| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 11/24/1992 | US5166292 Tetracarboxylic acid and diamine curable to imide films for high strength and heat resistance |
| 11/24/1992 | US5166108 Low temperature-sintering porcelain components |
| 11/24/1992 | US5165990 Styrene Polymer, Reinforcing Fiber |
| 11/24/1992 | US5165987 Adapting frequency band of oscillating circuit made from a metal-plastic-metal sandwich foil and sandwich foil for implementing the process |
| 11/24/1992 | US5165986 Copper conductive composition for use on aluminum nitride substrate |
| 11/24/1992 | US5165984 Stepped multilayer interconnection apparatus and method of making the same |
| 11/24/1992 | US5165957 Process for producing multilayer wiring structure |
| 11/24/1992 | US5165166 Method of making a customizable circuitry |
| 11/19/1992 | EP0514338A1 Mixtures of sprioheptadiene compounds |
| 11/19/1992 | EP0514074A2 Method of producing copper-clad laminated board |
| 11/19/1992 | EP0513643A1 Electronic package using closed pore composites |
| 11/19/1992 | EP0513376A1 Cubic molded article with built-in cubic conductor circuit and production method thereof |
| 11/19/1992 | EP0477291A4 Liquid crystal polymer film |
| 11/19/1992 | EP0288507B1 Process for preparing multilayer printed circuit boards |
| 11/18/1992 | CA2068833A1 Mixtures of spiroheptadienes |
| 11/17/1992 | US5165055 For decreasing electromagnetic and radio frequency interferences |
| 11/17/1992 | US5164916 High-density double-sided multi-string memory module with resistor for insertion detection |
| 11/17/1992 | US5164884 Device for cooling a power transistor |
| 11/17/1992 | US5164880 Electrostatic discharge protection device for a printed circuit board |
| 11/17/1992 | US5164818 Removable vlsi assembly |
| 11/17/1992 | US5164816 Polyamides, polyimides |
| 11/17/1992 | US5164737 Single turn ferrite rod antenna with mounting structure |
| 11/17/1992 | US5164699 Resistor structure in a cofired unitized multilayer circuit structure |
| 11/17/1992 | US5164698 Copper |
| 11/17/1992 | US5164692 Triplet plated-through double layered transmission line |
| 11/17/1992 | US5164547 Articles having a dielectric layer on a metal substrate having improved adhesion |
| 11/17/1992 | US5164460 Polyimide composite material and process for producing the same |
| 11/17/1992 | US5164342 Low dielectric, low temperature fired glass ceramics |
| 11/17/1992 | US5164264 Composite substrate |
| 11/17/1992 | US5164246 For semiconductors, aluminum nitride ceramics, electroconduc-tive coating, metal nitride, tungsten and molybdenum |
| 11/17/1992 | US5164245 Polyvinylidene fluoride, polymethyl methacrylate |
| 11/17/1992 | US5164141 Of thermoplastic polymers, reinforcement fibers, metals, pressing endless sheets at temperature above melting point |
| 11/17/1992 | US5163835 Contact assembly with grounding conductor support |
| 11/17/1992 | US5163833 Dual personal computer architecture peripheral adapter board |
| 11/17/1992 | US5163605 Method for mounting components to a circuit board |
| 11/17/1992 | US5163220 Method of enhancing the electrical conductivity of indium-tin-oxide electrode stripes |
| 11/12/1992 | WO1992020203A1 Integrated circuit packages using tapered spring contact leads for direct mounting to circuit boards |
| 11/12/1992 | WO1992020073A2 Conductive polymer compositions |
| 11/12/1992 | DE4114701A1 Electrical connector laminate for flat components, e.g. PCB and LCD - using metal- or graphite-coated hard mineral particles to provide conductivity perpendicular to it plane |
| 11/12/1992 | CA2102626A1 Integrated circuit packages using tapered spring contact leads for direct mounting to circuit boards |
| 11/11/1992 | EP0512701A2 Printed circuit board connecting device |
| 11/11/1992 | EP0512401A2 Low dielectric constant composite laminates filled with molecularly porous aerogels |
| 11/11/1992 | EP0280700B1 Circuit package attachment apparatus and method |
| 11/10/1992 | US5162977 Printed circuit board having an integrated decoupling capacitive element |
| 11/10/1992 | US5162971 High-density circuit module and process for producing same |
| 11/10/1992 | US5162896 IC package for high-speed semiconductor integrated circuit device |
| 11/10/1992 | US5162729 Embedded testing circuit and method for fabricating same |
| 11/10/1992 | US5162675 Dual personal computer architecture peripheral adapter board and circuit |
| 11/10/1992 | US5162450 Contaiing brominated and non-brominated bisphenol polyglycidyl ethers and catalysts; phsycial, electrical properties |
| 11/10/1992 | US5162240 Method and apparatus of fabricating electric circuit pattern on thick and thin film hybrid multilayer wiring substrate |
| 11/10/1992 | US5162191 Print heads |
| 11/10/1992 | US5162140 Flexible printed circuit board and coverlay film and manufacture methods therefor |
| 11/10/1992 | US5162062 Method for making multilayer electronic circuits |
| 11/10/1992 | US5161986 Low inductance circuit apparatus with controlled impedance cross-unders and connector for connecting to backpanels |
| 11/10/1992 | US5161980 Electrical interconnection of circuit devices |
| 11/10/1992 | US5161728 Coating on the ceramic a layer of metallizing composition, assembling metal with coated ceramic, heating to melt and cause reactions between composition ingredients and ceramic, keeping molten to allow liquid diffusion; dense, defect-free |
| 11/10/1992 | US5161403 Method and apparatus for forming coplanar contact projections on flexible circuits |
| 11/10/1992 | US5161305 Preparing aluminum nitride sintered body substrate, removing part of body by directing water jet to substrate surface |
| 11/10/1992 | CA1310138C Surface mount technology breakaway self regulating temperature heater |
| 11/10/1992 | CA1310137C Self regulating temperature heater with thermally conductive extensions |
| 11/10/1992 | CA1310099C Customizable circuitry |
| 11/10/1992 | CA1309941C Laminated plate for high frequency and method for producing same |
| 11/10/1992 | CA1309847C Tag and method of making same |
| 11/05/1992 | DE4114284A1 Workpiece handling arrangement esp. for PCB, etc. - aligns workpieces in trays before they reach processing station using camera and alignment arrangement |
| 11/04/1992 | EP0511833A2 Epoxy molding composition for surface mount applications |
| 11/04/1992 | EP0511691A2 Wet etching of chemically cured polyimide |
| 11/04/1992 | EP0511474A1 Electric connection for an electric motor |
| 11/04/1992 | EP0511339A1 Elastomeric seating member. |
| 11/04/1992 | EP0511301A1 Method for reducing shrinkage during firing of green ceramic bodies. |
| 11/04/1992 | EP0509992A4 Electrical connectors |
| 11/04/1992 | CN1018973B Unitary capacitance trimmer |
| 11/04/1992 | CN1018962B Anisotropically conductive polymeric matrix |
| 11/04/1992 | CN1018904B Polymeric films |
| 11/03/1992 | US5161098 AC adaptor |
| 11/03/1992 | US5161086 Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture |
| 11/03/1992 | US5161009 Ic module having a folding junction structure |
| 11/03/1992 | US5160787 Electrical laminate having ability to absorb ultraviolet rays |
| 11/03/1992 | US5160781 Polyimide composition and prepreg and laminate thereof |
| 11/03/1992 | US5160765 Coating paste, water vapor, hydrogen, oxygen, heating |
| 11/03/1992 | US5160409 Solder plate reflow method for forming a solder bump on a circuit trace intersection |
| 11/03/1992 | US5160374 Process and apparatus for preventing the pulse discharge of insulators in ionizing radiation |
| 11/03/1992 | US5160277 Snap-in lamp for printed circuits |
| 11/03/1992 | US5160270 Integrated circuit packages using tapered spring contact leads for direct mounting to circuit boards |
| 11/03/1992 | US5159751 Method of manufacturing electronic module assembly |
| 11/02/1992 | CA2066497A1 Epoxy molding composition for surface mount applications |
| 10/29/1992 | WO1992019090A1 Electrical power supply |
| 10/29/1992 | WO1992019089A1 Process for the production of fibre-reinforced substrates for the electrical industry |
| 10/29/1992 | WO1992019088A1 Protective coatings |
| 10/29/1992 | WO1992018213A1 High dielectric constant flexible ceramic composite |
| 10/29/1992 | DE4213250A1 Semiconductor assembly based on double sided circuit board - which can bend to absorb differential expansion of components soldered to either side in different positions |
| 10/29/1992 | DE4211824A1 Circuit board system for solid-state image sensor - has substrate with conductive pattern on both sides, insertable into support |
| 10/29/1992 | DE4113263A1 Copper@-coating of ceramic parts by electroless plating - used for metallisation of dielectric or coaxial resonators |
| 10/29/1992 | DE4113262A1 Electroless application of copper@ base coat to aluminium oxide ceramic substrate - by copper@ plating, selective varnishing, stripping and galvanic deposition of nickel@ and/or gold@, for prodn. of conducting strips |
| 10/29/1992 | DE4113261A1 Electroless application of copper@ base coat to reinforced teflon substrate - by removing copper@ lining on substrates with caustic ammonia etching bath, purifying substrate, catalysing substrate, chemical copper@ plating, drying and annealing |
| 10/28/1992 | EP0511162A1 Heat conducting adhesive films, laminates with heat conducting adhesive layers and their application |
| 10/28/1992 | EP0510869A2 Electrical connector having terminals which cooperate with the edge of a circuit board |
| 10/28/1992 | EP0510516A2 Sensor device on a substrate with an electrical link element and procedure to fabricate such a device |
| 10/28/1992 | EP0510477A1 Composition of polyarylene sulphides, dolomite and maleimides |
| 10/28/1992 | EP0510049A1 A method for manufacturing of mineature impedance matched interconnection patterns |
| 10/28/1992 | EP0509992A1 Electrical connectors. |