| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 06/30/1994 | DE4344791A1 Electrical connector for connecting two PCBs |
| 06/30/1994 | DE4343706A1 Heat-resistant electronic constructional element |
| 06/30/1994 | DE4343127A1 Load secure electronic component assembly |
| 06/30/1994 | DE4342818A1 Zusammengesetztes elektronisches Bauteil The composite electronic component |
| 06/30/1994 | DE4326825A1 HF screening method for PCB |
| 06/30/1994 | DE4244626A1 Positioning arrangement for PCB without guide |
| 06/29/1994 | EP0604205A2 Lead frame and method for manufacturing it |
| 06/29/1994 | EP0603743A2 Method for preparing negative-working wash-off relief images and elements for use therein |
| 06/29/1994 | EP0603739A1 Stress resistant electronic assembly |
| 06/29/1994 | EP0603623A2 Joining of layers and multi-layer circuit boards |
| 06/29/1994 | EP0603588A2 Process for coating organic polymeric substrate with copper |
| 06/29/1994 | EP0603532A1 Liquid crystal display device |
| 06/29/1994 | EP0603296A1 Solder bump fabrication method and solder bumps formed thereby. |
| 06/29/1994 | EP0603282A1 Method of making co-fired, multilayer substrates |
| 06/29/1994 | EP0596025A4 Oligoorganosilasesquioxanes |
| 06/29/1994 | EP0561806B1 Electrical device, in particular a switching and control device for motor vehicles |
| 06/29/1994 | EP0530191B1 Process and device for positionally precise soldering of parts to be soldered on a supporting plate |
| 06/29/1994 | CN1088502A Method and apparatus for dry process fluxing |
| 06/28/1994 | US5325443 Vision system for inspecting a part having a substantially flat reflective surface |
| 06/28/1994 | US5325267 Remote driver board having input/output connector circuitry molded therein |
| 06/28/1994 | US5324936 Hybrid optical/electrical circuit module with thermal insulation |
| 06/28/1994 | US5324892 Method of fabricating an electronic interconnection |
| 06/28/1994 | US5324804 Positive photoresists, high resolution, good contrast |
| 06/28/1994 | US5324591 Deep ultraviolet photolithographically defined ultra-thin films for selective cell adhesion and outgrowth and method of manufacturing the same and devices containing the same |
| 06/28/1994 | US5324569 Composite transversely plastic interconnect for microchip carrier |
| 06/28/1994 | US5324535 Coating dry solder directly on liquid resist sub-pattern |
| 06/28/1994 | US5324474 Method of making a printed wiring board spacer |
| 06/28/1994 | US5323947 Method and apparatus for use in forming pre-positioned solder bumps on a pad arrangement |
| 06/28/1994 | US5323701 Screen printing apparatus |
| 06/28/1994 | US5323534 Process for producing coaxial conductor interconnection wiring board |
| 06/28/1994 | US5323533 Method of producing coaxial connections for an electronic component, and component package |
| 06/23/1994 | WO1994014201A1 Electrical interconnect structures |
| 06/23/1994 | WO1994014180A1 Electroluminescent lamp devices and their manufacture |
| 06/23/1994 | WO1994013867A1 Adhesive metal foil and laminates comprising said metal foil |
| 06/23/1994 | WO1994013854A1 Method of producing a metal film |
| 06/23/1994 | WO1994013777A1 Cleaning compositions |
| 06/23/1994 | DE4343934A1 Thick-film substrate mfg. method |
| 06/23/1994 | DE4343753A1 Fluorocarbon polymer moulding modification to give hydrophilic surface |
| 06/23/1994 | DE4243385A1 Method for soldering electric components to PCB |
| 06/23/1994 | DE4243356A1 Circuit board mounting process |
| 06/23/1994 | DE4242462A1 Mfr. of insulated circuit track cross=over points on PCBs |
| 06/23/1994 | CA2150913A1 Electrical interconnect structures |
| 06/22/1994 | EP0603098A1 Magneto-repulsion punching with dynamic damping |
| 06/22/1994 | EP0602610A1 Electrical interconnection system with raised connection means |
| 06/22/1994 | EP0602609A1 Electrical interconnects having a supported bulge configuration |
| 06/22/1994 | EP0602328A2 Wire interconnect structures for connecting an integrated circuit to a substrate |
| 06/22/1994 | EP0602298A1 Process for dissipating heat from a semiconductor package |
| 06/22/1994 | EP0602258A1 Printed circuit with local higher wiring density and conical via holes and method of manufacturing such printed circuits |
| 06/22/1994 | EP0602257A1 Printed circuits with local higher wiring density and method for manufacturing such printed circuits |
| 06/22/1994 | EP0602252A1 Ceramic green sheet |
| 06/21/1994 | US5323209 Apparatus for precision alignment of plates used in two-sided contact printing |
| 06/21/1994 | US5322985 Method for boring small holes in substrate material |
| 06/21/1994 | US5322976 Process for forming polyimide-metal laminates |
| 06/21/1994 | US5322975 Universal carrier supported thin copper line |
| 06/21/1994 | US5322974 Interleaved fine line cables |
| 06/21/1994 | US5322763 Functioning as emulsion build for screen printing; exposing, developing photoresists; electroplating |
| 06/21/1994 | US5322593 Bonding separately formed polyimide layered wiring structures together, removing one base by cutting, forming via holes in exposed polyimide layer |
| 06/21/1994 | US5322565 Method and apparatus for through hole substrate printing |
| 06/21/1994 | US5322204 Electronic substrate multiple location conductor attachment technology |
| 06/21/1994 | US5321886 Applying conductive lines to integrated circuits |
| 06/21/1994 | US5321884 Multilayered flexible circuit package |
| 06/21/1994 | CA1330360C Circuit testers |
| 06/16/1994 | DE4341867A1 Micro-assemblies printed mounting and assembly connectors printing method - involves pressing micro-components against connection areas on substrate to expand connecting material layers on these areas |
| 06/16/1994 | DE4242097A1 EM compatibility protection for hybrid components - is provided by chip capacitor filter on ceramic carrier for suppression of direct irradiation and cable-conducted interference |
| 06/16/1994 | DE4241412A1 SMD components simultaneous removal assembly - has component conveyor arranged in direction of gravity below submerged circuit boards in desoldering bath |
| 06/16/1994 | DE4240996C1 Circuit board assembly with islands of rapid setting fusible adhesive - positioned in adhesive layer before components are positioned for rapid assembly and mounting irrespective of adhesive setting time |
| 06/15/1994 | EP0601900A1 Device for the manual testing of a printed circuit board equipped with surface mount components |
| 06/15/1994 | EP0601621A1 Three dimensional imaging system |
| 06/15/1994 | EP0601375A1 Method for forming electrical interconnections in laminated vias |
| 06/15/1994 | EP0601011A1 Manufacturing method for electrical circuit board |
| 06/15/1994 | EP0600925A1 Component of printed circuit boards. |
| 06/14/1994 | USRE34638 Laminates of polynorbornene and polyolefins derived from C2 -C4 monomers |
| 06/14/1994 | US5321585 Directly solderable auxiliary circuit board assembly and methods of making and using the same |
| 06/14/1994 | US5321583 Electrically conductive interposer and array package concept for interconnecting to a circuit board |
| 06/14/1994 | US5321380 Low profile printed circuit board |
| 06/14/1994 | US5321240 Non-contact IC card |
| 06/14/1994 | US5321210 Dielectric substrate, laminated blocks of alternating wiring layers and polyimide layers bonded to each other, electrical connections of solder pools and metal bumps on facing surfaces |
| 06/14/1994 | US5320919 Copper foil for inner layer circuit of multi-layered printed circuit board, method of producing the same and multi-layered printed circuit board having the same |
| 06/14/1994 | US5320894 Used in electronic equipment; isulating layers are made up of synthetic resin, plurity of via holes provided therein with to connect power interconnections selectively |
| 06/14/1994 | US5320756 Method of treating aqueous alkaline effluents derived from cleaning electronic circuit assemblies |
| 06/14/1994 | US5320737 Treatment to reduce solder plating whisker formation |
| 06/14/1994 | US5320541 Electrical connector having terminals which cooperate with the edge of a circuit board |
| 06/14/1994 | US5320274 Non-oxidizing soldering chamber with shaped curtain and method of soldering |
| 06/14/1994 | US5320273 Gas flow distribution system for molten solder dispensing process |
| 06/14/1994 | US5320272 Tin-bismuth solder connection having improved high temperature properties, and process for forming same |
| 06/14/1994 | US5320271 Splash protector rails for printed wiring boards |
| 06/14/1994 | US5320250 Method for rapid dispensing of minute quantities of viscous material |
| 06/14/1994 | CA1330225C Interface circuit with transient event tolerance |
| 06/14/1994 | CA1330175C Photoimageable compositions |
| 06/14/1994 | CA1330168C Solder composition |
| 06/09/1994 | WO1994013125A1 Process and apparatus for printing a printed circuit board |
| 06/09/1994 | WO1994012957A1 Detection tag |
| 06/09/1994 | WO1994012924A1 A security system and a method |
| 06/09/1994 | WO1994012311A1 Electrical connector |
| 06/09/1994 | DE4402042A1 Microparticle reflow solder and mfg. process - where solid solder is melted in anaerobic fluid forming ribbon of microspheres, and after sepg. off, fluid spheres are encapsulated in organic polymer |
| 06/09/1994 | DE4341598A1 Conductive composite particles useful as conductive filler for sealant compsns., etc. - have electrically conductive core and conductive refractory material conductively welded together with intermediate noble metal |
| 06/09/1994 | DE4340594A1 Electronic surface mount device - has electronic element with exposed flat surface in its upper region for drawing up device with suction nozzle |
| 06/09/1994 | DE4240454A1 Electrical connection for combination instrument - has component contacts inserted through circuit board cooperating with auxiliary contact at rear |
| 06/08/1994 | EP0600787A1 Process for metallising the surface of composite materials having an organic matrix and electronic components thus obtained |
| 06/08/1994 | EP0600590A1 Cooling electronic circuit assemblies |