| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 02/10/1993 | EP0526992A2 Multilayer carrier for mounting an integrated circuit and method of making the same |
| 02/10/1993 | EP0526855A1 Conformal circuit for structural health monitoring and assessment |
| 02/10/1993 | EP0526847A1 Novel imidazole-silane compounds, process for producing the same, and metal surface finishing agent containing the same |
| 02/10/1993 | EP0526821A1 Electrical control apparatus comprising electrical conductors plated on a insulating housing |
| 02/10/1993 | EP0526707A1 Low temperature co-fired ceramic structure containing buried capacitors |
| 02/10/1993 | EP0526656A1 Wiring board |
| 02/10/1993 | EP0526484A1 Method for assembling a coil on a printed circuit. |
| 02/10/1993 | EP0285669B1 Functional film and process for its production |
| 02/09/1993 | US5185690 High dielectric constant sheet material |
| 02/09/1993 | US5185502 High power, high density interconnect apparatus for integrated circuits |
| 02/09/1993 | US5185215 Zirconia toughening of glass-ceramic materials |
| 02/09/1993 | US5185210 Photodefinable interlevel dielectrics |
| 02/09/1993 | US5185209 Electronic interconnect structure; pattern from prepolymer which is an ether of the oligomeric condensation product of a dihydric phenol and formaldehyde |
| 02/09/1993 | US5185185 Process of pretreatment of metal-plating resin molded articles |
| 02/09/1993 | US5185042 Generic solar cell array using a printed circuit substrate |
| 02/09/1993 | US5185040 Apparatus for forming electrode on electronic component |
| 02/09/1993 | US5184768 Solder interconnection verification |
| 02/09/1993 | US5184662 Method for clad-coating ceramic particles |
| 02/09/1993 | US5184516 Conformal circuit for structural health monitoring and assessment |
| 02/09/1993 | US5184399 Method of manufacturing circuit board |
| 02/09/1993 | CA2033227C Voltage-controlled oscillator mounted on laminated printed circuit board |
| 02/09/1993 | CA2021285C Ceramic multilayer wiring substrate |
| 02/09/1993 | CA1313545C Electrical connectors |
| 02/04/1993 | WO1993002485A1 Microstrip line and manufacturing method therefor |
| 02/04/1993 | WO1993001928A1 Production of controlled porosity in a dielectric system |
| 02/04/1993 | DE4223576A1 Mounting and contacting device on circuit board by silver@ bonding - using two component adhesive of resin contg. microencapsulated hardener and accelerator, useful for non-metallic circuit boards, conductive films, etc. |
| 02/04/1993 | DE4125420A1 Electrically high grade binder for printed circuit board - contg. bisphenol=A di:cyanate, bisphenol=A epoxide] resin and opt. brominated bisphenol=A |
| 02/04/1993 | DE4125157A1 Composite reinforced with glass fibre or fabric for use in mouldings - which is treated in plasma with fluorine cpd. for plasma deposition of fluorinated polymer, used for transport, domestic, electronic fields, etc. |
| 02/03/1993 | EP0526272A1 Glasses for electronic substrates and products thereof |
| 02/03/1993 | EP0526133A2 Polyimide multilayer wiring substrate and method for manufacturing the same |
| 02/03/1993 | EP0526107A1 Stepped multilayer interconnection apparatus and method of making the same |
| 02/03/1993 | EP0525956A2 Metal foil with improved bonding to substrates and method for making said foil |
| 02/03/1993 | EP0525810A1 A constant impedance transition between transmission structures of different dimensions |
| 02/03/1993 | EP0525703A1 Connector for local networks |
| 02/03/1993 | EP0525644A1 Circuit substrate for mounting a semiconductor element |
| 02/03/1993 | EP0525497A1 Method for forming vias in multilayer circuits |
| 02/03/1993 | EP0525217A1 Carrier for electronic components |
| 02/03/1993 | EP0525087A1 Crosslinkable fluorinated aromatic ether compositions |
| 02/03/1993 | EP0525060A1 Miniature multiple conductor electrical connector. |
| 02/03/1993 | EP0524930A1 Fluorinated poly(arylene ethers). |
| 02/03/1993 | EP0478562A4 Snap fit contact assembly |
| 02/02/1993 | US5184284 Method and apparatus for implementing engineering changes for integrated circuit module |
| 02/02/1993 | US5184210 Structure for controlling impedance and cross-talk in a printed circuit substrate |
| 02/02/1993 | US5184209 Ic card and manufacturing method therefor |
| 02/02/1993 | US5184111 Circuit arrangement on a support film |
| 02/02/1993 | US5184095 Constant impedance transition between transmission structures of different dimensions |
| 02/02/1993 | US5183973 Polyimide substrate; layer of titanium; plurality of gold conductors; thin film; no organic adhesives |
| 02/02/1993 | US5183969 Epoxy resin which changes color on curing; opeining to visualize change |
| 02/02/1993 | US5183711 Metallic ground layer on insulative film; electrically conductive filler in holes; prevents crosstalk |
| 02/02/1993 | US5183692 Polyimide coating having electroless metal plate |
| 02/02/1993 | US5183684 Ceramification of an alkylaluminum amide to nitride with high temperature in presemce of ammonia |
| 02/02/1993 | US5183593 Electrically conductive cement |
| 02/02/1993 | US5183553 Method of forming a high temperature resistant copper coating on an inorganic dielectric |
| 02/02/1993 | CA2073809A1 Solder maks defined printed circuit board |
| 02/02/1993 | CA1313426C Adapter for electronic testing equipment for circuit boards and similar |
| 01/28/1993 | DE4224567A1 Adhesive tape for tape automated bonding - has adhesive layer comprising polyamide resin, layer contg. inorganic filler, layer contg. siloxane] epoxide] resin and layer contg. maleimide resin |
| 01/28/1993 | DE4125018A1 Elektrische verbindung, insbesondere durchkontaktierung bei einer leiterplatte Electrical connection, in particular through connection with a circuit board |
| 01/28/1993 | DE4124455A1 Multilayer circuit board assembly for HF signal transmission - has two modules consisting of circuit boards with signal and reference tracks separated by insulating boards |
| 01/27/1993 | EP0524761A1 Plastic pin grid array package |
| 01/27/1993 | EP0524744A1 Base board for printed circuit board |
| 01/27/1993 | EP0524430A1 Device for mounting an LC-Display on a circuit board |
| 01/27/1993 | EP0497871A4 Method of manufacturing a multilayered circuit board |
| 01/26/1993 | US5182780 Optical backplane interconnecting circuit boards |
| 01/26/1993 | US5182421 Printed wiring board with test pattern for through holes |
| 01/26/1993 | US5182050 Extrinsically/intrinsically conductive gel |
| 01/26/1993 | US5181859 Electrical connector circuit wafer |
| 01/26/1993 | US5181854 Press-contact type electric connector for a flat, flexible cable |
| 01/26/1993 | US5181317 Method of making an engineering change to a printed wiring board |
| 01/26/1993 | CA1313263C Apparatus and method for tracking and identifying printed circuit assemblies |
| 01/26/1993 | CA1313238C Electrical connectors |
| 01/21/1993 | WO1993001634A2 Electrical connection system |
| 01/21/1993 | WO1993001062A1 A method and product for improved glass fiber reinforced and filled thermoplastic and thermosetting resin systems |
| 01/21/1993 | DE4123870A1 Monitoring electronic assemblies with components on base carrier - measuring temp. at widely different points on carrier from variation in voltage applied to thermo-wires to detect burn through of components or conductor paths in module |
| 01/21/1993 | DE4123407A1 Compact HF current supply, esp. for lap top computer or fax machine - has components mounted on foldable circuit board halves which, when folded, cause components to face each other |
| 01/21/1993 | DE4123370A1 Method for producing electrical circuits based on flexible conductor plates - has rear side of copper@ laminated flexible basic material connected to mechanically stable auxiliary carrier with low heat expansion |
| 01/20/1993 | EP0523598A1 Ceramics circuit board |
| 01/20/1993 | EP0523479A2 Method for fabricating metal core layers for a multi-layer circuit board |
| 01/20/1993 | EP0523421A1 Boards for high frequency circuits |
| 01/20/1993 | EP0494913A4 Electro-active cradle circuits for the detection of access or penetration |
| 01/20/1993 | CN1068155A Metal foil with improved bonding to substrates and method for making said foil |
| 01/20/1993 | CN1068154A Metal foil with improved peel strength and method for making said foil |
| 01/19/1993 | US5181065 Flexible printed board for use in cameras |
| 01/19/1993 | US5180942 Thermally isolated ovenized crystal oscillator |
| 01/19/1993 | US5180867 Copolymerization of dicyclopentadiene with norbornene derivatives |
| 01/19/1993 | US5180645 Integral solid state embedded power supply |
| 01/19/1993 | US5180627 Heat resistant adhesive composition |
| 01/19/1993 | US5180625 Ceramic aluminum laminate and thermally conductive adhesive therefor |
| 01/19/1993 | US5180523 Polymer carriers, fillers, mixing and agglomeration to form powder particles |
| 01/19/1993 | US5180513 Shielded plastic enclosure to house electronic equipment |
| 01/19/1993 | US5180440 Printed circuit thermocouple arrangements for personnel training and equipment evaluation purposes |
| 01/19/1993 | US5180311 Resilient interconnection bridge |
| 01/19/1993 | US5180097 Method of mounting an electronic part onto a printed circuit board |
| 01/17/1993 | CA2073155A1 Dual curing composition and use thereof |
| 01/14/1993 | DE4121304A1 Cleaning agent for removing pastes from thick layer hybrid technology substrates - comprising water, limonene and surface active additives, is non-toxic and allows use of ultrasound |
| 01/13/1993 | EP0522633A2 Electric lamp having a cap of synthetic resin |
| 01/13/1993 | EP0522622A1 Composite green ceramic layer |
| 01/13/1993 | EP0521982A1 Method for producing a printed circuit board. |
| 01/13/1993 | EP0521904A1 Modification of polymer surfaces |
| 01/13/1993 | CN1068007A Making method fo multi-layer electronic circuit |
| 01/12/1993 | US5179601 Method of manufacturing circuit structure by insert molding of electric and/or optical transmission medium |