| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 08/25/1992 | US5142441 Circuit board with cooling device |
| 08/25/1992 | US5142268 Elimination of discrete capacitors in R/C networks |
| 08/25/1992 | US5142239 High frequency linear amplifier assembly |
| 08/25/1992 | US5142157 High density modular power switch drivers |
| 08/25/1992 | US5141976 Mixtures of polyarylene sulphides, nitroarylmethylidene ketones, glass fibers and optionally other fillers |
| 08/25/1992 | US5141972 Rigid microspheres fixed in pores of open-celled porous polytetrafluoroethylene |
| 08/25/1992 | US5141899 Low dielectric inorganic composition for multilayer ceramic package containing titanium silicate glass and crystal inhibitor |
| 08/25/1992 | US5141829 Method of preparing a photo-mask for imaging three-dimensional objects |
| 08/25/1992 | US5141800 Using unfused polytetrafluoroethylene layer to bond laminates together during sintering |
| 08/25/1992 | US5141798 Enamel for glass panes provided with silver conducting tracks |
| 08/25/1992 | US5141791 Curable polyphenylene ether-polyepoxide compositions from melt processed polyphenylene ethers, and laminates prepared therefrom |
| 08/25/1992 | US5141777 Highly conductive polymer thick film compositions |
| 08/25/1992 | US5141455 Mounting of electronic components on substrates |
| 08/25/1992 | US5140879 Variable array punch |
| 08/20/1992 | WO1992014281A1 Electrical connectors |
| 08/20/1992 | WO1992014280A1 Electrical connectors |
| 08/20/1992 | DE4104853A1 Detachable electric connection mfr. between circuit board and wiring - with contact members on edge of board integrally moulded with board |
| 08/19/1992 | EP0498898A1 Flexible printed circuit board and its manufacturing |
| 08/18/1992 | US5140706 Transmission-line transformer device for double-balanced miner |
| 08/18/1992 | US5140259 Meter device with integral sectional casing |
| 08/18/1992 | US5140110 Printed circuit board capable of preventing electromagnetic interference |
| 08/18/1992 | US5139924 Using closely packed insulated conductors embedded in radiation sensitive substrate which has conductive foil backing; simplification |
| 08/18/1992 | US5139852 Used for microelectronics such as semiconductor package; heat resistance, hermetic sealing, strees relieving, noncracking and high strength |
| 08/18/1992 | US5139851 Used for microelectronics such as semiconductor package; heat resistance, hermetic sealing, stree relieving, noncracking and high strength |
| 08/18/1992 | US5139819 Fast curing and storage stable thermoset polymer thick film compositions |
| 08/18/1992 | US5139813 Exposing coated surface to active plasma, then exposure to controlled-wave length light for detection of pinholes |
| 08/15/1992 | WO1992014864A2 Selective demetallization method and apparatus and products obtained by this method |
| 08/13/1992 | DE4103294A1 Electrically conductive vias through ceramic substrates - are made by drawing metal from tracks into holes by capillary action using filling of holes by suitable powder |
| 08/12/1992 | EP0498766A2 Modified polyarylenethers |
| 08/12/1992 | EP0498713A2 Process of mounting miniature electronic components with solderable leads on a flexible substrate |
| 08/12/1992 | EP0498677A2 Improvement in or relating to a printed-circuit board |
| 08/12/1992 | EP0498505A2 Epoxy resin composition for use in electrical laminates |
| 08/12/1992 | EP0498425A1 Glass fiber forming composition, glass fibers obtained from the composition and substrate for circuit board including the glass fibers as reinforcing material |
| 08/12/1992 | EP0498314A2 Cad apparatus for designing pattern of electric circuit |
| 08/12/1992 | EP0497871A1 Method of manufacturing a multilayered circuit board |
| 08/12/1992 | CN1063590A Orthogonal interconnection |
| 08/12/1992 | CN1017852B Miniature motor |
| 08/12/1992 | CN1017790B Transfer for automatic application |
| 08/11/1992 | US5138438 Lead connections means for stacked tab packaged IC chips |
| 08/11/1992 | US5138429 Precisely aligned lead frame using registration traces and pads |
| 08/11/1992 | US5138116 Mounting device for electronic component |
| 08/11/1992 | US5137791 Metal-film laminate resistant to delamination |
| 08/11/1992 | US5137751 Process for making thick multilayers of polyimide |
| 08/11/1992 | US5137456 High density, separable connector and contact for use therein |
| 08/11/1992 | US5137205 Symmetrical circuit arrangement for a x-y matrix electrode |
| 08/09/1992 | CA2060840A1 Printed-circuit board |
| 08/06/1992 | WO1992013435A1 Manufacturing multilayer ceramic substrate |
| 08/06/1992 | WO1992012875A1 Housing for motor vehicle electronics |
| 08/05/1992 | WO1992014345A1 Keypad apparatus |
| 08/05/1992 | EP0497556A1 Print coil device for double tuning circuit |
| 08/05/1992 | EP0497554A1 Hold-down terminal |
| 08/05/1992 | EP0497473A1 Integral edge connection of circuit cards |
| 08/05/1992 | EP0497284A2 Epoxy resin compositions for use in electrical laminates |
| 08/05/1992 | EP0497011A1 Circuit board assembly |
| 08/05/1992 | CN1063319A Preparation method of thin copper-clad invar sheets |
| 08/05/1992 | CA2074164A1 Keypad apparatus |
| 08/05/1992 | CA2060435A1 Modified polyarylene ethers |
| 08/04/1992 | US5136471 Laminate wiring board |
| 08/04/1992 | US5136470 Printed circuit board vibration stiffener |
| 08/04/1992 | US5136123 Multilayer circuit board |
| 08/04/1992 | US5136122 Braided fiber omega connector |
| 08/04/1992 | US5136120 Technique for reducing electromagnetic interference |
| 08/04/1992 | US5136015 Addition type imide resin prepolymer, manufacturing method thereof, prepreg and laminate thereof |
| 08/04/1992 | US5135993 High modulus silicones as toughening agents for epoxy resins |
| 08/04/1992 | US5135815 Reactive-oligoimide adhesives, laminates, and methods of making the laminates |
| 08/04/1992 | US5135595 Process for fabricating a low dielectric composite substrate |
| 08/04/1992 | US5135556 Method for making fused high density multi-layer integrated circuit module |
| 08/04/1992 | US5135412 Hold-down terminal |
| 08/04/1992 | US5134770 Method of fabricating a high-frequency transformer |
| 08/04/1992 | CA1306019C Controlled depth laser drilling system |
| 07/30/1992 | DE4102448A1 Electronic instrument - has light diode bodies fixed directly to conductor plate |
| 07/30/1992 | DE4102441A1 Ceramic-filled fluoro-polymer compsn. for electrical substrates - with silanised filler present to give improved flow properties, e.g. into through-holes |
| 07/30/1992 | DE4102349A1 Control appts. for current circuit monitoring - involves housing with inlet side covered by baseplate with pin contacts forming part of at least one stamp grid |
| 07/30/1992 | DE4102265A1 Gehaeuse kfz-elektronik Enclosures fcc electronics |
| 07/30/1992 | CA2060168A1 Circuit board assembly |
| 07/30/1992 | CA2059393A1 Hold-down terminal |
| 07/29/1992 | EP0496698A2 Flexible laminates |
| 07/29/1992 | EP0496491A1 Leadless chip resistor capacitor carrier for hybrid circuits and a method of making the same |
| 07/29/1992 | EP0496372A2 Process for coating a non-noble metal with a noble metal |
| 07/29/1992 | EP0496365A1 Compositions for the production of seed layers |
| 07/29/1992 | EP0496364A1 Composition for the production of seed layers |
| 07/29/1992 | EP0496334A1 A flexible base laminated with metal on both the surfaces and a process for producing same |
| 07/29/1992 | CN1063172A Optical backplane interconnecting circuit boards |
| 07/28/1992 | US5134546 Vehicle control unit structure |
| 07/28/1992 | US5134539 Multichip module having integral decoupling capacitor |
| 07/28/1992 | US5134508 Optical high-speed parallel backplane |
| 07/28/1992 | US5134461 Nickel alloy layer prevents diffusion of nickel into gold layer |
| 07/28/1992 | US5134252 Signal line |
| 07/28/1992 | US5134248 Thin film flexible electrical connector |
| 07/28/1992 | US5134202 Process for miscible blends of imide containing polymers with poly(aryl sulfones) |
| 07/28/1992 | US5134094 Single inline packaged solid state relay with high current density capability |
| 07/28/1992 | US5134029 Thermoconductivity, layers of lead oxide and bismuth oxide, aluminum nitride, alumina, silicon dioxide |
| 07/28/1992 | US5134018 Hybrid substrate |
| 07/28/1992 | US5133989 Process for producing metal-polyimide composite article |
| 07/28/1992 | US5133495 Method of bonding flexible circuit to circuitized substrate to provide electrical connection therebetween |
| 07/28/1992 | US5133120 Method of filling conductive material into through holes of printed wiring board |
| 07/28/1992 | US5133118 Surface mounted components on flex circuits |
| 07/28/1992 | US5133114 Spring clip for a heat seal connector |
| 07/26/1992 | CA2059892A1 Compositions for the production of seed layers |
| 07/26/1992 | CA2059891A1 Compositions for the production of seed layers |