| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 12/31/1991 | US5077115 Matrix; ceramic filler coated with rubbery polymer that bonds to the filler; thin film bonding poly; multilayer printed wiring boards |
| 12/31/1991 | US5077084 Process for producing a flexible printed base |
| 12/31/1991 | US5076796 Terminal pin for soldering to a printed circuit board |
| 12/31/1991 | CA1293783C Near-linear spring connect structure for flexible interconnect circuits |
| 12/31/1991 | CA1293605C Process for treating reinforced polymer composite |
| 12/30/1991 | CA2045832A1 Modified bisimide compositions |
| 12/27/1991 | EP0462384A1 Holder for maniature incandescent lamp |
| 12/27/1991 | EP0462266A1 Method for manufacturing flexible printed circuits, printed circuit thereby manufactured, and device for implementing the method. |
| 12/27/1991 | EP0428695A4 Improved three-dimensional circuit component assembly and method corresponding thereto |
| 12/27/1991 | EP0380634A4 Method of laser drilling fluoropolymer materials |
| 12/26/1991 | WO1991020175A1 Method for verifying solder interconnection by x-ray |
| 12/25/1991 | CN1057282A Thermally conductive adhesive |
| 12/24/1991 | US5075821 DC to DC converter apparatus |
| 12/24/1991 | US5075759 Surface mounting semiconductor device and method |
| 12/24/1991 | US5075252 Interdigitated trans-die lead method of construction for maximizing population density of chip-on-board construction |
| 12/24/1991 | US5075155 Porous support impregnated with binder of epoxy resin, bisphenol novolac, imidazole; storage stability, fast curing |
| 12/24/1991 | US5074969 Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate |
| 12/24/1991 | US5074037 Process for producing electrical connections on a universal substrate |
| 12/24/1991 | US5074035 Method of making thin film laminate printed circuit |
| 12/24/1991 | CA1293558C Hearing aid comprising printed circuit board |
| 12/24/1991 | CA1293544C Plated plastic castellated interconnect for electrical components |
| 12/24/1991 | CA1293434C Polynorbornene laminates |
| 12/22/1991 | CA2045086A1 Binder system |
| 12/18/1991 | EP0461989A1 Device using surface mounted electronic components and comprising a cooling device |
| 12/18/1991 | EP0461866A2 Nickel powder comprising ultra-fine spherical particles and method of producing the same |
| 12/18/1991 | EP0461702A1 Contact assembly |
| 12/18/1991 | EP0461609A1 Method of forming metallized layer on aluminum nitride base material |
| 12/18/1991 | EP0461269A1 High-frequency heating device |
| 12/18/1991 | EP0304472A4 Biased grinding assembly |
| 12/17/1991 | US5073840 Circuit board with coated metal support structure and method for making same |
| 12/17/1991 | US5073684 Sheet type storage battery and printed wiring board containing the same |
| 12/17/1991 | US5073683 Edge repair and reinforcement of flexible flat cables |
| 12/17/1991 | US5073607 Polyimide compositions containing polyorganosiloxane for improving atomic oxygen resistance |
| 12/17/1991 | US5073605 Curable blends; laminates for circuit boards; solvent resistance, nonflammable |
| 12/17/1991 | US5073526 Electronic package comprising aluminum nitride and aluminum nitride-borosilicate glass composite |
| 12/17/1991 | US5073462 Half acryloyl ester of bisphenol a, initiator, elastomeric bin der |
| 12/17/1991 | US5073438 Process for the preparation of laminates |
| 12/17/1991 | US5073180 Preheating green sheet to pyrolyze binders, adding steam to burn off, replacing steam, raising temperature to densify and crystallize, holding to seal vias, cooling |
| 12/17/1991 | US5072519 Method of producing electric circuit patterns |
| 12/17/1991 | CA1293305C High density ffc connector |
| 12/16/1991 | WO1991020088A1 Electrically conductive polymer thick film of improved wear characteristics and extended life |
| 12/16/1991 | CA2085220A1 Electrically conductive polymer thick film of improved wear characteristics and extended life |
| 12/15/1991 | CA2044413A1 Contact assembly |
| 12/12/1991 | WO1991019024A1 Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations |
| 12/12/1991 | DE4018387A1 PCB with film resistors in series - has slider contacting some resistors in parallel with additional adjustable resistors |
| 12/11/1991 | EP0460822A1 Integrated circuit packaging using flexible substrate |
| 12/11/1991 | EP0460668A2 IC module and a junction structure thereof |
| 12/11/1991 | EP0460559A2 Radial terminals type electronic component to insert in a printed circuit board |
| 12/11/1991 | EP0460554A1 Hybrid integrated circuit device |
| 12/11/1991 | EP0460548A2 Printed circuits and base materials precatalyzed for etal deposition |
| 12/11/1991 | EP0460539A2 Printed circuits and base materials having low Z-axis thermal expansion |
| 12/11/1991 | EP0460223A1 Board for surge absorbing device of communication line |
| 12/11/1991 | EP0389619A4 Curved plastic body with circuit pattern and method of making |
| 12/11/1991 | CN1056932A Isothermal termination block having multi-layer thermal conductor |
| 12/10/1991 | US5072333 Switching apparatus for high frequency signals with plural parallel printed circuit boards interconnected by alternating input and isolation lines |
| 12/10/1991 | US5072289 Wiring substrate, film carrier, semiconductor device made by using the film carrier, and mounting structure comprising the semiconductor device |
| 12/10/1991 | US5072283 Pre-formed chip carrier cavity package |
| 12/10/1991 | US5072193 Wire shielding for RF circuit boards and amplifiers |
| 12/10/1991 | US5072075 Double-sided hybrid high density circuit board and method of making same |
| 12/10/1991 | US5072074 High yield combined rigid and flexible printed circuits and method of manufacture |
| 12/10/1991 | US5071925 Polymer compositions |
| 12/10/1991 | US5071794 Comprises at least one crystallized, one non-crystallized and one alkaline earth metal silicate; useful in making multilayered circuits and electronic components |
| 12/10/1991 | US5071793 Low dielectric inorganic composition for multilayer ceramic package |
| 12/10/1991 | US5071714 Sputtering aluminum with copper; lower resistivity; superior electromigration |
| 12/10/1991 | US5071702 Fiber reinforced plastic bonded to electroconductive layer |
| 12/10/1991 | US5071701 Copolymer for use in preparing prepregs, printed circuit wiring boards prepared from such prepregs and processes for preparing such printed circuit wiring boards |
| 12/10/1991 | US5071363 Miniature multiple conductor electrical connector |
| 12/10/1991 | US5071223 Circuit structure formed by insert molding of electric and/or optical transmission medium |
| 12/10/1991 | US5070602 Method of making a circuit assembly |
| 12/10/1991 | US5070591 Method for clad-coating refractory and transition metals and ceramic particles |
| 12/05/1991 | DE4117938A1 Perforation method for PCB - partially depth drilling followed by laser finishing to required depth |
| 12/05/1991 | DE4117761A1 Semiconductor chip with film carrier - has lead wires between chip terminals and external electrodes applied to surface of film |
| 12/05/1991 | DE4117145A1 Chip mounting method on substrate - by heating adhesive layer to receiver chips from carrier |
| 12/05/1991 | DE4116826A1 Amplifier for piezoelectric force measuring appts. - is divided into feed voltage, charge amplifier, summation, and remote control modules |
| 12/05/1991 | DE4017752A1 Circuit board - is of format to receive electronic HF transistor stage |
| 12/04/1991 | EP0459876A1 Terminal adaptor as connector device |
| 12/04/1991 | EP0459831A2 Method and device for mounting components on a printed circuit board |
| 12/04/1991 | EP0459720A1 Metallized multilayer film |
| 12/04/1991 | EP0459472A1 Polyimide composite material and process for producing the same |
| 12/04/1991 | EP0459452A2 Aromatic polyimide film laminated with metal foil |
| 12/04/1991 | EP0459054A1 Isothermal termination block having a multi-layer thermal conductor |
| 12/04/1991 | EP0458984A1 Novel resin, process for preparing the same, and composition comprising the same |
| 12/04/1991 | CN1056793A Method for producing printed circuit board |
| 12/03/1991 | US5070529 Apparatus for sequential interconnection of electrical circuit boards |
| 12/03/1991 | US5070258 Integrated circuit having metal substrate used to provide electrical indication of operation mode of circuits |
| 12/03/1991 | US5070047 Dielectric compositions |
| 12/03/1991 | US5070046 Multilayer electronic circuits |
| 12/03/1991 | US5069971 With epoxy resins, printed circuits, diaminoalklyalkoxysilane |
| 12/03/1991 | US5069954 Offset printing pad, heat activated adhesive, for decoration o f ceramics |
| 12/03/1991 | US5069745 Process for preparing a combined wiring substrate |
| 12/03/1991 | US5069641 Modular jack |
| 12/03/1991 | US5069626 Plated plastic castellated interconnect for electrical components |
| 12/03/1991 | US5069213 Oximeter sensor assembly with integral cable and encoder |
| 12/03/1991 | US5069195 Apparatus for automatic separation along predetermined bending fracture lines in basic ceramic platelets of hybrid electronic circuits |
| 12/03/1991 | US5068962 Method of fabricating an energy meter |
| 12/03/1991 | CA1292826C Polyphenylene sulfide resin composition useful for plating |
| 12/03/1991 | CA1292824C Resin composition and a process for preparing laminates therefrom |
| 12/03/1991 | CA1292668C Encapsulated assemblage and method of making |
| 12/01/1991 | CA2042995A1 Metallized multilayer film |
| 11/28/1991 | WO1991018489A1 Gtab manufacturing process and the product produced thereby |