Patents for H05K 1 - Printed circuits (98,583)
09/1992
09/30/1992EP0506122A2 Power module
09/30/1992EP0506090A2 Semiconductor device with electromagnetic shield
09/30/1992EP0506080A2 Epoxy resin hardener and epoxy resin composition
09/30/1992EP0506062A2 Stripline shielding techniques in low temperature co-fired ceramic
09/30/1992EP0506042A2 Structure for and method of making a terminal plug
09/30/1992EP0505859A1 Electronic package for high density applications
09/30/1992EP0505438A1 Electronic articles containing a fluorinated poly(arylene ether) dielectric
09/29/1992WO1992017820A1 Photodefinable interlevel dielectrics
09/29/1992US5151611 Programmable device for integrated circuits
09/29/1992US5151386 Method of applying metallized contacts to a solar cell
09/29/1992US5151304 Multilayer element with polyimide support, coating, crystallization, washing and conversion of polyimide to polyamide and polyamide to polyimide
09/29/1992US5151300 Multilayer printed wiring boards for printed circuits
09/29/1992US5151299 A laminated film for printed circuits
09/29/1992US5150830 Method of bonding a sheet of metal, such as copper, on an aluminum nitride substrate
09/29/1992CA2105657A1 Photodefinable interlevel dielectrics
09/28/1992WO1992017903A2 Three-dimensional multichip module systems and methods of fabrication
09/28/1992WO1992017901A1 Multichip integrated circuit module and method of fabrication
09/28/1992CA2106873A1 Three-dimensional multichip module systems and methods of fabrication
09/28/1992CA2106872A1 Multichip integrated circuit module and method of fabrication
09/28/1992CA2063121A1 Stripline shielding techniques in low temperature co-fired ceramic
09/24/1992DE4109363A1 Bonding electrical or electronic component to wiring substrate - using electroconductive adhesive for terminals and insulating adhesive for mounting
09/23/1992EP0505307A2 A method for forming sealed co-fired glass ceramic structures
09/23/1992EP0504601A2 Substrate soldering in a reducing atmosphere
09/23/1992EP0504549A2 Multiplex communication control unit
09/23/1992EP0504314A1 Novel bistriazene compounds and polymeric compositions crosslinked therewith.
09/23/1992EP0504288A1 Fluorinated poly(naphthyl ethers)
09/23/1992EP0504265A1 Crosslinkable fluorinated polymer compositions.
09/22/1992US5150088 Stripline shielding techniques in low temperature co-fired ceramic
09/22/1992US5149839 Improved impregnation, solvent resistance, heat resistance and low water absoprtion properties
09/22/1992US5149590 Fluoropolymer filled with ceramic having a coating of fluorinated silane
09/22/1992US5149216 Printer carriage assembly having thermal dissipating means
09/22/1992CA1307857C Printed circuit board having an injection molded substrate
09/17/1992WO1992016096A1 Low temperature co-fired multilayer ceramic circuit boards with silver conductors
09/17/1992WO1992016089A1 Electrical device, in particular a switching or control device for motor vehicles
09/17/1992WO1992016025A1 Integral solid state embedded power supply
09/17/1992WO1992016004A1 Fusible flexible printed circuit and method of making same
09/17/1992WO1992015408A1 Specific microsieve, specific composite body
09/17/1992DE4108667A1 Composite circuit board with metallic base plate - obtd. by fixing a thick layer conductor plate on a metallic base plate using a pressure hardenable silicone adhesive hardened in separate oven process
09/17/1992DE4108155A1 Mfg. two layer circuit board with through contacts - photo-etching copper@ layers with laser cutting of board and soldering for flexible construction
09/17/1992DE4107657A1 Circuit board plug mounting - is provided by pin engagement with through hole contacts in board
09/16/1992EP0504020A1 High frequency transmitter-receiver using multilayer printed circuit technique
09/16/1992EP0503967A1 High density modular power switch drivers
09/16/1992EP0503456A1 Microprocessor controlled apparatus for medium and high voltage voltage switchgear
09/16/1992EP0503089A1 A fine sphere, a spherical spacer for a liquid crystal display element and a liquid crystal display element using the same.
09/16/1992EP0502953A1 Quaternary ammonium polyarylamides.
09/15/1992US5148355 Method for making printed circuits
09/15/1992US5148354 Connector for use with a printed circuit board
09/15/1992US5147985 Sheet batteries as substrate for electronic circuit
09/15/1992US5147692 Electroless plating of nickel onto surfaces such as copper or fused tungston
09/15/1992US5147519 Sacraficial substrate
09/15/1992US5147484 During burnout of binder
09/15/1992US5147482 Coating with thermoplastic resin
09/15/1992US5147210 Polymer film interconnect
09/15/1992US5147209 Intermediary adapter-connector
09/15/1992US5147208 Flexible printed circuit with raised contacts
09/15/1992CA1307453C Metal foil covered laminate
09/10/1992DE4107620A1 Elektrisches geraet, insbesondere schalt- oder steuergeraet fuer kraftfahrzeuge Geraet Electrical, particularly switchable or Steuergeraet for motor vehicles
09/10/1992DE4107429A1 Cross-bar distributor consisting of PCB printed on both sides - with self-crossing respectively parallel running conducting paths and each crossing place has recess in path with electrically isolated island
09/10/1992DE4107312A1 Mounting system for power semiconductor device - has heat conductive coupling between heat conductive layer beneath semiconductor device and insulating layer supporting circuit board
09/09/1992EP0502804A2 Structures for electrically conductive decals filled with organic insulator material
09/09/1992EP0502632A1 Process for producing a patterned metal surface
09/09/1992EP0502614A2 Thin film circuit substrate and processes for its manufacture
09/09/1992EP0502358A1 Composition of polyarylene sulphides, melamine resins and rubbers
09/09/1992EP0502345A1 Polyarylene sulfide with improved flash and good mechanical properties
09/09/1992EP0502190A1 Composite metal plate
09/09/1992CN1064368A Composite electric part of stacked multi-layer structure
09/08/1992US5146313 Metallized ceramic structure comprising aluminum nitride and tungsten layers
09/08/1992US5145936 Fluorinated poly (naphthyl ether)
09/08/1992US5145895 Blends of modified polyarylene sulfides and polycarbonates
09/08/1992US5145618 Passing sandwich of support substrate and pliable foil with polymerizable liquid between rolls, separating solid polymer sheet
09/08/1992US5145553 Method of making a flexible circuit member
09/08/1992US5145540 Finely dispersed, sinterable alumina, silica, magnesia, and glass; multilayer housings for microelectronics
09/08/1992US5145104 Substrate soldering in a reducing atmosphere
09/08/1992CA2061490A1 Process for producing a patterned metal surface
09/03/1992WO1992015187A1 Stiffening element
09/03/1992DE4205742A1 Holding tongs for winding EM core - have cooperating tong plates providing guidance for conductor wire wound onto core
09/02/1992EP0501749A1 Electrostatic discharge protection device
09/02/1992EP0501171A2 Contact apparatus for manufacturing a pressed contact connection
09/02/1992EP0501095A1 Process for metallising metal containing dielectric surfaces
09/02/1992EP0500988A1 Hearing aid to be worn on the head
09/02/1992CN1064088A Curable polyphenylene ether resin composition and cured resin composition obtainable therefrom
09/02/1992CA2062049A1 Electrostatic discharge protection device for a printed circuit board
09/02/1992CA2061297A1 Method for metallizing dielectric surfaces containing a metal
09/01/1992US5144586 Apparatus and method for connecting electronic modules containing integrated circuits and backup batteries
09/01/1992US5144548 Routing switcher
09/01/1992US5144536 Electronic circuit substrate
09/01/1992US5144535 Method of mounting electrical and/or electronic components of a printed circuit board
09/01/1992US5144534 Method for manufacturing rigid-flexible circuit boards and products thereof
09/01/1992US5144532 Circuit board assembly
09/01/1992US5144526 Low temperature co-fired ceramic structure containing buried capacitors
09/01/1992US5144104 Miniature switch device with tactile effect
09/01/1992US5143277 Method for the mounting of miniature electronic beam lead components
08/1992
08/27/1992DE4113606C1 PCB functional control and monitoring system - feeds test signal to additional thin conductor track formed between PCB connectors as control loop
08/26/1992WO1992015117A1 Wiring board
08/26/1992EP0500189A1 Device for connecting the connection pins of an integrated circuit mounted in a dual-in-line (DIL) package to printed circuitry on a printed circuit board in n different ways
08/26/1992EP0500093A1 Ceramic composite material and process for producing the same
08/26/1992EP0499986A2 Multilayer wiring structure and method for forming multilayer construction
08/26/1992EP0499748A1 TAB tape
08/26/1992EP0264454B1 Method for correcting curl and improving dimensional stability of flexible metal foil laminated plate
08/25/1992US5142448 Method for manufacturing rigid-flexible multilayer circuit boards and products thereof