Patents for H05K 1 - Printed circuits (98,583)
03/1992
03/31/1992CA1298087C Automatic grinding machine
03/28/1992WO1992006495A1 Thermal stress-relieved composite microelectronic device
03/28/1992CA2091465A1 Thermal stress-relieved composite microelectronic device
03/28/1992CA2051924A1 Leadframe adapted to support semiconductor elements and method of mounting leadframe
03/26/1992DE4030055A1 Verfahren zum herstellen einer schaltung A method of making a circuit
03/26/1992DE4030043A1 Automatic block section module for DC model railway - combines track and signal movement functions on printed circuit board supplied from source of traction voltage
03/25/1992EP0477036A2 Optical information transmitting device
03/25/1992EP0477004A2 Multi-layer wiring board
03/25/1992EP0476954A1 Method for preparing green sheets
03/25/1992EP0476898A2 Circuit board and process for producing the same
03/25/1992EP0476868A1 Three-dimensional electroformed circuitry
03/25/1992EP0476685A2 Thin memory module
03/25/1992EP0476575A2 Polyimide film with tin or tin salt incorporation resulting in improved adhesion
03/25/1992EP0476560A1 Polybenzazole polymers containing perfluorocyclobutane rings
03/25/1992EP0476320A1 Process for manufacturing conductive structures in thick film technique
03/25/1992CN1016027B Hermetically sealed electronic component
03/24/1992USRE33859 Hermetically sealed electronic component
03/24/1992US5099396 Electronic circuit configured for indicator case
03/24/1992US5099395 Circuit board for mounting electronic components
03/24/1992US5099394 Offset basecard
03/24/1992US5099393 Electronic package for high density applications
03/24/1992US5099388 Alumina multilayer wiring substrate provided with high dielectric material layer
03/24/1992US5099219 Fusible flexible printed circuit and method of making same
03/24/1992US5099090 Circuit writer
03/24/1992US5098815 Process for the production of dielectric layers in planar circuits on ceramics substrates
03/24/1992US5098781 Thermoplastic film, reinforced hollow glass microsphere reinforced laminates for thin low dielectric constant substrates
03/24/1992US5098769 Two-shot molded article for use in circuit formation
03/24/1992US5097593 Method of forming a hybrid printed circuit board
03/24/1992US5097592 Method of making molded electrical interconnection system
03/24/1992CA1297998C Interconnection system for integrated circuit chips
03/22/1992CA2051929A1 Polybenzazole polymers containing perfluorocyclobutane rings
03/22/1992CA2051795A1 Polyimide film with tin or tin salt incorporation resulting in improved adhesion
03/19/1992WO1992004811A1 Flexible printed circuit board and its manufacturing
03/19/1992WO1992004793A1 Modular protected entrance terminal
03/19/1992DE4029870A1 Modified resin prepn. by reacting phenol and formaldehyde - then treating with aryl phosphate, alcohol, and adduct of tetra:bromo-bisphenol-A with epoxide¨ resin or drying oil
03/19/1992DE4028978A1 Solder contact element for PCB - has reception zone for lead of SMD and through contact
03/18/1992EP0475630A2 Software reconfigurable transmission line apparatus
03/18/1992EP0475611A2 High modulus silicones as toughening agents for epoxy resins
03/18/1992EP0475567A2 Method for fabricating printed circuits
03/18/1992EP0475565A2 Electronic circuits and a method for their manufacture by means of ultrasonic welding
03/18/1992EP0475321A2 Epoxy resin film and method of producing it
03/18/1992EP0475145A1 Metal-film laminate resistant to delamination
03/18/1992EP0474904A1 Gear drive assembly for a commutator motor, in particular window raising drive for an automotive vehicle, and method for its manufacture
03/18/1992EP0474879A1 Paste for high temperature baking
03/18/1992CN1059606A Apparatus for providing electrical conduits in compact arrays of electronic circuitry utilizing cooling devices
03/18/1992CN1015952B Embedded catalyst receptors for metallization of dielectrics
03/18/1992CA2051272A1 Method for preparing green sheets
03/17/1992US5097390 Printed circuit and fabrication of same
03/17/1992US5097247 Heat actuated fuse apparatus with solder link
03/17/1992US5097101 Method of forming a conductive contact bump on a flexible substrate and a flexible substrate
03/17/1992US5096998 Unsaturated imide end groups, multilayer flexible metal-clad laminates
03/17/1992US5096987 Dipropargyl ether or alpha, alpha'-bis(4-hydroxyphenyl)-para-diisopropylbenzene
03/17/1992US5096788 Weldless battery pack
03/17/1992US5096771 Fireproof laminate
03/17/1992US5096749 Method of producing a metallization layer structure
03/17/1992US5096428 Header device
03/17/1992US5096425 Pin-shaped or flat-plate-shaped parallel terminals of an electronic or piezoelectric component for being inserted in a printed circuit board
03/17/1992US5096352 Diamond coated fasteners
03/17/1992US5095628 Process of forming a rigid-flex circuit
03/17/1992CA1297595C Printed circuit with thermal dissipator
03/17/1992CA1297584C Security device for sensitive data
03/17/1992CA1297247C Molecularly oriented molded body of ultra-high-molecular-weight ethylene/polyene copolymer
03/12/1992DE4028440A1 Mfg. printed circuits from PCB(s) and hybrid(s) - using hybrid(s) in greenform to obtain shape for mounting before sintering
03/12/1992DE4027761A1 Spark suppressor element for electromotor switch=on - is in circuit board form with pins soldered onto motor interface
03/11/1992EP0474605A2 Assembly and method of assembly for the application of electronic components to flexible printed circuits
03/11/1992EP0474354A1 Dielectric ceramic body, method of producing the same and circuit board using the same
03/11/1992EP0474176A2 Thin film multilayer circuit and method of making thin film multilayer circuits
03/11/1992EP0474054A2 Flexible multi-layer polyimide film laminates and preparation thereof
03/11/1992EP0473970A2 Method for producing electric resonant circuits, particulary resonance-tag
03/11/1992EP0473929A1 Method of forming a thin film electronic device
03/11/1992EP0473912A2 Electric circuit and method to manufacture the same
03/11/1992EP0454734A4 Devitrifying glass formulations for low expansion printed-circuit substrates and inks
03/11/1992EP0422213A4 Adhesion promotor for thermoplastic substrates
03/11/1992EP0243507B1 Flexible laminate for printed circuit board and process for its production
03/10/1992US5095407 Printed circuit
03/10/1992US5095405 Connector device having large number of connecting terminals arranged on arcuately guided connectors
03/10/1992US5095047 Epoxy resin composition and multilayer printed wiring board having insulating layer formed therefrom
03/10/1992US5094811 Method of making a printed circuit board
03/10/1992US5094713 Glass fibers, compounds of silicon or titanium
03/10/1992US5094574 Spot facing method and apparatus for printed circuit board
03/10/1992US5093987 Method of assembling a connector to a circuit element and soldering component for use therein
03/10/1992US5093986 Method of forming bump electrodes
03/10/1992US5093985 Method of assembly for small electrical devices
03/10/1992CA2045227A1 High memory density package
03/10/1992CA1297206C Electrostatic discharge protection for a printed circuit board
03/10/1992CA1297205C Method and apparatus for making a flexible interconnect
03/10/1992CA1297204C Multiple computer interface circuit board
03/10/1992CA1297203C Compliant s-leads for chip carriers
03/10/1992CA1297202C Printed circuit board components with alternate mounting modes
03/05/1992WO1992003903A1 Method of producing a soldered joint, and equipment with such joints
03/05/1992WO1992003901A1 Circuit board with electrical components, in particular surface-mounted devices
03/05/1992WO1992003887A1 Modular amplifier system for television distribution
03/05/1992WO1992003833A2 Thin-film resistance temperature device
03/05/1992WO1992003040A1 System for controlling the clamp means in a tree harvesting machine, especially grapple harvester
03/05/1992DE4027656A1 Contact element for circuit board with surface mounted devices - uses bent sheet metal C=shaped profile fitting around housing of surface mounted device
03/05/1992CA2050095A1 Dielectric composition containing cordierite and glass
03/04/1992WO1992004780A1 Ultra-small down-converter for satellite communication
03/04/1992EP0472776A2 Aluminum nitride powder, sintered body and production thereof
03/04/1992EP0248029B1 Method for selectively removing adhesives from polyimide substrates
03/04/1992CN1015771B Moulded printed circuit board