| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 06/22/1993 | US5222014 Three-dimensional multi-chip pad array carrier |
| 06/22/1993 | US5221729 Polyester which exhibits melt anisotropy |
| 06/22/1993 | US5221662 Superconducting screen printing ink and process for producing a thick superconducting film using this ink |
| 06/22/1993 | US5221639 Method of fabricating resistive conductive patterns on aluminum nitride substrates |
| 06/22/1993 | US5221399 Joining of printed wiring board to aluminum stiffener using adhesive film, electrically insulative mesh structure that cures at room temperature |
| 06/22/1993 | US5220724 Warming an adhesive containing conductive particles from solid phase to liquid phase, applying it to substrate, cooling back, warming both adhesive and substrate, takyfying, mounting the substrate, cooling back again; stamping or sceen printing |
| 06/22/1993 | CA1319430C Flexible printed circuit, especially for electronic cards, and card incorporating such a circuit |
| 06/16/1993 | EP0546997A1 Radiation-sensitive polymer |
| 06/16/1993 | EP0546560A1 Thick film copper paste composition |
| 06/16/1993 | EP0546497A2 Thermoplastic resin composition |
| 06/16/1993 | EP0546367A1 Method for the plasma treatment of a surface of a workpiece, vacuum treatment installation for carrying out same and use of the method or installation and lacquered, previously plasma treated plastic article. |
| 06/16/1993 | EP0546285A1 Electronic package assembly with protective encapsulant material |
| 06/16/1993 | EP0546133A1 A method for preparing aryl ketones. |
| 06/16/1993 | CN1073316A Two-layer or multilayer printer circuit board method of manufacturing such a printed circuit board, and laminate for the manufacture of such a printed circuit board by such a method |
| 06/16/1993 | CN1073304A High frequency patch cord data connector |
| 06/15/1993 | US5220628 Circuit board assembly |
| 06/15/1993 | US5220491 High packing density module board and electronic device having such module board |
| 06/15/1993 | US5220490 Substrate interconnect allowing personalization using spot surface links |
| 06/15/1993 | US5220489 Multicomponent integrated circuit package |
| 06/15/1993 | US5220488 Injection molded printed circuits |
| 06/15/1993 | US5220487 Electronic package with enhanced heat sinking |
| 06/15/1993 | US5220200 Provision of substrate pillars to maintain chip standoff |
| 06/15/1993 | US5220197 Single inline packaged solid state relay with high current density capability |
| 06/15/1993 | US5220135 Printed wiring board having shielding layer |
| 06/15/1993 | US5219977 Low water absorption, low expansion, high modulus, for flexible printed circuits |
| 06/15/1993 | US5219940 Styrene polymer composition |
| 06/15/1993 | US5219908 Pas with reduced flash formation and good mechanical properties |
| 06/15/1993 | US5219803 Mixing inorganic colorant with pure aluminum nitride powder, sintering |
| 06/15/1993 | US5219640 Flexible circuit having flexing section of reduced stiffness, and method of manufacture thereof |
| 06/15/1993 | US5219639 Multilayer structure and its fabrication method |
| 06/15/1993 | US5219607 Method of manufacturing printed circuit board |
| 06/15/1993 | US5219293 Connection structure of circuit boards having electronic parts thereon and flexible cable for coupling the circuit boards and connection method using the same |
| 06/15/1993 | US5219292 Printed circuit board interconnection |
| 06/15/1993 | CA1319205C2 Modular integrated circuit device |
| 06/15/1993 | CA1319204C2 Universal integrated circuit module |
| 06/15/1993 | CA1319203C2 Method of building a variety of complex integrated circuits from standardizable components |
| 06/15/1993 | CA1319202C2 Method of testing integrated circuit device |
| 06/11/1993 | CA2084856A1 Radiation-sensitive polymers |
| 06/10/1993 | WO1993011654A1 Electronic module assembly |
| 06/10/1993 | WO1993011587A1 High frequency patch cord data connector |
| 06/10/1993 | WO1993011176A1 Phosphorous containing resin |
| 06/10/1993 | CA2124465A1 Phosphorus containing resin |
| 06/09/1993 | EP0545910A2 Laminated foil for making high-frequency field interfering elements |
| 06/09/1993 | EP0545166A1 Automotive glass thick film conductor paste |
| 06/09/1993 | EP0544915A1 Package structure of semiconductor device and manufacturing method therefor |
| 06/09/1993 | EP0448614B1 Method of optimizing a conductor-path layout for the printing head of an ink printing device, and a conductor-path layout for such a printing head |
| 06/09/1993 | EP0357612B1 Electrical switching and control apparatus |
| 06/09/1993 | DE4139957A1 PCB preventing reverse polarity mounting of components - has hole pattern having one hole with different form from other for use in manual assembling of components |
| 06/09/1993 | CN1072940A Automotive class thick film comductor paste |
| 06/08/1993 | US5218335 Electronic circuit device having thin film resistor and method for producing the same |
| 06/08/1993 | US5218172 Metallized frame which interconnects etched wirings for integrated circuits |
| 06/08/1993 | US5218034 Polyimide film with tin or tin salt incorporation resulting in improved adhesion |
| 06/08/1993 | US5217849 Plating copper layers onto both surfaces of polyimide film, then forming photoresist layers on both sides, masking, exposure, development, baking, etching |
| 06/08/1993 | US5217828 Flexible thin film cell including packaging material |
| 06/08/1993 | US5217809 Block polymers of polybenzoxazole, polybenzothiazole and polybenzimidazole |
| 06/08/1993 | US5217796 Woven material of inorganic fiber and process for making the same |
| 06/08/1993 | US5217599 Using bismaleimide |
| 06/08/1993 | US5217566 Depositing a glass passivation layer over a silicon wafer while heating, densification and polishing to smooth without reflowing glass |
| 06/08/1993 | US5217383 Plug contact arrangement |
| 06/08/1993 | US5217216 HTCC/LTCC substrate blanker/multi-layer collation die |
| 06/03/1993 | DE4240224A1 New polyamide-polyamic acid block copolymers or flexible laminates - based on bi:phenyl-3,3,4,4-tetra:carboxylic acid di:anhydride and para-phenylenediamine |
| 06/03/1993 | DE4239982A1 Ribbon cable for telecommunications, computer and auto equipment - has flake graphite conductors in thermoplastic tape, reinforced by metal or fibre mesh giving lightweight non-corrosive assembly |
| 06/03/1993 | DE4208604A1 Ceramic connector material for electric circuit substrate - has copper layer with coating of aluminium oxide ceramic layer and aluminium nitride ceramic layer |
| 06/03/1993 | DE4202525C1 Multilayer rear wall bus plate for microprocessor module - has several current rails associated with respective potential planes coupled to current rail connection rows |
| 06/02/1993 | EP0544618A1 Highly filled epoxy casting resin masses |
| 06/02/1993 | EP0544398A1 An apparatus for laser processing of composite structures |
| 06/02/1993 | EP0544246A1 Heat sealable coextruded LCP film |
| 06/02/1993 | EP0543979A1 A device comprising laminated conductive patterns and easily selectable dielectrics. |
| 06/02/1993 | EP0543977A1 A device with flexible, stripline conductors and a method of manufacturing such a device. |
| 06/02/1993 | EP0543974A1 A circuit board having a lateral conductive pattern and shielded regions as well as a method of manufacturing such a board. |
| 06/01/1993 | US5216581 Electronic module assembly and method of forming same |
| 06/01/1993 | US5216207 Low temperature co-fired multilayer ceramic circuit boards with silver conductors |
| 06/01/1993 | US5215866 Depositing layers of titanium, platinum and electroplated gold on insulating substrate in spiral path, forming resistive links to connect adjacent turns of spiral |
| 06/01/1993 | US5215646 Low profile copper foil and process and apparatus for making bondable metal foils |
| 06/01/1993 | US5215645 Electrodeposited foil with controlled properties for printed circuit board applications and procedures and electrolyte bath solutions for preparing the same |
| 06/01/1993 | US5215610 Method for fabricating superconductor packages |
| 06/01/1993 | US5214991 Punching apparatus |
| 06/01/1993 | US5214844 Method of assembling integrated circuits to a silicon board |
| 06/01/1993 | CA1318746C Stable solutions of prepolymers of thiodi(phenylcyanate) |
| 06/01/1993 | CA1318476C Biaxially-stretched film made of poly(arylene sulfide)-based resin composition and production process thereof |
| 05/27/1993 | WO1993010560A1 High-voltage insulating disk |
| 05/27/1993 | CA2123574A1 High voltage insulating disk |
| 05/26/1993 | EP0543565A1 High speed electrical signal interconnect structure |
| 05/26/1993 | EP0543121A2 Method of manufacturing a metal/ceramic substrate with an interface region |
| 05/26/1993 | EP0543033A1 A connecting arrangement for providing a releasable connection between two striplines |
| 05/26/1993 | EP0527156A4 Highly conductive polymer thick film compositions |
| 05/26/1993 | EP0294478B1 Improved grinding guide and method |
| 05/26/1993 | CN1072364A Jig for detecting height of wavy solder surface, method of controlling height of solder suface |
| 05/25/1993 | US5214571 Multilayer printed circuit and associated multilayer material |
| 05/25/1993 | US5214570 Compact memory module |
| 05/25/1993 | US5214309 Thermally conductive bar cooling arrangement for a transistor |
| 05/25/1993 | US5214308 Substrate for packaging a semiconductor device |
| 05/25/1993 | US5214000 Thermal transfer posts for high density multichip substrates and formation method |
| 05/25/1993 | US5213886 Curable dielectric polyphenylene ether-polyepoxide compositions |
| 05/25/1993 | US5213878 Hollow thin walled refractory, ceramic bubbles distributed in matrix |
| 05/25/1993 | US5213876 Flexible circuit card with laser-contoured VIAs and machined capacitors |
| 05/25/1993 | US5213715 Globules of resin containing metal particles dispersed in second resin, becomes conductive upon compression |
| 05/25/1993 | US5213511 Dimple interconnect for flat cables and printed wiring boards |
| 05/25/1993 | CA1318388C I/o relay interface module |
| 05/23/1993 | CA2081141A1 Pulsed current resistive heating for bonding temperature critical components |