| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 07/27/1993 | US5230927 Method for metal-plating resin molded articles and metal-plated resin molded articles |
| 07/27/1993 | US5230924 Metallized coatings on ceramics for high-temperature uses |
| 07/27/1993 | US5230788 Insulated metal substrates and process for the production thereof |
| 07/27/1993 | US5230638 Surface mounted electrical connector for printed circuit boards |
| 07/22/1993 | WO1993014612A1 Sheet batteries as substrate for electronic circuits |
| 07/22/1993 | WO1993014516A1 Flexible circuit wiring board, and its manufacture |
| 07/22/1993 | WO1993014157A1 Process for preparing a strengthened polyimide film containing organometallic compounds for improving adhesion |
| 07/22/1993 | WO1992015404A1 Powder coating method for producing circuit board laminae and the like |
| 07/22/1993 | CA2104234A1 Powder coating method for producing circuit board laminae and the like |
| 07/21/1993 | EP0552058A1 Method of producing multi-layered wiring substrate |
| 07/21/1993 | EP0552042A1 Portable semiconductor storage apparatus |
| 07/21/1993 | EP0551826A1 Edge connector for a printed circuit card |
| 07/21/1993 | EP0551747A1 Polyetherimide flexible films |
| 07/21/1993 | EP0551529A1 Method for replacing chips |
| 07/21/1993 | EP0551395A1 Thermal stress-relieved composite microelectronic device |
| 07/21/1993 | CN1021674C Combination barrier and auxiliary CT board |
| 07/20/1993 | US5229916 Chip edge interconnect overlay element |
| 07/20/1993 | US5229640 Surface mountable clock oscillator module |
| 07/20/1993 | US5229566 Process and apparatus for spot-welding a flexible welding board to a battery cell |
| 07/20/1993 | US5229549 Aluminum nitride insulation |
| 07/20/1993 | US5229548 Circuit board having a stamped substrate |
| 07/20/1993 | US5229213 Laminated structure, printed circuits |
| 07/20/1993 | US5229192 Of an addition-condensation copolymer containing an acrylic acid ester, styrene and an amino or phenolic resin, red phosphorous and ammonium polyphosphate |
| 07/20/1993 | US5229167 Method of forming a film pattern on a substrate |
| 07/20/1993 | US5228192 Method of manufacturing a multi-layered ic packaging assembly |
| 07/20/1993 | US5228175 Process for the manufacture of a fibrous preform formed of refractory fibers for producing a composite material article |
| 07/20/1993 | CA2031865C High-density memory array packaging |
| 07/20/1993 | CA1320507C Thermal writing on glass or glass-ceramic substrates and copper-exuding glasses |
| 07/14/1993 | EP0551100A1 Partially crystallizable low melting glass |
| 07/14/1993 | EP0550999A1 A heat-transferring circuit substrate with limited thermal expansion and method for making same |
| 07/14/1993 | EP0550432A1 Improved interconnection structure and test method. |
| 07/14/1993 | CN1074310A Conductive polymer compositions |
| 07/13/1993 | US5227959 Electrical circuit interconnection |
| 07/13/1993 | US5227826 Layer transfer process for image production and apparatus to preform the process |
| 07/13/1993 | US5227812 Liquid jet recording head with bump connector wiring |
| 07/13/1993 | US5227749 Structure for making microwave circuits and components |
| 07/13/1993 | US5227742 Stripline cable having a porous dielectric tape with openings disposed therethrough |
| 07/13/1993 | US5227739 Dielectrics of ceramic oxides of barium, silicon, aluminum, strontium and zirconium; electrode films of silver and copper; compact |
| 07/13/1993 | US5227664 Semiconductor device having particular mounting arrangement |
| 07/13/1993 | US5227589 Plated-through interconnect solder thief |
| 07/13/1993 | US5227588 Interconnection of opposite sides of a circuit board |
| 07/13/1993 | US5227013 Forming via holes in a multilevel substrate in a single step |
| 07/13/1993 | US5227012 Method of manufacturing multi-layer thin film circuits containing integrated thin film resistors |
| 07/13/1993 | US5227008 Method for making flexible circuits |
| 07/13/1993 | US5226959 Green tape, crystallization inhibition |
| 07/13/1993 | US5226220 Method of making a strain relief for magnetic device lead wires |
| 07/11/1993 | CA2085653A1 Polyetherimide/dimethylsiloxane copolymer adhesive system for bonding copper foil to polyetherimide flexible films |
| 07/08/1993 | WO1993013637A1 Multi-layer circuit construction methods and structures with customization features and components for use therein |
| 07/08/1993 | WO1993012933A1 Polyamino-oligomer and polymaleimide compound |
| 07/07/1993 | EP0550176A1 Manufacturing method, including etch-rate monitoring |
| 07/07/1993 | EP0549791A1 Multilayer printed circuit board and method of manufacture |
| 07/07/1993 | EP0549619A1 Process for manufacturing circuits. |
| 07/07/1993 | EP0290578B1 Tungsten paste for co-sintering with pure alumina and method for producing same |
| 07/07/1993 | CN2137852Y Connecting foot for circuit board |
| 07/06/1993 | US5226137 Electronic key with multiple password protected sub-keys using address and translation to implement a block data move between public and protected sub-keys |
| 07/06/1993 | US5225969 Multilayer hybrid circuit |
| 07/06/1993 | US5225966 Conductive adhesive film techniques |
| 07/06/1993 | US5225634 Hybrid circuit formed of two circuits whose tracks are connected by electric connection balls |
| 07/06/1993 | US5225358 In single step after transistor fabrication by chemical vapor deposition of oxide or borophosphosilicate glass over wafer |
| 07/06/1993 | US5225268 Epoxy resin film and method of producing epoxy resin film |
| 07/06/1993 | US5224265 Fabrication of discrete thin film wiring structures |
| 07/06/1993 | US5224250 Apparatus for manufacturing ceramic capacitors |
| 07/06/1993 | CA1319837C Integrated heatable sensor |
| 07/01/1993 | DE4244136A1 Integrated laminated microwave circuit for motor vehicle communication system - has antenna circuit on one side of substrate with transmit and receive circuit on other side |
| 07/01/1993 | DE4243654A1 Thin integrated circuit card with integral battery - contains circuit board with battery aperture in resin with aperture, connector holding battery in aperture |
| 07/01/1993 | DE4241684A1 Encapsulated housing for semiconductor - has connecting leads bonded to housing with connecting wires embedded within protective material |
| 06/30/1993 | EP0549160A1 Connector |
| 06/30/1993 | EP0549080A1 Epoxy resin composition |
| 06/30/1993 | EP0548970A2 Prepolymers from bifunctional aromatic cyanates and electrical laminates made therefrom |
| 06/30/1993 | EP0548882A1 Hybrid optical/electrical circuit module |
| 06/30/1993 | EP0548652A1 Method of fabricating resistive conductive patterns on aluminum nitride substrates |
| 06/30/1993 | EP0548583A1 Header cover |
| 06/30/1993 | EP0540640A4 Combined rigid and flexible printed circuits |
| 06/30/1993 | CN1021448C Photopolymerizable composition having superior adhesion |
| 06/30/1993 | CN1021419C Metal-plated polymeric films |
| 06/29/1993 | US5224023 Foldable electronic assembly module |
| 06/29/1993 | US5224022 Reroute strategy for high density substrates |
| 06/29/1993 | US5224021 Surface-mount network device |
| 06/29/1993 | US5223690 Process and apparatus for spot-welding a flexible welding board to a battery cell |
| 06/29/1993 | US5223676 Composite circuit board having means to suppress heat diffusion and manufacturing method of the same |
| 06/29/1993 | US5223594 Heat resistance; electronic laminate |
| 06/29/1993 | US5223568 Process for forming hard shaped molded article of a cross-linked liquid polybutadiene or polyisoprene resin and a butadiene or isoprene containing solid polymer and resulting articles |
| 06/29/1993 | US5223094 Process for preparing strong aromatic polyamide papers of high porosity |
| 06/29/1993 | US5222739 Golf ball |
| 06/29/1993 | US5222668 Fluid actuated connector |
| 06/29/1993 | US5222305 Method for specifying and verifying positive graphics pattern positions relative to non-plated tooling holes patterns on the same substrate |
| 06/29/1993 | CA1319714C Devitrifying glass frits |
| 06/29/1993 | CA1319562C Plastic substrate for thermal ink jet printer |
| 06/24/1993 | WO1993012560A1 Method of joining connection plates |
| 06/24/1993 | WO1993012539A1 Thermal transfer posts for high density multichip substrates and formation method |
| 06/24/1993 | WO1993011906A1 Paste, ink or cream formulations for use in the electronics industry |
| 06/24/1993 | DE4206746C1 Manufacture of circuit board with rigid and flexible sections - has flexible sections created by having non-bonding insert of insulation broken away |
| 06/24/1993 | DE4141775A1 Electronic circuits mfr. - using temporary substrate for assembly and fixing with cast epoxy] resin |
| 06/24/1993 | CA2126189A1 Thermal transfer posts for high density multichip substrates and formation method |
| 06/24/1993 | CA2125487A1 Paste, ink or cream formulations for use in the electronics industry |
| 06/23/1993 | EP0547692A1 Electrical wire deletion |
| 06/23/1993 | EP0547616A1 Circular connector to mass terminated connector adaptor |
| 06/23/1993 | EP0285051B1 Method for bonding integrated circuit chips |
| 06/23/1993 | CN1073547A Resistiue metal layers and method for making same |
| 06/23/1993 | CN1073385A Method for making thick film/solder joints |