| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 01/11/1994 | US5277929 Sealing with photosetting or thermosetting resins and joining electric components |
| 01/11/1994 | US5277787 Method of manufacturing printed wiring board |
| 01/11/1994 | US5277738 Process and device for one- or two-sided stripping of protective films |
| 01/11/1994 | US5277734 Electrically conductive circuit sheet and method and apparatus for making same |
| 01/11/1994 | US5277725 Process for fabricating a low dielectric composite substrate |
| 01/11/1994 | US5277612 Carrier for guiding and supporting semiconductor devices |
| 01/11/1994 | US5277596 Printed circuit board assembly |
| 01/11/1994 | US5276964 Method of manufacturing a high density connector system |
| 01/11/1994 | US5276963 Process for obtaining side metallization and articles produced thereby |
| 01/11/1994 | US5276962 Method and apparatus for pressing contact elements of multipolar plug-in connectors into printed circuit board |
| 01/11/1994 | US5276961 Demountable tape-automated bonding method |
| 01/11/1994 | US5276955 Multilayer interconnect system for an area array interconnection using solid state diffusion |
| 01/11/1994 | US5276938 Freon recovery workstation |
| 01/09/1994 | CA2099316A1 Apparatus and methods for applying discrete coatings |
| 01/09/1994 | CA2098784A1 Apparatus and methods for applying conformal coatings to electronic circuit boards |
| 01/09/1994 | CA2098783A1 Spray gun with multiple axis movement |
| 01/06/1994 | WO1994000969A1 Self-aligning electrical contact array |
| 01/06/1994 | WO1994000966A1 Ceramic substrates with highly conductive metal vias |
| 01/06/1994 | WO1994000895A1 Connection using zebra strip |
| 01/06/1994 | CA2138032A1 Self-aligning electrical contact array |
| 01/05/1994 | EP0577589A1 Procedure for soldering and device for the working of this procedure |
| 01/05/1994 | EP0577484A1 Method of forming a bond between copper and a non-oxide ceramic substrate for power-electronics |
| 01/05/1994 | EP0577333A1 Temporary connections for fast electrical access to electronic devices |
| 01/05/1994 | EP0577223A1 Mounting structure for a terminal |
| 01/05/1994 | EP0577187A1 Method of providing a metal pattern on glass in an electroless process |
| 01/05/1994 | EP0577094A1 Protective covering for printed circuit boards and method for their manufacture |
| 01/05/1994 | EP0577083A1 7,8-cyclopropataxanes with antitumor action |
| 01/05/1994 | EP0577082A1 Fluoro taxols with antitumor activity |
| 01/05/1994 | EP0577071A2 Filter insert for connectors and cable |
| 01/05/1994 | EP0577067A2 Glass, dielectric composition, multilayer wiring substrate, and multilayer ceramic capacitor |
| 01/05/1994 | EP0576872A1 A new diffusion joining method and a paste used therefor |
| 01/05/1994 | EP0414872B1 Electrically conductive feedthrough and process for manufacturing it |
| 01/05/1994 | DE4222312A1 Flow soldered component circuit board mfr. - using surface solder masking layer with dispersed particles that gravitate to free surface of board. |
| 01/05/1994 | DE4221478A1 Soldering nozzle for wave soldering of flat circuitry components - has central opening for producing wave with ring groove for holding solder bath |
| 01/05/1994 | DE4221295A1 Print carrier to transfer motifs to e.g. hard smooth surfaces - consists of paper substrate, release layer which can be sepd. when hot, and transparent top ink carrier contg. adhesive |
| 01/04/1994 | US5276572 Magnetic disk apparatus |
| 01/04/1994 | US5276418 Flexible substrate electronic assembly |
| 01/04/1994 | US5276414 Moistureproof structure for module circuits |
| 01/04/1994 | US5276290 Electroplating process and composition |
| 01/04/1994 | US5276289 Electronic circuit device and method of producing the same |
| 01/04/1994 | US5276106 Decreasing viscosity with increasing temperature up to dissolution temperature, then increasing viscosity with temperature, rheology control |
| 01/04/1994 | US5275975 Method of making a relatively flat semiconductor package having a semiconductor chip encapsulated in molded material |
| 01/04/1994 | US5275970 Method of forming bonding bumps by punching a metal ribbon |
| 01/04/1994 | US5275897 Precisely aligned lead frame using registration traces and pads |
| 01/04/1994 | US5275889 Multi-layer wiring board |
| 01/04/1994 | US5275861 Radiation shielding fabric |
| 01/04/1994 | US5275856 Electrically conductive adhesive web |
| 01/04/1994 | US5275694 Process for production of copper through-hole printed wiring boards |
| 01/04/1994 | US5275689 Solubilizing acid labile polymer by reaction with organic acid |
| 01/04/1994 | US5275330 Solder ball connect pad-on-via assembly process |
| 01/04/1994 | US5274916 Method of manufacturing ceramic multilayer electronic component |
| 01/04/1994 | US5274915 Method of manufacturing a printed wiring board |
| 01/04/1994 | US5274913 Method of fabricating a reworkable module |
| 01/04/1994 | US5274912 Method of manufacturing a multilayer circuit board |
| 01/04/1994 | US5274911 Electronic components with leads partly solder coated |
| 01/04/1994 | CA2024784C Stackable multilayer substrate for mounting integrated circuits |
| 01/04/1994 | CA2012029C Method for wiring connection of a display device and structure for wiring connection to be used therefor |
| 01/04/1994 | CA1325791C Method and coating material for applying electrically conductive printed patterns to insulating substrates |
| 12/29/1993 | EP0576182A1 A semiconductor device |
| 12/29/1993 | EP0576023A1 Diode mounting |
| 12/29/1993 | EP0575985A2 Low-bridging soldering process |
| 12/29/1993 | EP0575892A1 Semiconducteur power module |
| 12/29/1993 | EP0575889A2 Semiconductor device, resin for sealing same and method of fabricating same |
| 12/29/1993 | EP0575850A2 Direct laser imaging for three-dimensional circuits and the like |
| 12/29/1993 | EP0575849A2 Conformal photomask for three-dimensional printed circuit board technology |
| 12/29/1993 | EP0575848A2 Ablative process for printed circuit board technology |
| 12/29/1993 | EP0575806A2 Package for integrated circuit chips |
| 12/29/1993 | EP0575426A1 Resist formation. |
| 12/29/1993 | CN1080110A Improved stencil or mask for applying solder to circuit boards and support frame thereof |
| 12/29/1993 | CN1079929A Solder powder coated with parylene |
| 12/29/1993 | CN1023301C Process for reflow soldering |
| 12/28/1993 | US5274570 Integrated circuit having metal substrate |
| 12/28/1993 | US5274401 Electrostatic printhead |
| 12/28/1993 | US5274352 Thick film resistive element, thick film printed circuit board and thick film hybrid integrated circuit device and their production methods |
| 12/28/1993 | US5274210 Laser bonding highly reflective surfaces |
| 12/28/1993 | US5274197 Electronic-parts mounting board and electronic-parts mounting board frame |
| 12/28/1993 | US5274195 Laminated conductive material, multiple conductor cables and methods of manufacturing such cables |
| 12/28/1993 | US5274060 Monomers of ether-substituted styrene derivatives |
| 12/28/1993 | US5273938 Connecting the first semiconductor die and the first side of the conductive traces pattern and encapsulating followed by doing the same to the second die after removing the transfer film |
| 12/28/1993 | US5273460 Electrical parts for surface mounting |
| 12/28/1993 | US5273440 Pad array socket |
| 12/28/1993 | US5273203 Ceramic-to-conducting-lead hermetic seal |
| 12/28/1993 | US5273187 Dispenser |
| 12/28/1993 | US5272980 Alignment method for transfer and alignment device |
| 12/28/1993 | CA1325548C Photocurable electrodeposition coating composition for printed circuit photoresist films |
| 12/23/1993 | WO1993026146A1 Thermal layout of thermoconductors |
| 12/23/1993 | WO1993026145A1 Method of making a printed circuit board |
| 12/23/1993 | WO1993026143A1 Process for producing printed circuit boards using a semi-finished product with extremely dense wiring for signal conduction |
| 12/23/1993 | WO1993026142A1 Three-dimensional printed circuit board, electronic circuit package using this board, and method for manufacturing this board |
| 12/23/1993 | WO1993026141A1 Electrical power distribution center having conductive ridges |
| 12/23/1993 | WO1993026063A1 Face-mount connector |
| 12/23/1993 | WO1993026028A1 Thermal protection device and process for activating the same |
| 12/23/1993 | WO1993025729A1 Stabilization of silicate solutions |
| 12/23/1993 | WO1993025728A1 Powdered electric circuit assembly cleaner |
| 12/23/1993 | WO1993025727A1 Low foaming effective hydrotrope |
| 12/23/1993 | WO1993025605A1 Silicon and zirconium based lacquer, its use as a substrate coating and substrates thus obtained |
| 12/23/1993 | WO1993025604A1 Silicon based lacquer, its use as a substrate coating and substrates thus obtained |
| 12/23/1993 | WO1993025345A2 Process and device for cooling micro-drills |
| 12/23/1993 | WO1993025336A1 Three-dimensional printing techniques ___________________________ |
| 12/23/1993 | DE4320527A1 Electrically conducting silicone gel - contg. silver coated mica and oxide free silver@ flakes are non-flowing, self-curing and thermally stable and have good conductivity |