant material and circuit substrate using the material |
| 04/20/1994 | EP0592768A1 A process for co-molding a metal insert |
| 04/20/1994 | EP0592745A1 Method and apparatus for two-sided coating of plate-like articles |
| 04/20/1994 | EP0592471A1 Method of treating the surface of moulded polyamide articles, and the articles thus obtained. |
| 04/20/1994 | CN2162758Y Soldering tin slot of spike welding gun |
| 04/19/1994 | US5305130 Connecting tape, film carrier type IC for driving a liquid crystal display panel and method for making wiring interconnections |
| 04/19/1994 | US5304922 Electrical circuit with resilient gasket support for raised connection features |
| 04/19/1994 | US5304843 Semiconductor device using film carrier |
| 04/19/1994 | US5304460 Anisotropic conductor techniques |
| 04/19/1994 | US5304428 Copper foil for printed circuit boards |
| 04/19/1994 | US5304399 Method of producing epoxy resin film |
| 04/19/1994 | US5304392 Screen printing gives uniform thickness of solder resist film |
| 04/19/1994 | US5304321 Cleaning compositions, formed of hydrogen-containing fluorochlorohydrocarbons and partially fluorinated alkanols |
| 04/19/1994 | US5304320 Compositions comprising a fluoro ether and use of these compositions |
| 04/19/1994 | US5304274 Method for manufacturing electrodes for multilayer ceramic capacitors |
| 04/19/1994 | US5304252 Method of removing a permanent photoimagable film from a printed circuit board |
| 04/19/1994 | US5303862 Using a patterned adhesive |
| 04/19/1994 | US5303824 Solder preform carrier and use |
| 04/19/1994 | US5303618 Via hole punch |
| 04/19/1994 | US5303466 Method of mounting surface connector |
| 04/14/1994 | WO1994008443A1 Method and apparatus for fabricating printed circuit boards |
| 04/14/1994 | WO1994008442A1 Fabrication of dense parallel solder bump connections |
| 04/14/1994 | WO1994008441A1 Method of manufacturing circuit boards |
| 04/14/1994 | WO1994008366A1 Contacting device for a film with several conductor tracks |
| 04/14/1994 | WO1994007747A1 Self tooling, molded electronics packaging |
| 04/14/1994 | WO1994007697A1 A screen printing stencil |
| 04/14/1994 | WO1994007696A1 Screen printing tensioning device |
| 04/14/1994 | WO1994007611A1 Method for forming circuitry by a spraying process with stencil |
| 04/14/1994 | WO1994003947A3 Modular panel for making a conductor network, associated connectors, and methods for fabricating such panels |
| 04/14/1994 | WO1994003921A3 Planarizing bumps for interconnecting matching arrays of electrodes |
| 04/14/1994 | DE4234022A1 Layered circuit with power resistor(s) - has extra ceramic carrier layer in heat conductive contact with power resistor |
| 04/13/1994 | EP0592285A1 Process and apparatus for electroplating a metal onto a flexible poor conducteur substrate and product obtained by this process |
| 04/13/1994 | EP0591887A2 Printed wiring board |
| 04/13/1994 | EP0591772A1 High-density/long-via laminated connector |
| 04/13/1994 | EP0591761A2 A two-sided printed circuit board, a multi-layered printed circuit board, and a method for producing the same |
| 04/13/1994 | EP0591759A2 Radiation polymerizable mixture and process for the preparation of a solder mask |
| 04/13/1994 | EP0591604A2 Via fill compositions |
| 04/13/1994 | EP0591198A1 Method for coating a dielectric ceramic piece. |