| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 05/24/1994 | CA2029540C Solder joint locator |
| 05/24/1994 | CA1329792C Device for the electrolytic treatment of board-shaped objects |
| 05/24/1994 | CA1329788C Metal coated laminate products made from textured polyimide film |
| 05/24/1994 | CA1329738C Multilayer ceramics from silicate esters |
| 05/19/1994 | DE4238747A1 Koaxiale Hochfrequenz-Steckverbindung für den Anschluß zahlreicher Koaxialleitungen Radio frequency coaxial connector for connecting multiple coaxial lines |
| 05/19/1994 | DE4238412A1 Machining printed circuit boards - cooling machining location with continuous or pulsed gas jets |
| 05/19/1994 | DE4238375A1 Adjusting drive with electric drive motor - has Hall sensor previously mounted in shell and mounted on control circuit board. |
| 05/19/1994 | DE4238366A1 Protective layer formation for switch during soldering - using small balls of glass or ceramic that attach to adhesive coating over top surface of switch |
| 05/19/1994 | CA2079418A1 Apparatus and method for manufacturing printed circuit boards |
| 05/18/1994 | EP0597635A1 Solder paste |
| 05/18/1994 | EP0597337A1 Device for flattening of solder bumps on circuit board surfaces before assembling |
| 05/18/1994 | EP0597254A1 Device with power semiconductor components |
| 05/18/1994 | EP0597090A1 Swash plate piston pump/motor |
| 05/18/1994 | EP0397663B1 Electrodeposition of tin-bismuth alloys |
| 05/18/1994 | CN1086949A Process for producing plastic laminates with metal laminae, especially for printed circuits |
| 05/18/1994 | CN1086948A Printed circuit board and assembly module for connection of screened conductors for distribution boards and distribution systems in light-current systems engineering |
| 05/17/1994 | US5313368 Electrical connections between printed circuit boards and integrated circuits surface mounted thereon |
| 05/17/1994 | US5313128 Lead wire elimination for enclosed spindle motor |
| 05/17/1994 | US5313097 High density memory module |
| 05/17/1994 | US5313043 Method and apparatus for laser machining |
| 05/17/1994 | US5313021 Circuit board for high pin count surface mount pin grid arrays |
| 05/17/1994 | US5312943 Dual curing conformal coatings |
| 05/17/1994 | US5312770 Techniques for forming isolation structures |
| 05/17/1994 | US5312715 Light-sensitive composition and process |
| 05/17/1994 | US5312698 Aluminum nitride substrate and method for producing same |
| 05/17/1994 | US5312674 Low-temperature-cofired-ceramic (LTCC) tape structures including cofired ferromagnetic elements, drop-in components and multi-layer transformer |
| 05/17/1994 | US5312643 Method of producing a transparent conductive film provided with supplementary metal lines |
| 05/17/1994 | US5312576 Method for making particulate filled composite film |
| 05/17/1994 | US5312562 Aqueous electronic circuit assembly cleaner and method |
| 05/17/1994 | US5312514 Method of making a field emitter device using randomly located nuclei as an etch mask |
| 05/17/1994 | US5312505 Film peeling method and apparatus for practicing same |
| 05/17/1994 | US5312264 Article locating and centering means |
| 05/17/1994 | US5312027 Precleaning of soldered circuit cards to prevent white residue |
| 05/17/1994 | US5311660 Flowing heated air through printed circuit to remove solvent by gas entrainment before passing stream of oxidizing solution |
| 05/11/1994 | WO1994010696A1 Self leaded surface mount coil lead form |
| 05/11/1994 | EP0596822A1 Continuous air bearing vapor stabilization system for a ceramic substrate and method |
| 05/11/1994 | EP0596771A2 Device for electric connection of printed circuit boards at least one of which is flexible |
| 05/11/1994 | EP0596721A1 Noise filter |
| 05/11/1994 | EP0596701A1 A printed circuit board component mounting device |
| 05/11/1994 | EP0596582A1 Bonded ceramic-metal composite substrate and circuit board constructed therewith |
| 05/11/1994 | EP0596266A1 Adapter for drilling machines |
| 05/11/1994 | EP0596025A1 Oligoorganosilasesquioxanes |
| 05/11/1994 | DE4337675A1 Semiconductor chip package with stepped connecting element surfaces - has wire bonds from chip to upper steps of elements with encapsulation completely enveloping chip on lower steps |
| 05/11/1994 | DE4337451A1 Mfr. of thermal fuse for telephone circuit overload applications - has M-shaped wire fuse of spring material with ends fixed under compression to contact pads on circuit board |
| 05/11/1994 | DE4238765A1 Electroless tin@ plating of circuit board with conditioned bath - conditioned by heating and adding copper salt or in contact with circuit board, giving stable planar surface suitable for repeated soldering |
| 05/11/1994 | DE4237876A1 Potentiometer with track connections protected against vibration - has wire links to socket pins soldered to pads that are embedded within insulating plastic resin. |
| 05/11/1994 | DE4237766A1 Repair and correction process for circuit boards - uses material coatings applied separately by metering heads |
| 05/11/1994 | DE4237611A1 Circuit board prodn. and circuit board - uses further layer of resin-impregnated fabric to cover conductive paths formed on composite baseboard |
| 05/11/1994 | DE4237591A1 Leiterplatten-Prüfeinrichtung mit Folienadapter PCB tester with transparency adapters |
| 05/11/1994 | DE4237496A1 Ribbon cable connection unit - has housing with contacts that are engaged by ribbon using push-in plug that locates in recess |
| 05/10/1994 | US5311407 Printed circuit based for mounted semiconductors and other electronic components |
| 05/10/1994 | US5311406 Microstrip printed wiring board and a method for making same |
| 05/10/1994 | US5311405 Method and apparatus for aligning and attaching a surface mount component |
| 05/10/1994 | US5311404 Electrical interconnection substrate with both wire bond and solder contacts |
| 05/10/1994 | US5311398 Housing for motor vehicle electronic system |
| 05/10/1994 | US5311396 Smart card chip-based electronic circuit |
| 05/10/1994 | US5311395 Surface mount heat sink |
| 05/10/1994 | US5311341 Connection structure between a tab film and a liquid crystal panel |
| 05/10/1994 | US5311164 Surge absorber |
| 05/10/1994 | US5311060 Heat sink for semiconductor device assembly |
| 05/10/1994 | US5310986 Laser machining apparatus |
| 05/10/1994 | US5310967 Applying conductive lines to integrated circuits |
| 05/10/1994 | US5310966 Wiring boards and manufacturing methods thereof |
| 05/10/1994 | US5310840 Energy-polymerizable adhesive, coating and film |
| 05/10/1994 | US5310580 Electroless metal adhesion to organic dielectric material with phase separated morphology |
| 05/10/1994 | US5310574 Method for surface mount solder joints |
| 05/10/1994 | US5310440 Convection transfer system |
| 05/10/1994 | US5310367 Solderable leads |
| 05/10/1994 | US5310353 Electrical power distribution center having conductive ridges |
| 05/10/1994 | US5309837 Method for screen printing of paste |
| 05/10/1994 | US5309632 Process for producing printed wiring board |
| 05/10/1994 | US5309629 Method of manufacturing a multilayer circuit board |
| 05/10/1994 | US5309625 Card type fuse and method of producing the same |
| 05/05/1994 | DE4310446C1 Power semiconductor circuit module - has mirror symmetrical configuration of power semiconductor carrier plates and heat sink elements |
| 05/05/1994 | DE4237083A1 Interconnection of adjacent circuit assemblies - by solder connecting circuit lines at bent edges of flexible substrates |
| 05/05/1994 | DE4227836A1 Verfahren zur Metallisierung von Nichtleitern und die Verwendung einer sauren Lösung A process for the metallisation of non-conductors and the use of an acidic solution |
| 05/04/1994 | EP0595752A1 Interconnect structure having improved metallization |
| 05/04/1994 | EP0595745A2 A method of controlling the densification behavior of a metalllic feature in a ceramic material |
| 05/04/1994 | EP0595671A1 Dry reflow process and apparatus |
| 05/04/1994 | EP0595600A1 Semiconductor device package |
| 05/04/1994 | EP0595343A2 Method of forming solder film |
| 05/04/1994 | EP0595068A1 Adhesive composition with functional filler |
| 05/04/1994 | EP0594987A1 Electric module |
| 05/04/1994 | EP0594932A1 Method for forming patterned transparent conducting film |
| 05/04/1994 | EP0594644A1 Anisotropic conductive adhesive film. |
| 05/04/1994 | EP0346355B1 Photopatternable composite |
| 05/04/1994 | CN1086372A Process for producing printed wiring board |
| 05/03/1994 | USH1306 Method of using an improved solder to bridge a nonmetallic gap between metallic surfaces, said improved solder, and an improved solder connection to bridge a nonmetallic gap between metallic surfaces |
| 05/03/1994 | US5309545 Combined radiative and convective rework system |
| 05/03/1994 | US5309327 Apparatus and method for manufacturing printed circuit boards |
| 05/03/1994 | US5309326 Circuit module having stacked circuit boards |
| 05/03/1994 | US5309324 Device for interconnecting integrated circuit packages to circuit boards |
| 05/03/1994 | US5309320 Circuit card assembly conduction converter |
| 05/03/1994 | US5309316 Terminal structure of flexible printed circuit board |
| 05/03/1994 | US5309181 Pressing clip for flexible member |
| 05/03/1994 | US5309130 Self leaded surface mount coil lead form |
| 05/03/1994 | US5309021 Semiconductor device having particular power distribution interconnection arrangement |
| 05/03/1994 | US5308929 Multilayer structure |
| 05/03/1994 | US5308928 Soldering interconnects for selective line coupling |
| 05/03/1994 | US5308927 Wiring board and a method of manufacturing |