Patents for H05K 1 - Printed circuits (98,583)
10/1992
10/27/1992US5159537 Mounting structure for electronic apparatus
10/27/1992US5159536 Panel board
10/27/1992US5159535 Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate
10/27/1992US5159532 Electronic control unit with multiple hybrid circuit assemblies integrated on a single common ceramic carrier
10/27/1992US5159433 Hybrid integrated circuit device having a particular casing structure
10/27/1992US5158827 Poly-4-methyl-1-pentene laminated to paper; preparation of cladding panels for multi-layer printed circuit boards
10/27/1992US5158820 Signal carrier supports with apertured dielectric layer
10/27/1992US5158708 Binder of polyhydroxystyrene derivative and thermosetting resins
10/27/1992US5158657 Circuit substrate and process for its production
10/27/1992US5158466 Electrical connector part
10/27/1992US5158465 Audio jack connector
10/27/1992US5157829 Method of burn-in testing of circuitry
10/27/1992US5157828 Method and device for fastening an electronic circuit substrate onto a support
10/25/1992CA2066867A1 Heat-conductive adhesive films, laminated with heat-conductive adhesive layers and the use thereof
10/21/1992EP0509466A1 Device for irreversible functioning interruption of an apparatus controlled by an electronic system
10/21/1992EP0509380A2 Improvement in or relating to a press-contact type electric connector for a flat, flexible cable
10/21/1992EP0509262A2 Solder-coated printed circuit board and method of manufacturing the same
10/20/1992US5157724 Weighted telephone base assembly
10/20/1992US5157589 Mutliple lamination high density interconnect process and structure employing thermoplastic adhesives having sequentially decreasing TG 's
10/20/1992US5157580 Protective plug for connector banks of telecommunication and data systems
10/20/1992US5157578 Hybrid printed circuit board
10/20/1992US5157480 Semiconductor device having dual electrical contact sites
10/20/1992US5157477 Electrical wiring structure
10/20/1992US5157326 Board assembly for validation and characterization of a bus system
10/20/1992US5157107 Heat-resistant insulating coating material and thermal head making use thereof
10/20/1992US5156923 Heat-transferring circuit substrate with limited thermal expansion and method for making
10/20/1992US5156903 Internal and surface electroconductor layers connected through metal layer formed by firing organometallic paste coating
10/20/1992US5156772 Circuit writer materials
10/20/1992US5156771 Comprising a metal powder, a binder of a homo- or copolymer of a substituted hydroxystyrene and a solvent; printed circuits; noise shield; durability; adhesion
10/20/1992US5156732 Etched with sulfuric acid to form hydrophilic denatured layer; etached with aliphatic diamine, then quaternary hydroxide
10/20/1992US5156710 Forming intractable and thermoplastic polyimide films on substrate, curing rapidly at low temperature, contacting with foil, applying low degassing pressure, increasing pressure and heating
10/20/1992US5156649 Test clip adapter for integrated circuit device
10/20/1992US5156552 Circuit board edge connector
10/20/1992US5156322 Applying layers of copper and silver galvanically or chemically to specified thickness improves adhesion
10/20/1992CA2065709A1 Irreversible arrangement for interrupting the functioning of an apparatus controlled by an electronic system
10/15/1992WO1992017994A1 Multilayer printed circuit board and method of manufacture
10/15/1992WO1992017921A1 Contact device for an electrical or electronic component
10/15/1992WO1992017905A1 Method for producing coaxial connections for electronic components, and component casing containing such connections
10/15/1992WO1992017532A1 Process for manufacturing prepregs containing solvent-free epoxy resin
10/15/1992WO1992017297A1 Fabrication of metal matrix composites by vacuum die casting
10/15/1992DE4111956A1 Multipole electrical circuit board connector - has socket contacts within socket housing cooperating with pin contacts attached to respective clamp poles
10/15/1992DE4111418A1 Verfahren zur herstellung von faserverstaerkten traegermaterialien fuer den elektrosektor A process for preparing faserverstaerkten traegermaterialien for the electric sector
10/14/1992EP0508951A2 Heat curable composition
10/14/1992EP0508946A1 Metal foil with structural surface
10/14/1992EP0508821A2 Process for manufacturing multi-layer glass ceramic substrate
10/14/1992EP0508735A2 Microwave filter
10/14/1992EP0508635A2 Attenuator apparatus and method of assembly
10/14/1992EP0508613A1 Multichip system and method of supplying clock signal therefor
10/14/1992EP0508368A2 Process for treating film comprising liquid crystal polymer
10/14/1992EP0508305A2 Mounting of electronic components on substrates
10/14/1992EP0508195A1 Method of forming a microelectronic package having a copper substrate
10/14/1992EP0508137A2 Liquid-crystal display device and process for producing the same
10/14/1992EP0508035A1 Process for metallising surfaces using metal powder
10/14/1992CN1065372A Solder-coated printed circuit board and method of manufacturing same
10/14/1992CN1065297A Process for producing paterned metal surface
10/14/1992CN1065280A Compositions of cupric alloy
10/14/1992CN1018621B Laser scribing system and method
10/13/1992US5155665 Copper sheet bonded to surface of ceramic substrate; hardness
10/13/1992US5155655 Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
10/13/1992US5155577 Integrated circuit carriers and a method for making engineering changes in said carriers
10/13/1992US5155378 Process and apparatus for establishing a unique address code on an individual module
10/13/1992US5155175 Dielectrics
10/13/1992US5155150 Blends of polyarylene sulfides, dolomite and maleic imides
10/13/1992US5155072 Useful in multilayer electric circuits and capacitors
10/13/1992US5155010 Photopolymerizable layer on support is exposed to light to modify surface thickness in a selective area to accept a color layer from a color carrier; compression, removal of color carrier so color remains on image carrier
10/13/1992US5154644 Edge connector for a printed circuit card
10/13/1992US5154546 Method for drilling multilayer printed circuit boards
10/13/1992US5153986 Method for fabricating metal core layers for a multi-layer circuit board
10/13/1992US5153985 Method of assembly for the application of electronic components to flexible printed circuits
10/13/1992CA2065206A1 Method of manufacturing a high frequency filter and a high frequency filter manufactured according to the method
10/13/1992CA2061296A1 Method for metallizing surfaces by means of metal powders
10/13/1992CA1308817C Low dielectric composite substrate
10/13/1992CA1308641C Process for the preparation of laminates
10/11/1992CA2063503A1 Metal foil with a structure surface
10/08/1992DE4110686A1 Kontaktanordnung fuer ein elektrisches oder elektronisches bauteil Contact arrangement for an electrical or electronic component
10/08/1992DE4108651C1 Screen printing method reproducing consistent coat thicknesses on substrates - measuring distance between underneath side of film and surface to be printed and supplying computer with result for registering any deviation
10/07/1992EP0507719A1 Improved glass-ceramic to copper adhesion
10/07/1992EP0507332A2 Laminate
10/07/1992EP0507271A2 Epoxy resin compositions for use in electrical laminates
10/07/1992EP0507021A1 System for electrically interconnecting component boards
10/06/1992US5153814 Mounting system for electrical function units, particularly for data technology
10/06/1992US5153707 Film material for manufacturing film carriers having outer lead portions with inner and outer metallic layers
10/06/1992US5153705 Tab package and a liquid-crystal panel unit using the same
10/06/1992US5153590 Keypad apparatus
10/06/1992US5153384 Circuit board and process for manufacturing same
10/06/1992US5153084 Process for preparing a photo-mask for imaging three-dimensional objects
10/06/1992US5153051 Multilayer thermoplastic substrate
10/06/1992US5153024 Process for manufacturing a printed circuit board by coating a polymeric substrate with a modified polyamine layer and further contacting the coated substrate with noble metal ions
10/06/1992US5152931 Mixing organic vehicle and metallic powders, forming a paste; electroconductivity
10/06/1992US5152869 Process for obtaining passive thin-layer circuits with resistive lines having different layer resistances and passive circuit made by said process
10/06/1992US5152863 Reactive-oligoimide adhesives, laminates, and methods of making the laminates
10/06/1992CA1308494C Connection structure between components for semiconductor apparatus
10/06/1992CA1308454C Process for making close tolerance thick film resistors
10/01/1992WO1992016970A1 Method of manufacturing two-layer tab tape
10/01/1992WO1992016142A1 Low noise optical probe
10/01/1992DE4110219A1 Verfahren zur herstellung von prepregs mit loesungsmittelfreiem epoxidharz Process for the preparation of prepregs with solvent-free epoxy resin
09/1992
09/30/1992EP0506562A1 Electrical connecting process
09/30/1992EP0506366A2 High performance curable PPO/monomeric epoxy compositions with tin metal salt compatibilizing agent
09/30/1992EP0506260A2 Interconnection of opposite sides of a circuit board
09/30/1992EP0506217A2 Method for measuring deviations of the layers in a multilayer device and apparatus to realise this method