| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 03/23/1993 | US5196230 Gradual diameter increase of aperture in each insulating layer |
| 03/23/1993 | US5196089 Multilayer ceramic substrate for mounting of semiconductor device |
| 03/23/1993 | US5195908 Multicircuit cable connector |
| 03/23/1993 | US5195238 Method of manufacturing a printed circuit board |
| 03/23/1993 | CA1315013C Circuit board with cooling device |
| 03/18/1993 | WO1993005633A1 Manufacturing method for electrical circuit board |
| 03/18/1993 | WO1993005632A1 Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias |
| 03/18/1993 | WO1993005631A1 Power electronics substrate and process for making it |
| 03/18/1993 | WO1993004998A1 Method of making co-fired, multilayer substrates |
| 03/18/1993 | WO1993001634A3 Electrical connection system |
| 03/18/1993 | DE4229026A1 Flexible printed circuit board with decreased bending - comprises conductive path arranged between two layers of insulating material |
| 03/18/1993 | DE4129964A1 Fixing integrated circuit element onto printed circuit - attaching IC to plastics film having conductive tracks, cutting out film, sticking onto printed circuit, and connecting tracks |
| 03/18/1993 | CA2113451A1 Method of making co-fired, multilayer substrates |
| 03/17/1993 | EP0532301A1 Electrical appliance powered by an incorporated rechargeable battery |
| 03/17/1993 | EP0531764A1 Fluorinated carbon polyimide composites |
| 03/17/1993 | EP0531687A2 Low cost high frequency switched mode converter and method for making same |
| 03/17/1993 | EP0531500A1 Method of producing coaxial connections for an electronic component |
| 03/16/1993 | US5195154 Optical surface mount technology (o-smt), optical surface mount circuit (o-smc), opto-electronic printed wiring board (oe-pwb), opto-electronic surface mount device (oe-smd), and methods of fabricating opto-electronic printed wiring board |
| 03/16/1993 | US5195021 Constraining core for surface mount technology |
| 03/16/1993 | US5194933 Semiconductor device using insulation coated metal substrate |
| 03/16/1993 | US5194713 Punching apertures in fluorocarbon resins with glass fiber composites for composites |
| 03/16/1993 | US5194703 Push-button arrangement |
| 03/16/1993 | US5194697 Electrically conductive feedthrough connection and methods of manufacturing same |
| 03/16/1993 | US5194545 Bismaleimides and polyimides prepared therefrom |
| 03/16/1993 | US5194518 Polyimides, prepregs, fluoropolymers |
| 03/16/1993 | US5194459 Fluoropolymer insulating material containing hollow microspheres |
| 03/16/1993 | US5194326 Bonding plies for electronics |
| 03/16/1993 | US5194316 Polyimide layer laminate sheet |
| 03/16/1993 | US5194294 Process for preparing electrical connection means, in particular interconnection substances of hybrid circuits |
| 03/16/1993 | US5194196 Hermetic package for an electronic device and method of manufacturing same |
| 03/16/1993 | US5194189 Process for manufacturing continuous, supported polymeric sheet from polymerizable liquid starting materials |
| 03/16/1993 | US5194137 Solder plate reflow method for forming solder-bumped terminals |
| 03/16/1993 | US5194010 Surface mount electrical connector assembly |
| 03/16/1993 | US5193270 Method for joining a conductor track foil to an electrical component |
| 03/11/1993 | DE4230330A1 Tape carrier package for soldering multipin chip to substrate by hf heating - comprises base film with device hose, leads having lead sections extending outwardly for bonding to substrate and lead sections extending into device hole |
| 03/11/1993 | DE4129835A1 Leistungselektroniksubstrat und verfahren zu dessen herstellung Power electronics substrate and method for its production |
| 03/11/1993 | DE4129332A1 Bus system for plug in processor modules for NC application - has local bus structure on each plug in module with interconnection provided by main bus |
| 03/11/1993 | CA2072727A1 Copper-based paste containing copper aluminate, for microstructural and shrinkage control of copper-filled vias |
| 03/10/1993 | EP0531185A1 Supporting structure, especially for signalling lights of motor vehicles, and its manufacturing process |
| 03/10/1993 | EP0531126A1 Pattern structure of a printed circuit board |
| 03/10/1993 | EP0530929A2 Thermal head with heat-resistant insulating coating material |
| 03/10/1993 | EP0530840A1 Electric circuit board module and method for producing electric circuit board module |
| 03/10/1993 | EP0530656A1 Printed circuit with surface mounted plug connector |
| 03/10/1993 | EP0309593B1 Ceramic base and process for its production |
| 03/10/1993 | CN1069829A 可网版印刷的厚膜浆料组合物 Screen printable thick film paste composition |
| 03/09/1993 | US5192940 Flat resistance for blower control unit for automobile air conditioner and blower control unit using the same |
| 03/09/1993 | US5192937 Resistance unit for motor speed control |
| 03/09/1993 | US5192927 Microstrip spur-line broad-band band-stop filter |
| 03/09/1993 | US5192619 Flexible copper-applied substrates |
| 03/09/1993 | US5192590 Coating metal on poly(aryl ether ketone) surfaces |
| 03/09/1993 | US5192477 Surface treatment of polyamide moldings |
| 03/09/1993 | US5192214 Planar interconnect with electrical alignment indicator |
| 03/09/1993 | US5191708 Manufacturing method of a probe head for semiconductor LSI inspection apparatus |
| 03/09/1993 | CA1314313C Low-loss electrical interconnects |
| 03/09/1993 | CA1314304C Electrostatic discharge protection for electronic packages |
| 03/04/1993 | DE4129056A1 Printed circuit board mounting for LED elements - has LED located in circuit board aperture, engaging with large cross section contact strips |
| 03/03/1993 | EP0530096A1 Printed circuit substrate configuration and structure |
| 03/03/1993 | EP0530052A1 Method of manufacturing multilayer electronic component |
| 03/03/1993 | EP0530036A1 Base board for printed circuit board |
| 03/03/1993 | EP0530003A1 Resistive metal layers and method for making same |
| 03/03/1993 | EP0529752A2 Via metallization for A1N ceramic electronic package |
| 03/03/1993 | EP0529298A2 Method for making thick film/solder joints |
| 03/03/1993 | EP0529267A2 Terminal block for telecommunications and data systems engineering |
| 03/03/1993 | EP0529097A1 Method of manufacturing two-layer tab tape |
| 03/03/1993 | EP0489118A4 Multi-layer circuit board that suppresses radio frequency interference from high frequency signals |
| 03/03/1993 | CN1020012C Coil arrangement |
| 03/02/1993 | US5191404 High density memory array packaging |
| 03/02/1993 | US5191182 Tuneable apparatus for microwave processing |
| 03/02/1993 | US5191174 High density circuit board and method of making same |
| 03/02/1993 | US5190813 Polytetrafluoroethylene, cation exchange resin, platinum |
| 03/02/1993 | US5190808 Norbornene-type copolymers, laminates |
| 03/02/1993 | US5190796 Method of applying metal coatings on diamond and articles made therefrom |
| 03/02/1993 | US5190793 Refractory covercoat for semicondutor devices and methods of making and using the same |
| 03/02/1993 | US5190601 Surface structure of ceramics substrate and method of manufacturing the same |
| 03/02/1993 | US5190463 High performance metal cone contact |
| 02/27/1993 | CA2076738A1 Resistive metal layers and method for making same |
| 02/27/1993 | CA2071778A1 Low dielectric inorganic composition for multilayer ceramic package |
| 02/24/1993 | EP0528323A1 A tape automated bonding (TAB) semiconductor device and method for making the same |
| 02/24/1993 | EP0527980A1 Specific microsieve, specific composite body. |
| 02/24/1993 | CA2076421A1 Method for making thick film/solder joints |
| 02/23/1993 | US5189598 Dual function microboard with a row of connectors on two edges |
| 02/23/1993 | US5189539 Drive line wiring for liquid crystal display |
| 02/23/1993 | US5189275 Printed circuit assembly with contact dot |
| 02/23/1993 | US5189261 Electrical and/or thermal interconnections and methods for obtaining such |
| 02/23/1993 | US5189128 Solution stable polyimide resin systems |
| 02/18/1993 | WO1993003593A1 Electrical connection, especially through contacts on a printed circuit board |
| 02/18/1993 | WO1993003526A1 Joint assembly for power and signal coupling between relatively rotatable structures |
| 02/18/1993 | WO1993003442A1 Multiboard multiprocessor connector system |
| 02/18/1993 | WO1993003207A1 Method for making metal sublayer based on aluminium or its alloys |
| 02/18/1993 | WO1993002979A1 Dielectric material for high frequency and resonator made thereof, and manufacture thereof |
| 02/18/1993 | WO1993002831A1 Solder plate reflow method for forming a solder bump on a circuit trace |
| 02/17/1993 | EP0527572A1 Formation of benzocyclobutene resin films |
| 02/17/1993 | EP0527468A1 High frequency module |
| 02/17/1993 | EP0527352A1 Screen-printable thick film paste composition |
| 02/17/1993 | EP0527156A1 Highly conductive polymer thick film compositions. |
| 02/17/1993 | CN1069157A Method for forming vias in multilayer circuits |
| 02/17/1993 | CN1069147A Epoxy molding composition for surface mount applications |
| 02/16/1993 | USRE34179 Temperature controlled hybrid assembly |
| 02/16/1993 | US5186813 Electrodeposition of a electroconductive polymer from a monomer having a oxidation potential lower than that of the second layer |
| 02/16/1993 | US5186383 Low and high melting alloys, cooling, resolidifying |