| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/08/1994 | US5293004 Printed circuit board having an electromagnetic shielding layer |
| 03/08/1994 | US5292624 Method for forming a metallurgical interconnection layer package for a multilayer ceramic substrate |
| 03/08/1994 | US5292618 Photocurable self-retainable gel, shaped article prepared therefrom, applications and preparations thereof |
| 03/08/1994 | US5292574 Ceramic substrate having wiring of silver series |
| 03/08/1994 | US5292559 Laser transfer process |
| 03/08/1994 | US5292557 With copper, treating substrate with stilbene-based fluorescent brightener |
| 03/08/1994 | US5292556 Method for preparing negative-working wash-off relief images |
| 03/08/1994 | US5292548 Substrates used in multilayered integrated circuits and multichips |
| 03/08/1994 | US5292424 Maintaining equal flux density by switching anodes on and off |
| 03/08/1994 | US5292388 Conveyorized vacuum applicator and method therefor |
| 03/08/1994 | US5292055 Gas shrouded wave improvement |
| 03/08/1994 | US5291653 Manufacturing printed wiring boards having electromagnetic wave shielding |
| 03/08/1994 | CA2027025C Method of manufacturing circuit board |
| 03/08/1994 | CA2014947C Process for applying conductive terminations to ceramic components |
| 03/06/1994 | CA2105448A1 Aluminum nitride circuit board and method of producing same |
| 03/03/1994 | WO1994005141A1 Composite molded product having three-dimensional multi-layered conductive circuits and method of its manufacture |
| 03/03/1994 | WO1994005140A1 Method of manufacturing a multilayer printed wire board |
| 03/03/1994 | WO1994005139A1 Process for producing finely structured electroconductive layers |
| 03/03/1994 | WO1994005134A1 Electronic component |
| 03/03/1994 | WO1994004985A1 Method of reducing the surface requirements, on a circuit board, of a power-supply net connecting consumers with the power supply |
| 03/03/1994 | WO1994004718A1 Method and apparatus for photo-forming small shaped metal containing articles from porous precursors and articles fabricated according to the method |
| 03/03/1994 | WO1994004591A1 Solution for coating non conductors with conductive polymers and their metallization process |
| 03/03/1994 | DE4328603A1 Electronic printed circuit component removal device - melts solder connections and exerts extraction force of component with securing device allowing solder removal |
| 03/03/1994 | DE4228805A1 Coating tool for electronic PCB - uses trough contoured to allow coating of specified areas with carton base and attached carton strips |
| 03/03/1994 | DE4228608A1 Electrically conductive adhesive - has plastic base and carrier contg. filing material comprising electrically conductive metal powder particles |
| 03/03/1994 | CA2142856A1 Solution for coating non-conductors with conductive polymers and their metallization process |
| 03/03/1994 | CA2142267A1 Method of manufacturing a multilayer printed wire board |
| 03/02/1994 | EP0585204A1 Process and apparatus for coating platelike products especially printed circuit boards |
| 03/02/1994 | EP0584973A2 Spray gun for substrate coating |
| 03/02/1994 | EP0584780A2 Process for producing printed wiring board |
| 03/02/1994 | EP0584691A1 Binder removal from multilayer ceramic structures |
| 03/02/1994 | EP0584577A1 Surface mounted electrical connector for printed circuit boards |
| 03/02/1994 | EP0584386A1 Printed circuit board and method of producing printed circuit boards |
| 03/02/1994 | EP0584356A1 Method of soldering |
| 03/02/1994 | CN2158164Y Full-automatic corner cutting machine for printed circuit plate |
| 03/02/1994 | CN1083267A Large ceramic article and method of manufacturing |
| 03/02/1994 | CN1023928C Solder post retention means for electric connector |
| 03/01/1994 | US5291375 Printed circuit board and electric device configured to facilitate bonding |
| 03/01/1994 | US5291372 Integral heat sink-terminal member structure of hybrid integrated circuit assembly and method of fabricating hybrid integrated circuit assembly using such structure |
| 03/01/1994 | US5291179 Printed circuit board |
| 03/01/1994 | US5291072 Crosstalk-reduced transmission device |
| 03/01/1994 | US5290986 Thermally assisted shorts removal process for glass ceramic product using an RF field |
| 03/01/1994 | US5290971 Printed circuit board provided with a higher density of terminals for hybrid integrated circuit and method of fabricating the same |
| 03/01/1994 | US5290970 Multilayer printed circuit board rework method and rework pin |
| 03/01/1994 | US5290732 Process for making semiconductor electrode bumps by metal cluster ion deposition and etching |
| 03/01/1994 | US5290662 Quaternized triblock copolymers on backings |
| 03/01/1994 | US5290624 Heat-conductive adhesive films, laminates with heat-conductive adhesive layers and the use thereof |
| 03/01/1994 | US5290608 Masking and curing with heat to form patterns and development |
| 03/01/1994 | US5290597 Partially curing, degreasing, treating with oxidizing agent, applying electroless copper or nickel, curing, applying secondary metal |
| 03/01/1994 | US5290586 Method to monitor Meta-Paete cure on metallized substrates |
| 03/01/1994 | US5290504 Continuous air bearing vapor stabilization system and method |
| 03/01/1994 | US5290423 Electrochemical interconnection |
| 03/01/1994 | US5290396 Trench planarization techniques |
| 03/01/1994 | US5290384 Apparatus for controlled spray etching |
| 03/01/1994 | US5290375 Thick film-forming, firing laminate of alternate ceramic and inner conductor layers; thick film-forming, firing glass insulating layer on top ceramic layer; thick film-forming, firing conductor layer on glass; electrical connections |
| 03/01/1994 | US5289966 Method for connecting electronic component with substrate |
| 03/01/1994 | US5289750 Apparatus for bonding continuous thin film to discrete base plates and film cutting apparatus therefor |
| 03/01/1994 | US5289639 Fluid treatment apparatus and method |
| 03/01/1994 | US5289632 Applying conductive lines to integrated circuits |
| 03/01/1994 | US5289630 Process for fabricating multilayer printed circuits |
| 03/01/1994 | US5289629 Apparatus for joining a conductor track foil to an electrical component |
| 02/28/1994 | CA2101000A1 Air assist for spray gun nozzle |
| 02/24/1994 | DE4227726A1 Laminate press for electric circuit plate, or decorative panel mfr. - has replaceable press sheets fitted to upper and lower press plate with automatic sheet changing device |
| 02/24/1994 | DE4227085A1 Verfahren zur Herstellung fein strukturierter elektrisch leitfähiger Schichten A process for producing finely structured electrically conductive layers |
| 02/23/1994 | EP0583997A1 Topographical selective patterns |
| 02/23/1994 | EP0583719A1 Compositions comprising the 1-chloro-2,2,2-trifluoroethyl difluoromethyl ehter and partially fluorinated alcanols |
| 02/23/1994 | EP0583714A2 Method for preparing high-resolution wash-off images and non-photosensitive elements for use therein |
| 02/23/1994 | EP0583653A1 Cleaning by cavitation in liquefied gas |
| 02/23/1994 | EP0583426A1 Improved process for preparing a nonconductive substrate for electroplating. |
| 02/23/1994 | EP0583407A1 Integrated circuit packages using tapered spring contact leads for direct mounting to circuit boards |
| 02/23/1994 | EP0583292A1 Solder leveller. |
| 02/23/1994 | EP0368943B1 Process and composition for preparing printed circuit through-holes for metallization |
| 02/23/1994 | CN1082806A Ultrasoic welding and electric circuit |
| 02/23/1994 | CN1082725A A method for forming a patterned polyimide coating film on a substrate |
| 02/23/1994 | CN1082541A Fluoro taxols |
| 02/22/1994 | US5288974 Control arrangement for a seat heater |
| 02/22/1994 | US5288959 Device for electrically interconnecting opposed contact arrays |
| 02/22/1994 | US5288952 Multilayer connector |
| 02/22/1994 | US5288951 Copper-based metallizations for hybrid integrated circuits |
| 02/22/1994 | US5288950 Flexible wiring board and method of preparing the same |
| 02/22/1994 | US5288944 Pinned ceramic chip carrier |
| 02/22/1994 | US5288589 Storage stability |
| 02/22/1994 | US5288542 Printed circuit having one dielectric substrate core with electroconductive surface layer covered by sub-composite having rigid dielectric substrate with polyimide layer, thermal properties, miniature electronics |
| 02/22/1994 | US5288541 Method for metallizing through holes in thin film substrates, and resulting devices |
| 02/22/1994 | US5288526 Ventilated curing oven and preheat flash zone system for curing coatings on circuit boards |
| 02/22/1994 | US5288519 Insulation layer for mold; hydrolysis of polyamic acid, degreasing, curing, surface oxidation-reduction of formed polyimide |
| 02/22/1994 | US5288377 Copper surface passivated with phosphate or copper oxide coating upon which resin is deposited |
| 02/22/1994 | US5288332 Flushing, washing, chelation |
| 02/22/1994 | US5288323 Apparatus with a shunt system for processing printed circuit board substrates |
| 02/22/1994 | US5288236 Method and apparatus for replacing electronic components on a printed circuit board |
| 02/22/1994 | US5288235 Electrical interconnects having a supported bulge configuration |
| 02/22/1994 | US5288027 Dispensing method and apparatus including a ribbon nozzle for coating printed circuit boards |
| 02/22/1994 | US5288007 Apparatus and methods for making simultaneous electrical connections |
| 02/22/1994 | US5287806 Apparatus and system for screen printing of solder paste onto printed circuit boards |
| 02/22/1994 | US5287620 Process of producing multiple-layer glass-ceramic circuit board |
| 02/22/1994 | US5287619 Method of manufacture multichip module substrate |
| 02/22/1994 | CA2008284C Multi-layer ceramic substrate with solder dam on connecting pattern |
| 02/17/1994 | WO1994003947A2 Modular panel for making a conductor network, associated connectors, and methods for fabricating such panels |
| 02/17/1994 | WO1994003942A1 Circuit interconnect system |
| 02/17/1994 | WO1994003923A1 Sealed conductive active alloy feedthroughs |