Patents for H05K 1 - Printed circuits (98,583) |
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09/30/1992 | EP0506122A2 Power module |
09/30/1992 | EP0506090A2 Semiconductor device with electromagnetic shield |
09/30/1992 | EP0506080A2 Epoxy resin hardener and epoxy resin composition |
09/30/1992 | EP0506062A2 Stripline shielding techniques in low temperature co-fired ceramic |
09/30/1992 | EP0506042A2 Structure for and method of making a terminal plug |
09/30/1992 | EP0505859A1 Electronic package for high density applications |
09/30/1992 | EP0505438A1 Electronic articles containing a fluorinated poly(arylene ether) dielectric |
09/29/1992 | WO1992017820A1 Photodefinable interlevel dielectrics |
09/29/1992 | US5151611 Programmable device for integrated circuits |
09/29/1992 | US5151386 Method of applying metallized contacts to a solar cell |
09/29/1992 | US5151304 Multilayer element with polyimide support, coating, crystallization, washing and conversion of polyimide to polyamide and polyamide to polyimide |
09/29/1992 | US5151300 Multilayer printed wiring boards for printed circuits |
09/29/1992 | US5151299 A laminated film for printed circuits |
09/29/1992 | US5150830 Method of bonding a sheet of metal, such as copper, on an aluminum nitride substrate |
09/29/1992 | CA2105657A1 Photodefinable interlevel dielectrics |
09/28/1992 | WO1992017903A2 Three-dimensional multichip module systems and methods of fabrication |
09/28/1992 | WO1992017901A1 Multichip integrated circuit module and method of fabrication |
09/28/1992 | CA2106873A1 Three-dimensional multichip module systems and methods of fabrication |
09/28/1992 | CA2106872A1 Multichip integrated circuit module and method of fabrication |
09/28/1992 | CA2063121A1 Stripline shielding techniques in low temperature co-fired ceramic |
09/24/1992 | DE4109363A1 Bonding electrical or electronic component to wiring substrate - using electroconductive adhesive for terminals and insulating adhesive for mounting |
09/23/1992 | EP0505307A2 A method for forming sealed co-fired glass ceramic structures |
09/23/1992 | EP0504601A2 Substrate soldering in a reducing atmosphere |
09/23/1992 | EP0504549A2 Multiplex communication control unit |
09/23/1992 | EP0504314A1 Novel bistriazene compounds and polymeric compositions crosslinked therewith. |
09/23/1992 | EP0504288A1 Fluorinated poly(naphthyl ethers) |
09/23/1992 | EP0504265A1 Crosslinkable fluorinated polymer compositions. |
09/22/1992 | US5150088 Stripline shielding techniques in low temperature co-fired ceramic |
09/22/1992 | US5149839 Improved impregnation, solvent resistance, heat resistance and low water absoprtion properties |
09/22/1992 | US5149590 Fluoropolymer filled with ceramic having a coating of fluorinated silane |
09/22/1992 | US5149216 Printer carriage assembly having thermal dissipating means |
09/22/1992 | CA1307857C Printed circuit board having an injection molded substrate |
09/17/1992 | WO1992016096A1 Low temperature co-fired multilayer ceramic circuit boards with silver conductors |
09/17/1992 | WO1992016089A1 Electrical device, in particular a switching or control device for motor vehicles |
09/17/1992 | WO1992016025A1 Integral solid state embedded power supply |
09/17/1992 | WO1992016004A1 Fusible flexible printed circuit and method of making same |
09/17/1992 | WO1992015408A1 Specific microsieve, specific composite body |
09/17/1992 | DE4108667A1 Composite circuit board with metallic base plate - obtd. by fixing a thick layer conductor plate on a metallic base plate using a pressure hardenable silicone adhesive hardened in separate oven process |
09/17/1992 | DE4108155A1 Mfg. two layer circuit board with through contacts - photo-etching copper@ layers with laser cutting of board and soldering for flexible construction |
09/17/1992 | DE4107657A1 Circuit board plug mounting - is provided by pin engagement with through hole contacts in board |
09/16/1992 | EP0504020A1 High frequency transmitter-receiver using multilayer printed circuit technique |
09/16/1992 | EP0503967A1 High density modular power switch drivers |
09/16/1992 | EP0503456A1 Microprocessor controlled apparatus for medium and high voltage voltage switchgear |
09/16/1992 | EP0503089A1 A fine sphere, a spherical spacer for a liquid crystal display element and a liquid crystal display element using the same. |
09/16/1992 | EP0502953A1 Quaternary ammonium polyarylamides. |
09/15/1992 | US5148355 Method for making printed circuits |
09/15/1992 | US5148354 Connector for use with a printed circuit board |
09/15/1992 | US5147985 Sheet batteries as substrate for electronic circuit |
09/15/1992 | US5147692 Electroless plating of nickel onto surfaces such as copper or fused tungston |
09/15/1992 | US5147519 Sacraficial substrate |
09/15/1992 | US5147484 During burnout of binder |
09/15/1992 | US5147482 Coating with thermoplastic resin |
09/15/1992 | US5147210 Polymer film interconnect |
09/15/1992 | US5147209 Intermediary adapter-connector |
09/15/1992 | US5147208 Flexible printed circuit with raised contacts |
09/15/1992 | CA1307453C Metal foil covered laminate |
09/10/1992 | DE4107620A1 Elektrisches geraet, insbesondere schalt- oder steuergeraet fuer kraftfahrzeuge Geraet Electrical, particularly switchable or Steuergeraet for motor vehicles |
09/10/1992 | DE4107429A1 Cross-bar distributor consisting of PCB printed on both sides - with self-crossing respectively parallel running conducting paths and each crossing place has recess in path with electrically isolated island |
09/10/1992 | DE4107312A1 Mounting system for power semiconductor device - has heat conductive coupling between heat conductive layer beneath semiconductor device and insulating layer supporting circuit board |
09/09/1992 | EP0502804A2 Structures for electrically conductive decals filled with organic insulator material |
09/09/1992 | EP0502632A1 Process for producing a patterned metal surface |
09/09/1992 | EP0502614A2 Thin film circuit substrate and processes for its manufacture |
09/09/1992 | EP0502358A1 Composition of polyarylene sulphides, melamine resins and rubbers |
09/09/1992 | EP0502345A1 Polyarylene sulfide with improved flash and good mechanical properties |
09/09/1992 | EP0502190A1 Composite metal plate |
09/09/1992 | CN1064368A Composite electric part of stacked multi-layer structure |
09/08/1992 | US5146313 Metallized ceramic structure comprising aluminum nitride and tungsten layers |
09/08/1992 | US5145936 Fluorinated poly (naphthyl ether) |
09/08/1992 | US5145895 Blends of modified polyarylene sulfides and polycarbonates |
09/08/1992 | US5145618 Passing sandwich of support substrate and pliable foil with polymerizable liquid between rolls, separating solid polymer sheet |
09/08/1992 | US5145553 Method of making a flexible circuit member |
09/08/1992 | US5145540 Finely dispersed, sinterable alumina, silica, magnesia, and glass; multilayer housings for microelectronics |
09/08/1992 | US5145104 Substrate soldering in a reducing atmosphere |
09/08/1992 | CA2061490A1 Process for producing a patterned metal surface |
09/03/1992 | WO1992015187A1 Stiffening element |
09/03/1992 | DE4205742A1 Holding tongs for winding EM core - have cooperating tong plates providing guidance for conductor wire wound onto core |
09/02/1992 | EP0501749A1 Electrostatic discharge protection device |
09/02/1992 | EP0501171A2 Contact apparatus for manufacturing a pressed contact connection |
09/02/1992 | EP0501095A1 Process for metallising metal containing dielectric surfaces |
09/02/1992 | EP0500988A1 Hearing aid to be worn on the head |
09/02/1992 | CN1064088A Curable polyphenylene ether resin composition and cured resin composition obtainable therefrom |
09/02/1992 | CA2062049A1 Electrostatic discharge protection device for a printed circuit board |
09/02/1992 | CA2061297A1 Method for metallizing dielectric surfaces containing a metal |
09/01/1992 | US5144586 Apparatus and method for connecting electronic modules containing integrated circuits and backup batteries |
09/01/1992 | US5144548 Routing switcher |
09/01/1992 | US5144536 Electronic circuit substrate |
09/01/1992 | US5144535 Method of mounting electrical and/or electronic components of a printed circuit board |
09/01/1992 | US5144534 Method for manufacturing rigid-flexible circuit boards and products thereof |
09/01/1992 | US5144532 Circuit board assembly |
09/01/1992 | US5144526 Low temperature co-fired ceramic structure containing buried capacitors |
09/01/1992 | US5144104 Miniature switch device with tactile effect |
09/01/1992 | US5143277 Method for the mounting of miniature electronic beam lead components |
08/27/1992 | DE4113606C1 PCB functional control and monitoring system - feeds test signal to additional thin conductor track formed between PCB connectors as control loop |
08/26/1992 | WO1992015117A1 Wiring board |
08/26/1992 | EP0500189A1 Device for connecting the connection pins of an integrated circuit mounted in a dual-in-line (DIL) package to printed circuitry on a printed circuit board in n different ways |
08/26/1992 | EP0500093A1 Ceramic composite material and process for producing the same |
08/26/1992 | EP0499986A2 Multilayer wiring structure and method for forming multilayer construction |
08/26/1992 | EP0499748A1 TAB tape |
08/26/1992 | EP0264454B1 Method for correcting curl and improving dimensional stability of flexible metal foil laminated plate |
08/25/1992 | US5142448 Method for manufacturing rigid-flexible multilayer circuit boards and products thereof |