| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 11/28/1991 | WO1991018416A1 Interdigitated trans-die lead construction and method of construction for maximizing population density of chip-on-board construction |
| 11/28/1991 | WO1991018415A1 Circuit board for mounting ic and mounting method thereof |
| 11/28/1991 | WO1991018035A1 Cyanate ester resin composition containing an epoxy/aromatic adduct |
| 11/28/1991 | WO1991017880A1 Resin film and method of making said film |
| 11/28/1991 | WO1991017840A1 Process for making fine conductor lines |
| 11/28/1991 | DE4115160A1 Light and compact display-frame for lap-top computer - uses ribbon-cables across gap between circuit-board and display |
| 11/27/1991 | EP0458740A1 Adhesion of foils of polyimides, adhesives and printed circuits |
| 11/27/1991 | EP0458739A2 Curable resins leading to flame resistant and highly heat resistant polymers and process for their preparation |
| 11/27/1991 | EP0458483A1 Improvements in or relating to connectors |
| 11/27/1991 | EP0458448A2 An adapter and test fixture for an integrated circuit device package |
| 11/27/1991 | EP0458293A1 Multilayer wiring board and method for manufacturing the same |
| 11/27/1991 | EP0458092A2 Curved array ultrasonic transducer assembly and its method of manufacture |
| 11/27/1991 | EP0457985A1 Microwave semiconductor device |
| 11/27/1991 | CN1014883B Dielectric compositions |
| 11/26/1991 | US5068712 Semiconductor device |
| 11/26/1991 | US5068652 Personal computer having condition indicator |
| 11/26/1991 | US5068631 Sub power plane to provide EMC filtering for VLSI devices |
| 11/26/1991 | US5068612 Electromagnetic shield for an inductive search coil assembly |
| 11/26/1991 | US5068307 Polyamideimides containing 3,4'-diamino-diphenylether as diamine component and process for preparing the same |
| 11/26/1991 | US5068303 Printed circuit boards for electronics formed from polymers of cyclic polyenes and cyclic polysiloxanes containing hydrogen |
| 11/26/1991 | US5068210 Low dielectric constant ceramic materials |
| 11/26/1991 | US5068150 Copper powder for electroconductive paints and electroconductive paint compositions |
| 11/26/1991 | US5067904 IC socket |
| 11/26/1991 | US5067826 Ball and roller bearings and bearing components |
| 11/26/1991 | US5067229 Cutting device for use in manufacturing electronic components |
| 11/24/1991 | CA2042153A1 Bonding of polymide films, and printed circuit boards |
| 11/21/1991 | EP0457583A2 Multilayer interconnection substrate |
| 11/21/1991 | EP0457313A1 Assembly group, in particular for data technology |
| 11/21/1991 | EP0457071A2 Process for generating fine conductor lines |
| 11/21/1991 | EP0456912A1 Polyamide type laminated film |
| 11/21/1991 | EP0456887A2 Electrical circuit |
| 11/21/1991 | DE4115738A1 Metal clamp for electrically connecting circuit track - connects two separate tracks on opposite sides of circuit board |
| 11/21/1991 | DE4016088A1 Drilling holes in multilayer circuit boards - using drill with several drill bits connected to each other but independently controllable for adaption to position of layers |
| 11/21/1991 | DE4016059A1 Mouldable polyarylene sulphide mixt. with good mechanical properties - contg. poly:silicon-epoxide] resin and filler-reinforcing agent |
| 11/21/1991 | DE4015941A1 Increased contrast, auto visual controlled chip mounting - using fluorescent liquid on chip legs to enable camera to accurately control positioning of chips on high density circuit board |
| 11/19/1991 | US5067047 Circuit pack with inboard jet cooling |
| 11/19/1991 | US5067042 Wiring board for flat package type integrated circuit device |
| 11/19/1991 | US5066735 Lamination of prepregs for electrical applications |
| 11/19/1991 | US5066692 Electromagnetic wave shielding composition comprising epoxy resin and copper particles |
| 11/19/1991 | US5066620 Conductive paste compositions and ceramic substrates |
| 11/19/1991 | US5066565 Selective protection of poly(tetra-fluoroethylene) from effects of chemical etching |
| 11/19/1991 | US5066361 Etching, silanation, applying resin; automobiles |
| 11/19/1991 | US5066360 Using resist as protective covering for metallized appertures so they are not destroyed during etching of circuit board pattern |
| 11/19/1991 | US5066357 Method for making flexible circuit card with laser-contoured vias and machined capacitors |
| 11/19/1991 | US5065506 Method of manufacturing circuit board |
| 11/19/1991 | US5065502 Method for modifying electrical performance characteristics of circuit paths on circuit panels |
| 11/14/1991 | WO1991017589A1 Electronic connector matrix system |
| 11/14/1991 | WO1991017550A1 Highly conductive polymer thick film compositions |
| 11/14/1991 | DE4114944A1 Portable computer with support and inclined surfaces - has carrier units on circuit board fox removable components held vertically and at angle to maintain packing density |
| 11/14/1991 | DE4113483A1 Fine wiring trace prodn. for single or multilayer circuits - by photocopying tacky pattern on temporary substrate, developing with conductive powder, transferring to substrate and sintering |
| 11/13/1991 | EP0456428A2 Electronic system having component parts bonded by a thermally conductive adhesive |
| 11/13/1991 | EP0456423A2 Circuit pack with inboard jet cooling |
| 11/13/1991 | EP0456243A2 Composite sheet and a process for producing ceramic circuit board using same |
| 11/13/1991 | EP0455915A1 Electroless plating of nickel onto surfaces such as copper or fused tungsten |
| 11/13/1991 | EP0455714A1 A method of manufacturing a substrate for placement of electrical and/or electronic components. |
| 11/13/1991 | EP0455658A1 Method and device for fastening an electronic circuit substrate onto a support. |
| 11/13/1991 | EP0389559A4 Moldable/foldable radio housing |
| 11/12/1991 | US5065284 Multilayer printed wiring board |
| 11/12/1991 | US5065283 Printed circuit board with busbar interconnections |
| 11/12/1991 | US5065279 Integral protective enclosure for tab or similar delicate assembly mounted locally on a flexible printed circuit board |
| 11/12/1991 | US5065275 Titanate ceramic dielectric and calcium-magnesium silicate insulating laminate |
| 11/12/1991 | US5065227 Integrated circuit packaging using flexible substrate |
| 11/12/1991 | US5065122 Metallizing fluoroplastic substrate |
| 11/12/1991 | US5064989 Surface shaping and finishing apparatus and method |
| 11/12/1991 | US5064884 Good mechanical properties; injection molding |
| 11/12/1991 | US5064469 Organic Amine, 1,2-Dihydroxybenzene Compound, Ethylene Glycol |
| 11/12/1991 | US5064378 Mounting of DRAMs of different sizes and pinouts within limited footprint |
| 11/12/1991 | US5064377 Compression contact electrical connector assembly for a disc drive |
| 11/12/1991 | CA2039058A1 Circuit pack with inboard jet cooling |
| 11/08/1991 | CA2041807A1 Thermally conductive adhesive |
| 11/07/1991 | DE4113730A1 H.F. printed circuit substrate prodn. - from injection moulded thermoplastic resin board with accurate thickness by bonding to copper foil or laminate |
| 11/07/1991 | DE4014162A1 Glass fibre-reinforced polyarylene sulphide moulding compsns. - contg. quinhydrone have improved mechanical properties and flowability |
| 11/07/1991 | DE4014070A1 Mfg. process for printed circuit boards - forming by injection moulding with trenches filled in with conductive material for tracks |
| 11/06/1991 | EP0455571A2 Low thermal coefficients of expansion(TCE) polyimides |
| 11/06/1991 | EP0455407A2 Insulating material and production thereof |
| 11/06/1991 | EP0455229A2 Ceramic substrate used for fabricating electric or electronic circuit |
| 11/06/1991 | EP0455208A2 Copolyimide film with improved properties |
| 11/06/1991 | EP0455019A1 Conductive paste composition |
| 11/06/1991 | EP0454874A1 Thia- and/or selenafulvalenyl compound |
| 11/06/1991 | EP0454759A1 Thick film copper via fill inks |
| 11/06/1991 | EP0454734A1 Devitrifying glass formulations for low expansion printed-circuit substrates and inks |
| 11/06/1991 | EP0394327B1 Central circuit arrangement for motor vehicles |
| 11/05/1991 | US5063478 Electrical or electronic control key pad |
| 11/05/1991 | US5063280 Method and apparatus for forming holes into printed circuit board |
| 11/05/1991 | US5063137 Laser-marking method and resin composition for laser-marking |
| 11/05/1991 | US5063121 Sheet with metallized layer containing molybdenum, tungsten, activator metal or their alloys and interface layer of yttria and alumina |
| 11/05/1991 | US5062916 Method for the manufacture of electrical membrane panels having circuits on flexible plastic films |
| 11/05/1991 | US5062891 Glass and ceramics |
| 11/05/1991 | US5062801 Function unit in which circuit boards are mounted on a center plane by way of distribution boards |
| 11/03/1991 | CA2039895A1 Conductive paste composition |
| 10/31/1991 | WO1991016805A1 Ceramic circuit board |
| 10/31/1991 | WO1991016740A1 Intermediary adapter-connector |
| 10/31/1991 | WO1991016726A1 Multilayer circuit board for mounting ic and manufacture thereof |
| 10/31/1991 | WO1991016718A1 Method for assembling a coil on a printed circuit |
| 10/31/1991 | WO1991016370A1 Crosslinkable fluorinated aromatic ether compositions |
| 10/31/1991 | DE4010193A1 Printed circuit board for power electronic circuit |
| 10/31/1991 | CA2041545A1 Copolyimide film with improved properties |
| 10/31/1991 | CA2039321A1 Process for forming multi-level coplanar conductor/insulator films employing photosensitive polyimide polymer compositions |
| 10/30/1991 | WO1991016369A1 Fluorinated poly(arylene ethers) |
| 10/30/1991 | EP0454502A1 Optical circuitry, substrates therefor, opto-electronic devices and methods of making them |