| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 07/20/1994 | EP0606813A2 Process for corrosion free multi-layer metal conductors |
| 07/20/1994 | EP0606645A1 Method for forming via holes in multilayer circuits |
| 07/20/1994 | EP0606402A1 Lamination of a photopolymerizable solder mask layer to a substrate containing holes using an intermediate photopolymerizable liquid layer. |
| 07/20/1994 | EP0606355A1 Method and compositions for diffusion patterning |
| 07/20/1994 | EP0606334A1 Azeotropic compositions of 1,1,1,2,3,4,4,5,5,5-decafluoropentane and trans-1,2-dichloroethylene, cis-1,2-dichloroethylene or 1,1-dichloroethane. |
| 07/20/1994 | EP0606294A1 Structure of an electrotechnical device |
| 07/20/1994 | EP0606216A1 Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias. |
| 07/20/1994 | EP0578816A4 Method of inspecting articles |
| 07/20/1994 | EP0526490B1 Temperature and solvent-resistant ink for the ink-jet printing process |
| 07/20/1994 | CN1089768A Wideband amplifier for TV antenna |
| 07/20/1994 | CN1025508C Copper etch process using haldes |
| 07/19/1994 | US5331513 Method of mounting electronic part on circuit substrate and circuit substrate including electronic parts mounted thereon |
| 07/19/1994 | US5331407 Method and apparatus for detecting a circuit pattern |
| 07/19/1994 | US5331204 Integrated circuit package in which impendance between signal pads and signal lines is matched by reducing the size of a ground plane |
| 07/19/1994 | US5331172 Ionized metal cluster beam systems and methods |
| 07/19/1994 | US5331124 Wireless floating horn switch |
| 07/19/1994 | US5331040 Adhesives for laminating polyimide film to copper foil, flexible circuits |
| 07/19/1994 | US5331029 Resin for bonding polyarylene sulfide and adhesive |
| 07/19/1994 | US5330878 Patterning a printed circuit using computer |
| 07/19/1994 | US5330825 Printed circuit substrate with projected electrode and connection method |
| 07/19/1994 | US5330684 Anisotropic conductive adhesive film |
| 07/19/1994 | US5330613 Electric connection method |
| 07/19/1994 | US5330595 Process of making resin-impregnated material webs |
| 07/19/1994 | US5330582 Using mixture og glycol ether and nonionic surfactants |
| 07/19/1994 | US5330101 Material changeover and anti-skin over system |
| 07/19/1994 | US5330096 Method of wave soldering with unique solder pad configuration |
| 07/19/1994 | US5329696 Method of manufacturing electronic device |
| 07/19/1994 | US5329695 Method of manufacturing a multilayer circuit board |
| 07/19/1994 | CA1330771C Transport apparatus for boards |
| 07/14/1994 | DE4300342A1 Vehicle air-bag control device |
| 07/14/1994 | DE4241657C1 Prodn. of homogeneous gold layer(s) |
| 07/13/1994 | EP0606104A2 Rechargeable type small electric appliance |
| 07/13/1994 | EP0605982A2 Multi-chip module board |
| 07/13/1994 | EP0605967A1 Synchronized process for catalysis of electroless metal plating on plastic |
| 07/13/1994 | EP0605842A1 Arrangement for a vehicle |
| 07/13/1994 | EP0605712A1 Packaging electrical components |
| 07/13/1994 | EP0605689A1 Anisotropic electrical connection. |
| 07/13/1994 | EP0605567A1 Water-soluble formulation for masking and the like, and method utilizing the same |
| 07/13/1994 | EP0605431A1 Contact having a mass of reflowable solderable material thereon |
| 07/13/1994 | EP0478575B1 Preparation of bromo-containing perfluoropolymers having iodine curesites |
| 07/13/1994 | CN2171974Y Double-cylinder circulation printed circuit plate tin-plating trough |
| 07/13/1994 | CN1089423A Printing wiring board |
| 07/13/1994 | CN1089213A Polynorbornene prepreg laminated to conductive surface |
| 07/12/1994 | US5329428 High-density packaging for multiple removable electronics subassemblies |
| 07/12/1994 | US5329424 Busbar holder for securing busbars to a PCB |
| 07/12/1994 | US5329423 Compressive bump-and-socket interconnection scheme for integrated circuits |
| 07/12/1994 | US5329159 Semiconductor device employing an aluminum clad leadframe |
| 07/12/1994 | US5329158 Surface mountable semiconductor device having self loaded solder joints |
| 07/12/1994 | US5329067 Structure for fixing optical cable holding box to printed circuit board |
| 07/12/1994 | US5328974 Reaction of platinum halide with acetylenic compound for addition to silicon hydrogen bonds to add unsaturated group |
| 07/12/1994 | US5328811 Polyaldehyde layer on copper oxide, copper foil and substrate for lithographic images |
| 07/12/1994 | US5328803 Photopolymerizable composition |
| 07/12/1994 | US5328752 Substrate for printed circuit boards using photocurable resin and process for producing the same |
| 07/12/1994 | US5328751 Ceramic circuit board with a curved lead terminal |
| 07/12/1994 | US5328750 Activated ink coating |
| 07/12/1994 | US5328715 Process for making metallized vias in diamond substrates |
| 07/12/1994 | US5328660 Alloy consisting of tin, silver, bismuth and indium; for joining integrated circuit chips to carriers and substrates |
| 07/12/1994 | US5328566 Process for producing inorganic fiber-based prepreg sheet and process for producing insulating laminate |
| 07/12/1994 | US5328561 Water solutions of cupric ion, ammonium hydroxide or ion and chelate compounds |
| 07/12/1994 | US5328534 Composite including an inorganic image and method of transferring such an image |
| 07/12/1994 | US5328522 Solder pastes |
| 07/12/1994 | US5328521 Kinetic solder paste composition |
| 07/12/1994 | US5328520 Solar cell with low resistance linear electrode |
| 07/12/1994 | US5328376 Patterned laminar electrical interconnection |
| 07/12/1994 | US5328087 Thermally and electrically conductive adhesive material and method of bonding with same |
| 07/12/1994 | US5328078 Connection method and connection device for electrical connection of small portions |
| 07/12/1994 | US5327920 Automated apparatus and vapor/immersion cleaning method for soiled parts |
| 07/12/1994 | CA2011397C Method and apparatus for cleaning electronic and other devices |
| 07/07/1994 | WO1994014911A1 Heat-resistant adhesive film for printed board and method of use thereof |
| 07/07/1994 | WO1994014542A1 Process and device for the mechanical separation of metal-containing plastic mixtures and compounds |
| 07/07/1994 | DE4317184C1 Smart card mfr. e.g. for credit, debit esp. telephone card |
| 07/07/1994 | DE4300012A1 Selective lacquer finishing method for SMD-equipped PCB |
| 07/06/1994 | EP0605399A2 Multilayered wiring board and method for manufacturing the same |
| 07/06/1994 | EP0605124A2 Radiation-sensitive resist composition |
| 07/06/1994 | EP0604966A1 Desoldering wick |
| 07/06/1994 | EP0604952A1 Multilayer ceramic parts |
| 07/06/1994 | EP0604893A2 Liquid crystal apparatus |
| 07/06/1994 | EP0604865A1 LCP films having roughened surface and process therefor |
| 07/06/1994 | EP0604823A1 Triazine polymer and use thereof |
| 07/06/1994 | EP0598006A4 Solder plate reflow method for forming a solder bump on a circuit trace. |
| 07/06/1994 | CN1088865A No-clean soldering flux and method using the same |
| 07/05/1994 | US5327013 Solder bumping of integrated circuit die |
| 07/05/1994 | US5327010 IC card having adhesion-preventing sheets |
| 07/05/1994 | US5326937 Grounding structure of a printed wiring board |
| 07/05/1994 | US5326936 Mounting device for mounting an electronic device on a substrate by the surface mounting technology |
| 07/05/1994 | US5326792 Protective coatings for flexibile circuits |
| 07/05/1994 | US5326671 Triazine polymers |
| 07/05/1994 | US5326643 Terminally unsaturated polyimide |
| 07/05/1994 | US5326636 Assembly using electrically conductive cement |
| 07/05/1994 | US5326623 Multilayer circuits with ceramic substrates, patterns bonded with titanium and conductors |
| 07/05/1994 | US5326619 Thermal transfer donor element comprising a substrate having a microstructured surface |
| 07/05/1994 | US5326593 Surface roughening of resin molded articles for metallizing |
| 07/05/1994 | US5326442 Apparatus for the galvanic treatment of articles |
| 07/05/1994 | US5326428 Method for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability |
| 07/05/1994 | US5326412 Method for electrodepositing corrosion barrier on isolated circuitry |
| 07/05/1994 | US5326390 Substituted polysaccharide, hydrogen bonding, inorganic oxide |
| 07/05/1994 | US5326177 Perfected air pad |
| 07/05/1994 | US5326016 Method for removing electrical components from printed circuit boards |
| 07/05/1994 | US5325583 Method for manufacturing printed circuit board |
| 07/05/1994 | CA2049626C Matt film |