| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 07/23/1992 | WO1992012548A1 High-frequency device |
| 07/23/1992 | CA2059709A1 Flexible laminates |
| 07/22/1992 | EP0495540A2 Multi-level board, especially for high frequency |
| 07/22/1992 | EP0495479A1 Diamond member, laminated diamond substrate, and method of making same |
| 07/22/1992 | EP0495470A2 Device for noise suppressing of a switched power unit |
| 07/22/1992 | EP0495303A2 Deposition of electroactive polymers |
| 07/22/1992 | EP0495282A2 Film carrier tape for TAB |
| 07/22/1992 | EP0495035A1 Method of applying metallized contacts to a solar cell |
| 07/22/1992 | EP0494913A1 Electro-active cradle circuits for the detection of access or penetration |
| 07/22/1992 | EP0494879A1 Coil arrangement for a focussing or track control circuit. |
| 07/22/1992 | EP0266412B1 Surface mountable diode |
| 07/21/1992 | US5132879 Secondary board for mounting of components having differing bonding requirements |
| 07/21/1992 | US5132878 Customizable circuitry |
| 07/21/1992 | US5132877 Molded electrical assembly having an integral connector |
| 07/21/1992 | US5132864 Printed circuit board |
| 07/21/1992 | US5132587 Spark plug electrodes |
| 07/21/1992 | US5131941 High Temperature, Radiation |
| 07/21/1992 | US5131852 Electrical socket |
| 07/21/1992 | US5131141 Method for preparing a double-sided flexible circuit board with electrical connection at a through-hole |
| 07/21/1992 | US5131140 Method for evaluating plane splits in printed circuit boards |
| 07/16/1992 | DE4100865A1 Use of reactive substrate in thick film resistor mfr. - has thick dielectric layer acting as adhesion promoter and insulating layer, between resistor layer and substrate |
| 07/15/1992 | EP0494759A1 Orthogonal interconnection |
| 07/15/1992 | EP0494722A2 A curable polyphenylene ether resin composition and a cured resin composition obtainable therefrom |
| 07/15/1992 | EP0494668A2 Polyimide multilayer wiring board and method of producing same |
| 07/15/1992 | EP0494560A2 Support for printed circuits with heat dissipation means |
| 07/15/1992 | EP0494235A1 Solderable conductive polymer composition |
| 07/15/1992 | EP0494204A1 Improved composite dielectric |
| 07/15/1992 | EP0494153A1 Compound arrangement with printed circuit board. |
| 07/14/1992 | US5130894 Three-dimensional circuit modules |
| 07/14/1992 | US5130882 Multilayer circuit board transient protection device |
| 07/14/1992 | US5130768 Compact, high-density packaging apparatus for high performance semiconductor devices |
| 07/14/1992 | US5130499 Flexible circuit and a device for holding the flexible circuit in the folded state |
| 07/14/1992 | US5130498 Aluminum nitride, aluminum alloy, bonding layer, resistance against thermal stress |
| 07/14/1992 | US5130444 With or without the addition of aromatic diamine; flexible, reinforcement with fibers |
| 07/14/1992 | US5130407 Hydantoin or barbituric acid-extended epoxy resin |
| 07/14/1992 | US5130192 Process for preparing metallized polyimide film |
| 07/14/1992 | US5130181 Polyphenylene sulfide laminate |
| 07/14/1992 | US5130179 Insulation, glass powder, metal powder |
| 07/14/1992 | US5129829 Socket for a miniature incandescent lamp |
| 07/14/1992 | CA1304929C Silver sensing material for use on film |
| 07/10/1992 | CA2059022A1 Orthogonal interconnection |
| 07/09/1992 | WO1992011679A1 Battery apparatus with circuit runner as current limiting device |
| 07/09/1992 | WO1992011665A1 Three-dimensional microwave circuit carrier and integral waveguide coupler |
| 07/09/1992 | WO1992011646A1 Thermoplastic norbornene dicarboximide polymers useful for dielectric devices |
| 07/09/1992 | WO1992011580A1 Photodefinable interlevel dielectrics |
| 07/08/1992 | EP0493939A1 Flexible printed circuits |
| 07/08/1992 | EP0493870A2 A TAB package and a liquid-crystal panel unit using the same |
| 07/08/1992 | EP0493414A1 Polyimide resin laminates. |
| 07/08/1992 | EP0448702A4 Application specific tape automated bonding |
| 07/07/1992 | US5128832 Termination of the signal and ground lines of a backplane |
| 07/07/1992 | US5128749 Fused high density multi-layer integrated circuit module |
| 07/07/1992 | US5128444 Heat resistant adhesive |
| 07/07/1992 | US5128417 Good adhesion to metals, substrate for electronic devices |
| 07/07/1992 | US5128013 Deposition of electroactive polymers |
| 07/07/1992 | US5128008 Method of forming a microelectronic package having a copper substrate |
| 07/07/1992 | US5127986 High power, high density interconnect method and apparatus for integrated circuits |
| 07/07/1992 | US5127838 Plated electrical connectors |
| 07/07/1992 | US5127570 Flexible automated bonding method and apparatus |
| 07/07/1992 | US5127158 Process for producing a printed circuit board with a syndiotactic polystyrene support |
| 07/07/1992 | CA1304884C Carbon black-filled foam and process of preparing same |
| 07/02/1992 | DE4040643A1 Simulation of integrated circuit in housing - involves components on base plate, corresp. to basic dimensions of original housing with terminals for original |
| 07/01/1992 | EP0493240A2 Liquid crystal display module |
| 07/01/1992 | EP0493106A2 Method of locating objects |
| 07/01/1992 | EP0493103A2 Electrical connection system |
| 07/01/1992 | EP0492933A2 Multichip module |
| 07/01/1992 | EP0492830A2 Method of indicating a cure point for ultraviolet radiation curing compositions by color change |
| 07/01/1992 | EP0492518A1 A ceramic substrate for electronic circuit and a method for producing the same |
| 07/01/1992 | EP0492492A2 Method of securing a connector to a circuit element and soldering lead frame for use therein |
| 07/01/1992 | EP0492154A1 Thermoplastic film, reinforced hollow glass microsphere reinforced laminates for thin low dielectric constant substrates |
| 07/01/1992 | EP0492110A1 Method for connecting a flexible printed circuit board to an electrical component, apparatus obtainable thereby as well as a device for assembling a flexible printed circuit board |
| 07/01/1992 | CN2109051U Copper foil coaded gum |
| 07/01/1992 | CN1017248B Resin composition |
| 07/01/1992 | CA2057979A1 Flexible printed circuits |
| 06/30/1992 | US5126921 Electronic component and a method for manufacturing the same |
| 06/30/1992 | US5126920 Multiple integrated circuit interconnection arrangement |
| 06/30/1992 | US5126910 Modular computer memory circuit board |
| 06/30/1992 | US5126818 Semiconductor device |
| 06/30/1992 | US5126467 Prepregs for printed circuits having improved soldering heat resistance and heat shock resistance |
| 06/30/1992 | US5126293 Homogenous dispersion of transition metal or compound grains in crystalline aluminum nitride particles, thermoconductivity |
| 06/30/1992 | US5126292 Glassy binder system for ceramic substrates, thick films and the like |
| 06/30/1992 | US5126192 Flame retardant, low dielectric constant microsphere filled laminate |
| 06/30/1992 | US5125856 Cable to printed circuit board keyed connector system |
| 06/30/1992 | US5125557 Ceramics bonded product and method of producing the same |
| 06/30/1992 | US5125153 Method of making a hybrid electronic array |
| 06/25/1992 | WO1992011113A1 Direct bonding of copper to aluminum nitride substrates |
| 06/25/1992 | WO1992010365A1 Non-beading, thin-film, metal-coated ceramic substrate |
| 06/25/1992 | DE4127432A1 Bead filter for electromagnetic interference redn., for automation - comprises epoxy] coating with aluminium@ and silicon@ for high impedance, mechanical strength, uniformity, and signal=to=noise ratio on PCB |
| 06/24/1992 | EP0491543A2 Via resistors within multilayer 3-dimensional structures/substrates |
| 06/24/1992 | EP0491542A1 Via capacitors within multi-layer 3-dimensional structures/substrates |
| 06/24/1992 | EP0491515A2 Use of amorphous carbon to promote adhesion between electroactive polymer films and conductive substrates |
| 06/24/1992 | EP0491345A2 Silicon-nitride sintered body |
| 06/24/1992 | EP0491336A2 Electric circuit |
| 06/24/1992 | EP0491308A1 Tetrapolyimide film containing oxydiphthalic dianhydride |
| 06/24/1992 | EP0491307A1 Tetrapolyimide film containing benzophenone tetracarboxylic dianhydride |
| 06/24/1992 | EP0491306A1 Aromatic polyimides derived from aromatic dianhydrides and chlorinated aromatic diamines |
| 06/24/1992 | EP0491262A2 Semiconductor module |
| 06/24/1992 | CN1062257A Method for making switch and potentiometer in curcuit board |
| 06/23/1992 | US5124888 Electric circuit apparatus |
| 06/23/1992 | US5124884 Electronic part mounting board and method of manufacturing the same |
| 06/23/1992 | US5124677 Waffleline-configured surface-mount package for high frequency signal coupling applications |