| Patents for H05K 1 - Printed circuits (98,583) |
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| 05/20/1992 | EP0486231A2 Parallel processing system |
| 05/20/1992 | EP0486208A2 Optical backplane interconnecting circuit boards |
| 05/20/1992 | EP0486146A2 Personal computer with input/output subsystem |
| 05/20/1992 | EP0485910A2 Organic vehicle for electronic composition |
| 05/20/1992 | EP0485838A2 Injection molded circuit boards by injection behind flexible circuits with thermoplastic materials |
| 05/20/1992 | EP0485588A1 Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations. |
| 05/20/1992 | CN1061248A Apparatus for electrodepositing metal |
| 05/19/1992 | US5115090 Polyamic acids and polyimides for multilayer elements, imsulators and passivation layers |
| 05/19/1992 | US5115082 Fluorinated poly(arylene ether) |
| 05/19/1992 | US5114796 Fast curing and storage stable thermoset polymer thick film compositions |
| 05/19/1992 | US5114780 Electronic articles containing a fluorinated poly(arylene ether) dielectric |
| 05/19/1992 | US5114757 Enhancement of polyimide adhesion on reactive metals |
| 05/19/1992 | US5114642 Process for producing a metal-screened ceramic package |
| 05/19/1992 | US5114518 Method of making multilayer circuit boards having conformal Insulating layers |
| 05/19/1992 | US5114353 Multiple connector arrangement for printed circuit board interconnection |
| 05/19/1992 | US5113788 Screen printing machine for through hole printing an electric conductor |
| 05/19/1992 | US5113579 Method of manufacturing hybrid integrated circuit |
| 05/19/1992 | CA1301369C Hermetic pin grid array package |
| 05/19/1992 | CA1301368C2 Stacked circuit cards and guided vehicle configuration |
| 05/19/1992 | CA1301272C Electrical connector |
| 05/19/1992 | CA1301107C Process for the production of plastic parts having conductive polymeric coatings by in-mold electrodeposition method |
| 05/19/1992 | CA1300890C Grinding guide and method |
| 05/19/1992 | CA1300889C Biased grinding assembly |
| 05/17/1992 | CA2055078A1 Parallel processing system |
| 05/15/1992 | CA2055301A1 Optical backplane interconnecting circuit boards |
| 05/14/1992 | WO1992008338A1 Stacked configuration for integrated circuit devices |
| 05/14/1992 | WO1992008260A1 One-piece insulator body and flexible circuit |
| 05/14/1992 | WO1992003833A3 Thin-film resistance temperature device |
| 05/14/1992 | DE4035696A1 Computer tomography measuring system - has individual measuring channels within common housing coupled via PCB to electronic evaluation stage |
| 05/14/1992 | DE4035526A1 Electronic circuit module for motor vehicle - is based on flexible circuit foil with heat sinking aluminium@ plates |
| 05/14/1992 | CA2055065A1 Organic vehicle for electronic composition |
| 05/13/1992 | EP0485308A1 Manufacturing process of an electronic card with a heat sink. |
| 05/13/1992 | EP0485176A2 Metal thin film having excellent transferability and method of preparing the same |
| 05/13/1992 | EP0484916A2 Silicon nitride sintered body |
| 05/13/1992 | EP0484852A1 Temperature controlled electronical circuit |
| 05/13/1992 | EP0484756A2 SMD-type resistor arrangement |
| 05/13/1992 | EP0484731A2 Method of processing an AlN circuit board |
| 05/12/1992 | US5113317 Support for auxiliary circuit card |
| 05/12/1992 | US5113316 System for the assembly and connection of electronic circuit boards, particularly for use in motor vehicles |
| 05/12/1992 | US5113315 Heat-conductive metal ceramic composite material panel system for improved heat dissipation |
| 05/12/1992 | US5113313 Optical element carrying printed substrate and optical head device using the substrate |
| 05/12/1992 | US5112932 Epoxy-terminated polyoxazolidones and process for the preparation thereof |
| 05/12/1992 | US5112926 Improved hardness, toughness and drilling properties |
| 05/12/1992 | US5112694 Copper foil laminated with polyimidesiloxane copolymer |
| 05/12/1992 | US5112687 Highly conductive polymer thick film compositions |
| 05/12/1992 | US5112668 Insulated metal substrates and process for the production thereof |
| 05/12/1992 | US5112648 Method of manufacturing a printed circuit board |
| 05/12/1992 | US5112462 Method of making metal-film laminate resistant to delamination |
| 05/12/1992 | US5112425 Manufacture of printed circuit boards from prepregs of reinforcement impregnated with curable resin, copper alkanoate alkali halide |
| 05/12/1992 | US5112262 Apparatus and method for electrical connections of a display device |
| 05/12/1992 | US5112231 Electrical card edge connector assembly |
| 05/12/1992 | US5112230 Reconfigurable substrate for electric circuit connections |
| 05/12/1992 | US5111723 Punch apparatus with positive slug removal |
| 05/12/1992 | CA1300715C Tag and method of making same |
| 05/12/1992 | CA1300708C Solderless, pushdown connectors for rf and dc |
| 05/12/1992 | CA1300701C Connector assembly |
| 05/12/1992 | CA1300648C Glass-ceramics for electronic packaging |
| 05/12/1992 | CA1300328C Laminated composite of a rigid polyurethane modified polyisocyanurate substrate and metal, plastic, cellulose, glass, ceramic or combinations thereof |
| 05/12/1992 | CA1300327C Laminated composite of a rigid polyisocyanurate substrate and metal, plastic,cellulose, glass ceramic or combination thereof |
| 05/10/1992 | CA2054926A1 Enclosure and printed circuit card with heat sink and manufacturing process of such a card |
| 05/08/1992 | CA2055005A1 Temperature controlled electronic circuit |
| 05/07/1992 | DE4136061A1 Test system for PCB(s) - identifies end points of network paths grouped at set distances to reduce number of test points |
| 05/07/1992 | DE4136017A1 Conductive paste using graphite interlaminar cpd. with improved moisture resistance - uses lead chloride combined with more reactive metal chloride as additive, used for mfg. thick film resistors and conductors |
| 05/07/1992 | DE4035134A1 Noise suppression system for electronic components - uses blocking capacitors preenting transfer of noise currents between similar component groups |
| 05/06/1992 | EP0484290A2 A support element for carrying hybrid circuits in a remelting furnace |
| 05/06/1992 | EP0484062A1 A semiconductor device comprising two integrated circuit packages |
| 05/06/1992 | EP0484023A2 Apparatus for electrodepositing metal |
| 05/06/1992 | EP0483979A1 Method for producing printed circuit boards |
| 05/06/1992 | EP0483782A2 Metallising process |
| 05/06/1992 | EP0483699A1 Reactive-oligoimide adhesives, laminates, and methods of making the laminates |
| 05/06/1992 | EP0483408A1 Removable VLSI package |
| 05/06/1992 | EP0483376A1 Polyimide resin film |
| 05/06/1992 | EP0290617B1 Control unit |
| 05/06/1992 | CN1060861A Enhancement of polyimide adhesion on reactive metals |
| 05/06/1992 | CN1016573B Carrier of electronic elements and manufacture thereof |
| 05/05/1992 | US5111406 Method for determining drill target locations in a multilayer board panel |
| 05/05/1992 | US5111364 Impact resistant layer for a circuit board |
| 05/05/1992 | US5111363 Mount for electronic parts |
| 05/05/1992 | US5111278 Three-dimensional multichip module systems |
| 05/05/1992 | US5111200 Broadband space-division switching network with linkage in a printed circuit board having multi-layer micro-strip lines |
| 05/05/1992 | US5111178 Used in potentiometers where wiper contacts the polymer film, fibers or shperical particles on surface |
| 05/05/1992 | US5111003 Multilayer wiring substrate |
| 05/05/1992 | US5110867 Interpenetrating polymer network of epoxy resin, polyallyl polymer and anhydride |
| 05/05/1992 | US5110664 Thick film and thin film composite substrate and electronic circuit apparatus using it |
| 05/05/1992 | US5110654 Ceramic multilayer wiring substrate |
| 05/05/1992 | US5110633 Finely particulate metal oxide filler; acid aqueous solution of noble metal salt |
| 05/05/1992 | US5110384 Process for making electrically conductive patterns |
| 05/05/1992 | US5110298 Solderless interconnect |
| 05/05/1992 | US5109596 Adapter arrangement for electrically connecting flat wire carriers |
| 05/05/1992 | CA1300306C Moulded printed circuit board |
| 05/05/1992 | CA1300240C Impedance controlled connector interface |
| 05/05/1992 | CA1300238C Device for distributing very high flow-rate digital signals |
| 05/05/1992 | CA1299873C Grinding guide and method for controlling the automatic grinding of objects |
| 05/01/1992 | CA2054299A1 Apparatus for electrodepostiing metal |
| 05/01/1992 | CA2054282A1 Reactive-oligoimide adhesives, laminates, and methods of making the laminates |
| 04/29/1992 | EP0482940A1 Method of forming an electrical connection for an integrated circuit |
| 04/28/1992 | US5109479 Method of designing three dimensional electrical circuits |
| 04/28/1992 | US5109238 Thick film resistor material and thermal head obtained therefrom |
| 04/28/1992 | US5109087 Polymaleimide comonomer |
| 04/28/1992 | US5108958 Ceramic composite for electronic applications |