| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 05/19/1993 | EP0542533A1 Semiconductor chip carrier capable of stably mounting a semiconductor chip |
| 05/19/1993 | EP0541937A1 Process for high temperature sintering of a resistor material based on ruthenium oxide or compounds thereof |
| 05/19/1993 | EP0541914A1 Recessed chip capacitor wells with cleaning channels on integrated circuit packages |
| 05/19/1993 | EP0305539B1 Fiber-reinforced heat-resistant polyolefin composition |
| 05/19/1993 | DE4228523A1 Symbol printing process for circuit boards - uses ink jet print head to provide component symbols at specific board locations |
| 05/19/1993 | DE4137709A1 Universal circuit board for bread boarding - has matrix of component connecting elements spaced at different intervals for connecting wide range of components. |
| 05/19/1993 | DE4137339A1 Contact between circuit board and variable distance component, e.g. telephone electroacoustic transducer - has plug-socket connector flow-soldered onto segments of circuit board, with electric contact made via wire bridges |
| 05/19/1993 | CN2134033Y High heat elimination printed circuit board |
| 05/19/1993 | CN1020766C Preparation method of thin copper-clad invar sheets |
| 05/18/1993 | US5212576 Insulating material with coefficient linear expansion matching that of one substrate over connection between two conductive patterns |
| 05/18/1993 | US5212279 Hot-melt adhesive and its use in polyimide film and printed circuit board |
| 05/18/1993 | US5212259 Printed circuits |
| 05/18/1993 | US5212244 Thermosetting resin composition, and prepreg and laminated sheet which use the same |
| 05/18/1993 | US5212121 Raw batches for ceramic substrates, substrates produced from the raw batches, and production process of the substrates |
| 05/18/1993 | US5211803 Producing metal patterns on a plastic surface |
| 05/18/1993 | US5211565 Circuit board to store information |
| 05/18/1993 | US5210941 Method for making circuit board having a metal support |
| 05/18/1993 | CA2007199C Single atmosphere for firing copper compatible thick film materials |
| 05/18/1993 | CA1318015C Customizable circuitry |
| 05/18/1993 | CA1317824C Process for improving the adhesive strength of electrolessly deposited metal layers on polyimide surfaces |
| 05/18/1993 | CA1317729C Film-based structural components with controlled coefficient of thermal expansion |
| 05/13/1993 | WO1993009656A1 Electrical device, especially a connecting and control device for motor vehicles |
| 05/13/1993 | WO1993009504A1 Field programmable circuit board |
| 05/13/1993 | WO1993009502A1 Field programmable logic module |
| 05/13/1993 | WO1993009200A1 Uses of 1,1,1,3,3,3-hexafluoropropane |
| 05/13/1993 | WO1993009167A1 Process for preparing a polyimide film with a preselected value for cte |
| 05/13/1993 | WO1993009163A1 Low thermal expansion coefficient polyimides with improved elongation |
| 05/12/1993 | EP0541436A2 Conductive pattern layer structure and method of producing the conductive pattern layer structure |
| 05/12/1993 | EP0540894A1 Amide- and carboxylgroups containing N-aminoalkylimidazole compounds and their use as curing agents for epoxy resins |
| 05/12/1993 | EP0540820A1 Method of production of a structured thin film layered resistance system and circuit device with a thin film layered resistance system manufactured following this method |
| 05/12/1993 | EP0540657A1 Shaped articles containing copolymers of polybenzazoles |
| 05/12/1993 | EP0540640A1 Combined rigid and flexible printed circuits |
| 05/12/1993 | EP0516819A4 Direct bonding of copper to aluminum nitride substrates |
| 05/11/1993 | US5210855 System for computer peripheral bus for allowing hot extraction on insertion without disrupting adjacent devices |
| 05/11/1993 | US5210683 Recessed chip capacitor wells with cleaning channels on integrated circuit packages |
| 05/11/1993 | US5210682 Radial type of parallel system bus structure having pairs of conductor lines with impedance matching elements |
| 05/11/1993 | US5210379 Printed wiring board with electromagnetic wave shielding layer |
| 05/11/1993 | US5210378 Joint assembly for power and signal coupling between relatively rotatable structures |
| 05/11/1993 | US5210157 Interpenetrating network of ring-containing allyl polymers and epoxy resin, and a laminate prepared therefrom |
| 05/11/1993 | US5210006 Process for preparing mounting tapes for automatic mounting of electronic components |
| 05/11/1993 | US5209873 Electrically conductive paste and coating |
| 05/11/1993 | US5209819 Process for producing molding for precision fine-line circuit |
| 05/11/1993 | US5209817 Simplification of process |
| 05/11/1993 | CA1317429C High-lubricity film |
| 05/08/1993 | CA2082299A1 N-aminoalkylimidazole compounds containing amido and carboxyl groups and their use as curing agents for epoxy resins |
| 05/06/1993 | DE4136381A1 Elektrisches geraet, insbesondere schalt- und steuergeraet fuer kraftfahrzeuge Geraet Electrical, particularly command and Control unit for motor vehicles |
| 05/06/1993 | DE4136355A1 Three=dimensional assembly of electronic components and sensors, e.g. for accelerometer mfr. - interconnecting substrates with solder joints, conductive adhesive or wire bonds to edges of polyhedron |
| 05/06/1993 | DE4136159A1 Heat seal compsn. for electroconductive bonding of PCB, LCD etc. - comprises polymer contg. hard, discrete, electroconductive particles |
| 05/05/1993 | EP0540451A2 Structure and process for thin film interconnect |
| 05/05/1993 | EP0540319A2 A wire harness |
| 05/05/1993 | EP0540247A2 Formulation of multichip modules |
| 05/05/1993 | EP0540104A1 Two-layer of multilayer printed circuit board, method of manufacturing such a printed circuit board, and laminate for the manufacture of such a printed circuit board by such a method |
| 05/05/1993 | EP0540101A1 Two-layer or multilayer printed circuit board |
| 05/05/1993 | EP0540070A1 Method for forming an electrical connection for an integrated circuit |
| 05/05/1993 | EP0539756A1 Substrate material for a microstripline circuit and method for preparing substrates |
| 05/04/1993 | US5208733 Enclosure and printed circuit card with heat sink |
| 05/04/1993 | US5208068 Substrates with layer pressed on supports and controlling thickness |
| 05/04/1993 | US5207888 Electroplating process and composition |
| 05/04/1993 | CA2005729C Method and apparatus for forming electrode on electronic component |
| 05/01/1993 | CA2081607A1 Electronic devices |
| 04/29/1993 | WO1993008672A1 Manufacture of multilayer ceramic part, and multilayer ceramic part |
| 04/29/1993 | WO1993008624A1 Interconnector |
| 04/29/1993 | DE4135103A1 High frequency electrical connection appts. - has triple plate arrangement of thin layers on flexible polyimide substrates with electric through contacts |
| 04/29/1993 | DE4134753A1 Wideband high frequency circuit for frequencies above 500 Mhz - compensates for stray inductance using inductor of lower Q connected in parallel across dielectric substrate having dielectric constant greater than 10 |
| 04/28/1993 | EP0539327A1 Epoxy novolac resins stabilised with organic phosphor compounds |
| 04/28/1993 | EP0539123A2 Extrinsically/intrinsically conductive gel |
| 04/28/1993 | EP0539095A2 Semiconductor device having radiator structure and method of producing the same |
| 04/28/1993 | EP0538978A2 Method of forming an electrically conductive contact on a substrate |
| 04/28/1993 | EP0538457A1 Fabrication of metal matrix composites by vacuum die casting |
| 04/28/1993 | EP0538280A1 Rheostatic switching arrangement. |
| 04/28/1993 | EP0357608B1 High-frequency component |
| 04/28/1993 | CN1071535A Cilver-rich conductor compositions for high thermal cycled and aged adhesions |
| 04/27/1993 | US5206905 Password protected device using incorrect passwords as seed values for pseudo-random number generator for outputting random data to thwart unauthorized accesses |
| 04/27/1993 | US5206795 Compliant connection for substrates |
| 04/27/1993 | US5206624 Intermediate product for use in the production of thick-film circuits |
| 04/27/1993 | US5206463 Overcoating with flexible material, then electroconductive material |
| 04/27/1993 | US5206190 Dielectric constant of less than about 4.5, firing temperature of less than 950 degrees celcius and sintered density of greater than 95 degrees theoretical density |
| 04/27/1993 | US5206091 Low dielectric constant, low moisture uptake polyimides and copolyimides for interlevel dielectrics and substrate coatings |
| 04/27/1993 | US5206078 Printed circuit-board and fabric therefor |
| 04/27/1993 | US5206074 Electronic circuit package; polyoxazoles |
| 04/27/1993 | US5205762 High frequency patch cord data connector |
| 04/27/1993 | US5205750 Temperature compensating strain relief connection for flexible electrical circuits |
| 04/23/1993 | CA2081000A1 Epoxy novolaks stabilised with organic phosphorus compounds |
| 04/22/1993 | DE4222233A1 Urea and-or urethane gp.-contg. imidazole cpds. - useful as hardeners for epoxy] resins prepd. e.g. by reaction of (meth)acrylic acid or ethyl (meth)acrylate with imidazole and reaction with e.g. N-aminoethyl:piperazine |
| 04/21/1993 | EP0538075A1 Adhesive polyimide film |
| 04/21/1993 | EP0538003A1 Method of manufacturing inversion type ICs and IC module using same |
| 04/21/1993 | EP0537667A2 High dielectric constant material |
| 04/20/1993 | US5204917 Modular hearing aid |
| 04/20/1993 | US5204806 Flexible printed circuit board |
| 04/20/1993 | US5204416 Dielectrics in integrated circuits |
| 04/20/1993 | US5204415 Polymers prepared from dipropargyl ether of alpha, alpha'-bis (4-hydroxyphenyl)-para-diisopropylbenzene |
| 04/20/1993 | US5204289 Mullite bubbles dispersed in matrix |
| 04/20/1993 | US5204166 Thick film resistor composition, hybrid IC using the composition, and process for producing the hybrid IC |
| 04/20/1993 | US5204025 Polyepoxides containing diglycidylamino groups and cured by a nitrogen-containing Phenol-Formaldehyde Resin resole and copper powder; moisture resistance; adhesion; shields |
| 04/20/1993 | US5203075 Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders |
| 04/20/1993 | CA1316574C Moldable/foldable radio housing |
| 04/20/1993 | CA1316303C Composite structure |
| 04/15/1993 | WO1993007736A1 Silver-rich conductor compositions for high thermal cycled and aged adhesion |
| 04/15/1993 | WO1993007657A1 Plated compliant lead |
| 04/15/1993 | WO1993006964A1 Method for forming solder bump interconnections to a solder-plated circuit trace |