| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 01/12/1993 | US5179501 Laminated electronic module assembly |
| 01/12/1993 | US5179366 End terminated high power chip resistor assembly |
| 01/12/1993 | US5179188 Crosslinkable fluorinated aromatic ether composition |
| 01/12/1993 | US5178976 Technique for preparing a photo-mask for imaging three-dimensional objects |
| 01/12/1993 | US5178965 Copper printed circuit coated with tin-lead solder |
| 01/12/1993 | US5178957 Noble metal-polymer composites and flexible thin-film conductors prepared therefrom |
| 01/12/1993 | US5178956 Pretreatment process for electroless plating of polyimides |
| 01/12/1993 | US5178914 Electroless metal deposition |
| 01/12/1993 | US5178802 Surface treatment of polyolefin objects |
| 01/12/1993 | US5178726 Multilayer element, pulsation, energy absorbers and ablation |
| 01/12/1993 | US5178725 Method for working ceramic material |
| 01/12/1993 | US5178318 Multilayer rigid-flex printed circuit boards for use in infrared reflow oven and method for assembling same |
| 01/12/1993 | US5178051 Magnetic punch die retention for HTCC/LTCC fabrication |
| 01/12/1993 | US5177863 Method of forming integrated leadouts for a chip carrier |
| 01/12/1993 | US5177856 Method of making a shield for a printed circuit board |
| 01/12/1993 | US5177841 Method of manufacturing ceramic layered product |
| 01/12/1993 | CA1312660C Electrical connection arrangement for flat cable |
| 01/12/1993 | CA1312574C Circuit board material |
| 01/07/1993 | WO1993000785A1 Integrated-circuit design with reduced number of power/ground pins and improved power distribution |
| 01/07/1993 | WO1993000713A1 Process for producing a self-supporting thick film structure |
| 01/07/1993 | WO1993000705A1 Package structure of semiconductor device and manufacturing method therefor |
| 01/07/1993 | WO1993000392A1 Method of treating the surface of moulded polyamide articles, and the articles thus obtained |
| 01/07/1993 | EP0521735A1 Semiconductor memory control device and method of mounting same in high density |
| 01/07/1993 | EP0521720A1 Heat-dissipating multi-layer circuit board |
| 01/07/1993 | EP0521483A2 Printed circuit board and semiconductor chip carrier sheet |
| 01/07/1993 | EP0521441A1 Insulated support for semiconductor device and method for manufacturing the same |
| 01/07/1993 | EP0521343A1 Electronic device and its production method |
| 01/07/1993 | EP0521335A1 Surface-mounting type semiconductor package having an improved efficiency for heat dissipation |
| 01/07/1993 | EP0521144A1 Manufacturing multilayer ceramic substrate |
| 01/07/1993 | EP0411036B1 Ceramic plate (substrate) coated on at least one side with metal |
| 01/07/1993 | DE4217224A1 Film aus mit partikeln gefuelltem verbundmaterial und verfahren zu seiner herstellung Film with particles were full composite material and process for its manufacture |
| 01/07/1993 | DE4121545A1 Lamp current monitoring appts. for motor vehicle - provides spatial and thermal separation between heat generation components and heat sensitive components |
| 01/07/1993 | DE4121390A1 Verfahren zum herstellen einer freitragenden dickschichtstruktur A method of manufacturing a cantilever thick layer structure |
| 01/05/1993 | US5177782 Modular protected entrance terminal |
| 01/05/1993 | US5177596 Electronic component mounting structures for fpc tape carrier and methods of separation and application |
| 01/05/1993 | US5177458 Dielectric filter construction having notched mounting surface |
| 01/05/1993 | US5177326 Lead wire array for a leadless chip carrier |
| 01/05/1993 | US5177324 In situ RF shield for printed circuit board |
| 01/05/1993 | US5176942 Process for manufacturing fiber-reinforced base materials for the electrical industry based on epoxy resin and imidazole-acrylic acid adduct curing agents |
| 01/05/1993 | US5176853 Controlled adhesion conductor |
| 01/05/1993 | US5176780 Method of bonding polyimide films and printed circuit boards incorporating the same |
| 01/05/1993 | US5176773 Method of manufacturing a ceramic carrier |
| 01/05/1993 | US5176530 Miniature multiple conductor electrical connector |
| 01/05/1993 | US5176524 IC socket structure |
| 01/05/1993 | US5176309 Oxidation to form copper-cuprous oxide eutectic alloy interface layer; bonding and peel strength |
| 01/05/1993 | CA1312387C Hybrid printed circuit board |
| 01/03/1993 | CA2072817A1 Multi-layer circuit board |
| 12/30/1992 | EP0520776A2 Method of applying metal coatings on diamond |
| 12/30/1992 | EP0520682A1 Personal data card fabricated from a polymer thick-film circuit |
| 12/30/1992 | EP0520640A1 Metal foil with improved peel strength and method for making said foil |
| 12/30/1992 | EP0520434A1 Integrated socket-type package for flip chip semiconductor devices and circuits |
| 12/30/1992 | EP0520410A1 Control apparatus with terminal arrangement |
| 12/30/1992 | EP0520318A1 surface roughening of resin molded articles for metallizing |
| 12/30/1992 | EP0520243A2 Metal core circuit board |
| 12/30/1992 | EP0520236A2 Polyimides based on 9-aryl-9(perfluoroalkyl)-xanthene-2,3,6,7-dianhydride or 9,9'-bis(perfluoroalkyl)xanthene-2,3,6,7-dianhydride and benzidine derivatives |
| 12/30/1992 | EP0520195A2 Electroplating process and composition |
| 12/29/1992 | US5175668 Circuit board for a component requiring heat sinkage |
| 12/29/1992 | US5175609 Structure and method for corrosion and stress-resistant interconnecting metallurgy |
| 12/29/1992 | US5175515 Signal routing technique for electronic systems |
| 12/29/1992 | US5175409 Self-soldering flexible circuit connector |
| 12/29/1992 | US5175399 Copper conductor laminated to substrate which also has organic dielectric, heat and chemical resistance |
| 12/29/1992 | US5175280 Electroconductive complexes; heat resistance |
| 12/29/1992 | US5175240 Aromatic homopolyimide or copolyimide films having low water absorption and high thermal durability |
| 12/29/1992 | US5175224 Forming reinforced polyimides |
| 12/29/1992 | US5175130 Low-temperature baked substrate |
| 12/29/1992 | US5175060 Leadframe semiconductor-mounting substrate having a roughened adhesive conductor circuit substrate and method of producing the same |
| 12/29/1992 | US5175044 Sheet-like ceramic substrate for tip parts |
| 12/29/1992 | US5175024 Removal of oxide layers by treatment with an amine and reduction with catechol compound |
| 12/29/1992 | US5174925 Conductive ink composition and method of forming a conductive thick film pattern |
| 12/29/1992 | US5174847 Process for the production of a circuit arrangement on a support film |
| 12/29/1992 | US5174842 Method for laminating ceramic green sheets |
| 12/29/1992 | CA2070047A1 Metal foil with improved peel strength and method for making said foil |
| 12/29/1992 | CA2070046A1 Metal foil with improved bonding to substrates and method for making said foil |
| 12/29/1992 | CA1312160C Resin composition for printed circuit board |
| 12/29/1992 | CA1312146C Printed circuit board with pin receiving portion |
| 12/27/1992 | CA2071662A1 Integrated socket-type package for flip-chip semiconductor devices and circuits |
| 12/26/1992 | CA2071719A1 Polyimides based on 9-aryl-9(perfluoroalkyl)-xanthene-2,3,6.7-dianhydride or 9,9'-bis(perfluoroalkyl)xanthene-2,3,6.7-dianhydride and benzidine derivatives |
| 12/24/1992 | DE4217076A1 Ceramic-filled fluoro:polymer for PCB use - contg. specified volume of filler coated with fluorinated and/or non-fluorinated silane, having improved flow properties |
| 12/24/1992 | DE4217075A1 Ceramic-filled fluoro:polymer composite for circuit board use - contains specific vol. of filler coated with zirconate or titanate to improve flow properties and chemical resistance at high pH |
| 12/24/1992 | DE4120723A1 Verfahren zur oberflaechenbehandlung von polyamid-formkoerpern und danach erhaltene formkoerper A method for the surface finishing of polyamide-formkoerpern and then obtained formkoerper |
| 12/23/1992 | WO1992022996A1 Electrical device with at least one contact pin and conductor track sheet |
| 12/23/1992 | WO1992022995A1 A circuit board having a lateral conductive pattern and shielded regions as well as a method of manufacturing such a board |
| 12/23/1992 | WO1992022994A1 A device comprising laminated conductive patterns and easily selectable dielectrics |
| 12/23/1992 | WO1992022941A1 Electrical connectors |
| 12/23/1992 | WO1992022939A1 A device with flexible, stripline conductors and a method of manufacturing such a device |
| 12/23/1992 | WO1992022422A1 Shape retaining flexible electrical circuit |
| 12/23/1992 | EP0519740A2 Signal routing technique for high frequency electronic systems |
| 12/23/1992 | EP0519676A2 Process of producing multiple layer glass-ceramic circuit board |
| 12/23/1992 | EP0519631A2 Both-side roughened copper foil with protection film |
| 12/23/1992 | EP0519202A1 Electric device with at least one contact pin and one flexible printed circuit |
| 12/23/1992 | EP0519200A1 Connection of LLCCC structural elements for the space electronics |
| 12/23/1992 | EP0519175A2 Method for making multilayer electronic circuits |
| 12/23/1992 | EP0519085A1 High-frequency device |
| 12/23/1992 | EP0236404B1 Manufacture of electrical circuits |
| 12/22/1992 | US5173844 Integrated circuit device having a metal substrate |
| 12/22/1992 | US5173842 Electrical assembly with deformable bridge printed circuit board |
| 12/22/1992 | US5173839 Heat-dissipating method and device for led display |
| 12/22/1992 | US5173826 Thin film head with coils of varying thickness |
| 12/22/1992 | US5173542 Bistriazene compounds and polymeric compositions crosslinked therewith |
| 12/22/1992 | US5173457 Paste compositions |