| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 03/03/1992 | US5093761 Circuit board device |
| 03/03/1992 | US5093758 Electrical insulation film and condenser |
| 03/03/1992 | US5093640 Microstrip structure having contact pad compensation |
| 03/03/1992 | US5093435 Blend of amorphous and crystalline thermoplastic resins as dielectric material |
| 03/03/1992 | US5093186 Conductors in laminated through holes; noncracking; low electrical resistance |
| 03/03/1992 | US5093183 Printed circuit board with layer and order of assembly identification |
| 03/03/1992 | US5093038 Ultraviolet curable ink composition |
| 03/03/1992 | US5092782 Integral elastomeric card edge connector |
| 03/03/1992 | US5092033 Method for packaging semiconductor device |
| 03/03/1992 | CA1296833C Polymethylpentene release sheet |
| 03/03/1992 | CA1296781C Arrangement for removable connection between substrates |
| 03/03/1992 | CA1296515C Resistor compositions |
| 03/01/1992 | CA2026956A1 Polyphenylene oxide/hybrid epoxy resin system for electrical laminates |
| 02/27/1992 | DE4026822A1 Surface mountable device carrier prodn. for reliability - esp. for mfg. tape-automated-bonding, by forming bond and contact elements on insulating polyimide film and resistance electroplating |
| 02/27/1992 | DE4026722A1 Making soldered connection between component and PCB - locating discs on terminal pins to improve contact with soldering pads of flexible board |
| 02/26/1992 | EP0472420A2 IC card connection structure |
| 02/26/1992 | EP0472317A1 Sub power plane to provide EMC filtering for VLSI devices |
| 02/26/1992 | EP0472277A1 Method for laser scribing substrates |
| 02/26/1992 | EP0472274A1 Data processing apparatus having connectors to receive system components |
| 02/26/1992 | EP0472177A2 Matt film |
| 02/26/1992 | EP0472165A1 Low dielectric inorganic composition for multilayer ceramic package |
| 02/26/1992 | EP0472034A1 Mixtures of polyarylene sulfides, nitroaryl methylide ketones, glass fibres, and optionally further fillers |
| 02/26/1992 | EP0471982A1 Mounting system for electrical function units, especially for data technics |
| 02/26/1992 | EP0471938A1 High circuit density thermal carrier |
| 02/26/1992 | EP0471937A2 Substrates for copper foils of flexible circuit boards |
| 02/26/1992 | EP0471936A1 Protection-foil for flexible circuit-plates |
| 02/26/1992 | EP0397747A4 Three-dimensional circuit component assembly and method corresponding thereto |
| 02/26/1992 | EP0204004B1 Wiring structure of a terminal circuit |
| 02/26/1992 | CN1059040A Personal computer with shielding of input/output signals |
| 02/25/1992 | USRE33831 Non-shortning pin system |
| 02/25/1992 | US5091822 Radial type of parallel system bus structure with printed, twisted conductor lines |
| 02/25/1992 | US5091771 Compact package for electronic module |
| 02/25/1992 | US5091500 Flexibility, heat resistance |
| 02/25/1992 | US5091481 Composition of polyepoxy compounds, linear polymer and aromatic diamine |
| 02/25/1992 | US5091476 Fireproofing |
| 02/25/1992 | US5091466 Insolubilization of soluble pre-imidized polyimides by polyhydrazine compounds |
| 02/25/1992 | US5091286 Laser-formed electrical component and method for making same |
| 02/25/1992 | US5091218 Method for producing a metallized pattern on a substrate |
| 02/25/1992 | US5091212 Applying electrode paste to selected portions of electronic surface through slit of specified width |
| 02/25/1992 | US5091114 Conductive metal powders, process for preparation thereof and use thereof |
| 02/25/1992 | US5090918 Isothermal termination block having a multi-layer thermal conductor |
| 02/25/1992 | US5090122 Method for manufacturing a three-dimensional circuit substrate |
| 02/25/1992 | US5090116 Method of assembling a connector to a circuit element and soldering lead frame for use therein |
| 02/25/1992 | CA1296417C Hearing aid comprising a printed circuit board and hearing coil |
| 02/25/1992 | CA1296288C Method for selective chemical plating |
| 02/24/1992 | CA2048558A1 Low dielectric inorganic composition for multilayer ceramic package |
| 02/20/1992 | WO1992003034A1 Heat-conductive metal ceramic composite material panel system for improved heat dissipation |
| 02/20/1992 | WO1992003033A1 Compliancy tolerant pattern for circuit carrying substrates |
| 02/20/1992 | WO1992003030A1 Method of forming electrodes |
| 02/20/1992 | DE4026233A1 Leiterplatte mit elektrischen bauelementen, insbesondere in smd-ausfuehrung Circuit board with electrical components, in particular in SMD version |
| 02/20/1992 | DE4026220A1 Varying resistance of printed resistors - pressing conductive paste onto widened resistive portions of tracks printed on flexible foil to reduce resistance |
| 02/20/1992 | DE4026054A1 Ceramic substrate circuit board - has layer of intersecting metallic tracks forming grid |
| 02/20/1992 | DE4024908A1 Prodn. of resist patterns on substrates, esp. drilled substrates - by laminating substrate with a solid resist, removing the protective film, applying a liq. resist, exposing with a mask, and developing |
| 02/19/1992 | EP0471229A1 Mixtures of modified polyaryl sulphides and polycarbonates |
| 02/19/1992 | EP0471149A2 Method for the manufacture of electrical membrane panels having circuits on flexible plastic films |
| 02/19/1992 | EP0422127A4 Thick film dielectric compositions |
| 02/19/1992 | CN1015582B Carrier substrate and method for preparing same |
| 02/18/1992 | US5089881 Fine-pitch chip carrier |
| 02/18/1992 | US5089599 Improved fracture toughness from cured copolymer; printed circuits, aerospace |
| 02/18/1992 | US5089593 Polyimide containing 4,4'-bis(4-amino-2-trifluoromethylphenoxy)-biphenyl moieties |
| 02/18/1992 | US5089355 Metal layer subjected to compression plastic deformation; dimensional stability |
| 02/18/1992 | US5089347 Metallized composite polymer films |
| 02/18/1992 | US5089346 Heat resistant adhesive composition and bonding method using the same |
| 02/18/1992 | US5089343 With 1-methylimidazole as curing catalyst; separators or bonding sheets for printed circuit prepregs |
| 02/18/1992 | US5089173 Thermpopastic polymers, a tertiary amine and conductive silver flake filler |
| 02/18/1992 | US5089172 Thick film conductor compositions for use with an aluminum nitride substrate |
| 02/18/1992 | US5089071 Process for producing a multilayered ceramic structure using an adhesive film |
| 02/18/1992 | US5088931 Apparatus for sequencing signals in conjunction with shorting contacts |
| 02/13/1992 | DE4025186A1 Poly-hydantoin and poly-isocyanurate-poly-oxazolidinone resin mixt. - useful for prodn. of cast film, mouldings and printed circuit boards with low shrinkage at high temp. |
| 02/12/1992 | EP0470854A2 Golf ball |
| 02/12/1992 | EP0470839A2 Ceramic substrate having wiring incorporating silver |
| 02/12/1992 | EP0470740A2 Rigid-flexible printed circuit and process of forming such a circuit |
| 02/12/1992 | EP0470404A1 Multipolar plug fixture |
| 02/12/1992 | EP0470318A2 Resonant tag and method of manufacturing the same |
| 02/12/1992 | EP0470262A1 Copper alloy composition |
| 02/12/1992 | EP0470232A1 Three dimensional plating or etching process and masks therefor |
| 02/11/1992 | US5087658 Heat-resistant resin paste and integrated circuit device produced by using the heat-resistant resin paste |
| 02/11/1992 | US5087530 Automatic bonding tape used in semiconductor device |
| 02/11/1992 | US5087505 Holllow core; parallel arrangement; spacing layer |
| 02/11/1992 | US5087497 Electric circuit substrate |
| 02/11/1992 | US5087413 Conducting material and a method of fabricating thereof |
| 02/11/1992 | US5087396 Directing laser beam at high melting nonmetallic inorganic powder and lower vaporizing binder; controling power density; vacuum removal of loosened powder |
| 02/11/1992 | US5086967 Solder connection device |
| 02/11/1992 | US5086652 Multiple pad contact sensor and method for measuring contact forces at a plurality of separate locations |
| 02/11/1992 | CA1295702C Rotating transformer |
| 02/11/1992 | CA1295461C Method of mounting refined contact surfaces on a substrate, and substrate provided with such contact surfaces |
| 02/06/1992 | WO1992002117A1 Heat dissipating structure of semiconductor device |
| 02/06/1992 | WO1992002116A1 Electric appliance, in particular switching and control appliance for motor vehicles |
| 02/06/1992 | WO1992002039A1 Improved interconnection structure and test method |
| 02/06/1992 | DE4124833A1 Labelling component for electronic modules - has mounted optical or EM absorbing reflecting or fluorescent elements providing code |
| 02/06/1992 | DE4024575A1 Semiconductor circuit mounted on substrate - allows data exchange between chips by opto-electric couplers |
| 02/05/1992 | EP0470049A2 Multilayered laminates |
| 02/05/1992 | EP0470031A2 Circuit board EMI suppressor |
| 02/05/1992 | EP0469957A1 Resin composition for image formation |
| 02/05/1992 | EP0469308A1 Multilayered circuit board assembly and method of making same |
| 02/04/1992 | US5086478 Finding fiducials on printed circuit boards to sub pixel accuracy |
| 02/04/1992 | US5086371 Printed circuit board assembly handle/stiffener |
| 02/04/1992 | US5086139 Composition comprising bisimide and triene |
| 02/04/1992 | US5085923 Printed circuits; high purity, high density |
| 02/04/1992 | US5085922 Printed circuit board |