| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 12/22/1992 | US5173359 Composite material for electrical applications reinforced by para-oriented aramide fibrous substance and process for preparing same |
| 12/22/1992 | US5173354 Non-beading, thin-film, metal-coated ceramic substrate |
| 12/22/1992 | US5173331 Forming a dielectric composite containing conductor parts; for packaging of integrated circuits |
| 12/22/1992 | US5173330 Patterning composition and method for patterning on a substrate |
| 12/22/1992 | US5173162 Multi-layered electrostrictive effect element |
| 12/22/1992 | US5173150 Process for producing printed circuit board |
| 12/22/1992 | US5172852 Soldering method |
| 12/22/1992 | US5172755 Cooling apparatus for a heat generating device |
| 12/22/1992 | US5172472 Multi-layer rigid prototype printed circuit board fabrication method |
| 12/22/1992 | US5172471 Method of providing power to an integrated circuit |
| 12/22/1992 | CA2071703A1 Signal routing technique for high frequency electronic systems |
| 12/22/1992 | CA1311856C Multiple integrated circuit interconnection arrangement |
| 12/22/1992 | CA1311854C Apparatus and method for high density interconnection substrates using stacked modules |
| 12/22/1992 | CA1311816C Contact member for electrical conductors |
| 12/20/1992 | CA2071154A1 Surface roughening of resin molded articles for metallizing |
| 12/18/1992 | CA2066069A1 Method for making multilayer electronic circuits |
| 12/17/1992 | DE4119526A1 HV meandering electrode system for electrostatic holding plates - has tracks formed on board with outer tracks receiving HV to cause electrostatic discharge |
| 12/17/1992 | DE4119427A1 Compact circuit board for computer - has main board with pair of parallel slots to receive connectors for pair of expansion board connectors coupled to main board pins |
| 12/16/1992 | EP0518701A2 Field programmable circuit module |
| 12/16/1992 | EP0518422A2 Method of selectively metallizing a pattern of a material other than glass on a glass substrate by electroless metallization |
| 12/16/1992 | EP0518390A2 Jack and test plug |
| 12/16/1992 | EP0518317A1 Surface roughening of resin molded articles for metallizing |
| 12/16/1992 | EP0518005A2 Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates |
| 12/16/1992 | CN1067138A Electronic detail mounting module |
| 12/16/1992 | CN1019537B Multi-layer printed circuit boards |
| 12/15/1992 | US5172311 Electrical amplifier for controlling valves |
| 12/15/1992 | US5172304 Capacitor-containing wiring board and method of manufacturing the same |
| 12/15/1992 | US5172301 Heatsink for board-mounted semiconductor devices and semiconductor device assembly employing same |
| 12/15/1992 | US5171826 Heat resistant adhesive composition and bonding method using the same |
| 12/15/1992 | US5171642 Multilayered intermetallic connection for semiconductor devices |
| 12/15/1992 | US5171417 Copper foils for printed circuit board applications and procedures and electrolyte bath solutions for electrodepositing the same |
| 12/15/1992 | US5170931 Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate |
| 12/15/1992 | US5170544 Method of producing electrical resonant circuits, specifically resonance labels |
| 12/15/1992 | CA2071153A1 Surface roughening of resin molded articles for metallizing |
| 12/10/1992 | WO1992022192A1 Method of manufacturing a multilayer printed wire board |
| 12/10/1992 | WO1992022191A1 Printed wire boards and method of making same |
| 12/10/1992 | WO1992022090A1 Thermally conductive electronic assembly |
| 12/10/1992 | WO1992020073A3 Conductive polymer compositions |
| 12/10/1992 | WO1992017903A3 Three-dimensional multichip module systems and methods of fabrication |
| 12/10/1992 | DE4118935A1 Elektrisches geraet mit wenigstens einem kontaktstift und einer leiterbahnfolie Electric geraet with at least one contact pin and a conductor track foil |
| 12/10/1992 | DE4118398A1 Electronic assembly with circuit board in metallic housing e.g. for satellite - cools by conduction into metallic core without insulation under chip and against heat sink |
| 12/10/1992 | DE4118397A1 Metal-cored circuit board carrying integrated circuit chip e.g. for satellite - cools by conduction into core from underside of chip mounted in hole through insulating layer |
| 12/10/1992 | DE4118308A1 Circuit board structure with surface mounted devices - has main and auxiliary boards adhered together via electrically insulating adhesive |
| 12/10/1992 | CA2110679A1 Method of manufacturing a multilayer printed wire board |
| 12/10/1992 | CA2110678A1 Printed wire boards and method of making same |
| 12/09/1992 | EP0517560A2 Method of manufacturing a superconducting microwave component substrate |
| 12/09/1992 | EP0517337A2 Epoxy resin composition for electrical laminates |
| 12/09/1992 | EP0517306A2 Heat actuated fuse apparatus with solder link |
| 12/09/1992 | EP0517264A1 Electronic circuits and their fabrication |
| 12/09/1992 | EP0517005A2 Thin film head with coils of varying thickness |
| 12/09/1992 | EP0516819A1 Direct bonding of copper to aluminum nitride substrates. |
| 12/09/1992 | EP0213205B1 Method of stacking printed circuit boards |
| 12/09/1992 | CN1019369B Process and apparatus for producing copper-coated laminate |
| 12/08/1992 | US5170330 Circuit board structure for at least two different component types |
| 12/08/1992 | US5170326 Electronic module assembly |
| 12/08/1992 | US5170245 Semiconductor device having metallic interconnects formed by grit blasting |
| 12/08/1992 | US5170032 Radiation manufacturing apparatus and amendment |
| 12/08/1992 | US5169679 Printing patterns of high and low resistance materials on insulating substrate; adding copper-rich layer; overlapping; firing |
| 12/08/1992 | US5169493 Method of manufacturing a thick film resistor element |
| 12/08/1992 | US5169471 Auto electrical connecting circuit board assembly |
| 12/08/1992 | US5168624 Method of manufacturing printed wiring board |
| 12/08/1992 | CA2070618A1 Epoxy resin composition for electrical laminates |
| 12/02/1992 | EP0516579A1 Interface connection through an insulating part |
| 12/02/1992 | EP0516402A1 Substrate provided with electric lines and its manufacturing method |
| 12/02/1992 | EP0516237A1 Modified bisimide compositions |
| 12/02/1992 | EP0516170A2 Semiconductor chip mounted circuit board assembly and method for manufacturing the same |
| 12/02/1992 | EP0516149A1 Electronic device |
| 12/02/1992 | EP0515824A2 Capacitor element |
| 12/02/1992 | EP0515680A1 Epoxy resin-impregnated prepreg |
| 12/02/1992 | EP0515383A1 Thick-film hybrid unit with a plug connection |
| 12/01/1992 | WO1992021640A1 A method for preparing aryl ketones |
| 12/01/1992 | US5168430 Flexible printed circuit connecting means for at least one hybrid circuit structure and a printed circuit board |
| 12/01/1992 | US5168384 Miniature liquid crystal display device |
| 12/01/1992 | US5168006 Woven fabric for fiber-reinforced thermoplastic resin laminate |
| 12/01/1992 | US5167997 Protected conductive foil assemblage and procedure for preparing same using static electrical forces |
| 12/01/1992 | US5167985 Process for producing flexible printed circuit board |
| 12/01/1992 | US5167913 Sintering without forming metal oxide |
| 12/01/1992 | US5167869 Gold conductor composition for forming conductor patterns on ceramic based substrates |
| 12/01/1992 | US5167723 Thermocouple with overlapped dissimilar conductors |
| 12/01/1992 | US5167512 Multi-chip module connector element and system |
| 12/01/1992 | US5167511 High density interconnect apparatus |
| 12/01/1992 | CA2087711A1 Method for preparing aryl ketones |
| 12/01/1992 | CA2062641A1 Capacitor element |
| 12/01/1992 | CA2007166C Low profile chip carrier socket |
| 11/26/1992 | WO1992021223A1 Heat sink and electromagnetic interference shield assembly |
| 11/26/1992 | WO1992020637A1 Ceramic board having glaze, manufacturing method therefor, and electronic device using the ceramic board |
| 11/26/1992 | WO1992020489A1 Methods and systems of preparing extended length flexible harnesses |
| 11/25/1992 | EP0515061A1 Process of producing aluminum nitride multiple-layer circuit board |
| 11/25/1992 | EP0515037A1 Fuse |
| 11/25/1992 | EP0514873A1 Heater type hybrid integrated circuit |
| 11/25/1992 | EP0514723A1 Electronic parts loaded module |
| 11/25/1992 | EP0514708A1 Safety guard for circuit components and/or data in an electrotechnical apparatus |
| 11/25/1992 | EP0514557A1 Coating solution for forming transparent electrically conductive film, method of preparation thereof, electrically conductive substrate, method of preparation thereof, and display device having transparent electrically conductive substrate |
| 11/24/1992 | US5166867 Bus bar for a circuit board |
| 11/24/1992 | US5166865 Compliancy tolerant pattern for circuit carrying substrate |
| 11/24/1992 | US5166864 Protected circuit card assembly and process |
| 11/24/1992 | US5166775 Air manifold for cooling electronic devices |
| 11/24/1992 | US5166609 Adapter and test fixture for an integrated circuit device package |
| 11/24/1992 | US5166570 Electronic component |
| 11/24/1992 | US5166308 Condensation of tetracarboxylic acid and aromatic diamine, mixing, casting and extrusion with heating |