| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 04/28/1992 | US5108842 Curable dielectric polyphenylene ether-polyepoxide compositions useful in printed circuit board production |
| 04/28/1992 | US5108840 Multilayer electronic circuit article having a poly(naphthyl ether) dielectric |
| 04/28/1992 | US5108825 Noncracking, good adhesion, heat resistance |
| 04/28/1992 | US5108823 Process for the metallization of moldings of polyarylene sulfides |
| 04/28/1992 | US5108822 With dielectric film of reduced thickness |
| 04/28/1992 | US5108819 Thin film electrical component |
| 04/28/1992 | US5108785 Via formation method for multilayer interconnect board |
| 04/28/1992 | US5108541 Processes for electrically conductive decals filled with inorganic insulator material |
| 04/28/1992 | US5108026 Eutectic bonding of metal to ceramic |
| 04/28/1992 | US5107587 Method for the construction and application of a circuit-board interface for electrical connection in control and monitoring apparatus |
| 04/28/1992 | CA1299740C Black level drift compensator for use in a television receiver |
| 04/23/1992 | DE4033199A1 PCB mfr. using miniature through-pins - achieves high component density using vertical solder dipping process |
| 04/22/1992 | EP0481779A1 Radial and parallel bus structure |
| 04/22/1992 | EP0481778A1 Bus structure connecting means |
| 04/22/1992 | EP0481755A2 Electromagnetic windy structures, and methods for forming electromagnetic winding structures |
| 04/22/1992 | EP0481703A2 Interconnect structure for use with programming elements and test devices |
| 04/22/1992 | EP0481483A1 Method of manufacturing the front mask of a display device |
| 04/22/1992 | EP0481472A1 Multilayer printed wiring board and process for manufacturing the same |
| 04/22/1992 | EP0481308A1 Method of manufacturing ceramics circuit board |
| 04/22/1992 | EP0481271A1 Multilayer printed circuit board and manufacturing method |
| 04/22/1992 | EP0481177A1 Printed circuit board with soldered integrated circuit |
| 04/21/1992 | US5107397 Technique for component placement and orientation to improve circuit pack cooling |
| 04/21/1992 | US5107329 Pin-grid array semiconductor device |
| 04/21/1992 | US5107078 Electric connection or disconnection element, integrated circuit including such elements and the corresponding connection or disconnection method |
| 04/21/1992 | US5106673 Polyimide and fluoropolymer containing films and laminates |
| 04/21/1992 | US5106313 Header device |
| 04/21/1992 | US5106308 Planar contact grid array connector |
| 04/21/1992 | US5105537 High speed electrochemical etching in aqueous salt solution by selective anodic dissolution of mask-defined areas |
| 04/21/1992 | CA1299279C Hearing aid comprising a printed circuit film |
| 04/21/1992 | CA1299277C Jackfield with front removable jack modules having lamp assemblies |
| 04/20/1992 | CA2053562A1 Radial-and-parallel bus structure |
| 04/20/1992 | CA2053561A1 Means for connecting cpu boards to a radial-and-parallel bus structure |
| 04/16/1992 | WO1992006496A1 Multi-film hybrid circuit with power components |
| 04/16/1992 | WO1992006402A1 A fine sphere, a spherical spacer for a liquid crystal display element and a liquid crystal display element using the same |
| 04/16/1992 | WO1992005953A1 Composite metal plate |
| 04/15/1992 | EP0480703A2 Producing metal patterns on a substrate |
| 04/15/1992 | EP0480468A1 Glassy low dielectric inorganic composition |
| 04/15/1992 | EP0480194A2 High performance metal cone contact |
| 04/15/1992 | EP0480168A1 Apparatus to uniformly apply a force on a row of stacks in asintering oven |
| 04/15/1992 | EP0480038A1 Ceramic circuit board |
| 04/15/1992 | EP0479986A1 A multi-layer printed circuit board and a method for assuring assembly in a selected order. |
| 04/14/1992 | US5105340 Circuit board |
| 04/14/1992 | US5105261 Semiconductor device package having particular lead structure for mounting multiple circuit boards |
| 04/14/1992 | US5105055 Tunnelled multiconductor system and method |
| 04/14/1992 | US5104944 Process for nucleophilic derivatization of materials having an imide group conjugated to an aromatic moiety |
| 04/14/1992 | US5104734 Applying metal as metal benzotriazole; heating |
| 04/14/1992 | US5104480 Direct patterning of metals over a thermally inefficient surface using a laser |
| 04/14/1992 | CA1298770C Low dielectric constant laminate of fluoropolymer and polyaramid |
| 04/12/1992 | CA2051890A1 Crystal growth inhibitor for glassy low dielectric inorganic composition |
| 04/09/1992 | DE4040662C1 Electrical plug connector - has poly-flex circuit into which ends of contact pins are plugged |
| 04/09/1992 | DE4031733A1 Mehrlagenhybride mit leistungsbauelementen Multi-layer hybrid with power devices |
| 04/08/1992 | EP0478975A2 Process for producing a metal-organic polymer combination |
| 04/08/1992 | EP0478971A2 Dielectric composition containing cordierite and glass |
| 04/08/1992 | EP0478962A2 Microwave-stripline assembly |
| 04/08/1992 | EP0478879A2 A system of interconnecting electrical elements having differing bonding requirements for mounting said elements to a printed circuit board |
| 04/08/1992 | EP0478562A1 Snap fit contact assembly. |
| 04/08/1992 | CN1016219B Laminated veneer sheet for multilayer printing curcuit board |
| 04/07/1992 | US5103375 Electronic module assembly and method of manufacture |
| 04/07/1992 | US5103293 Polyimides |
| 04/07/1992 | US5103288 Semiconductor device having multilayered wiring structure with a small parasitic capacitance |
| 04/07/1992 | US5103247 Semiconductor device |
| 04/07/1992 | US5103071 Surface mount technology breakaway self regulating temperature heater |
| 04/07/1992 | US5102981 Imide prepolymer from bisimide, diamine and tribromophenylmaleimide |
| 04/07/1992 | US5102831 Method of manufacturing multi-chip package |
| 04/07/1992 | US5102829 Plastic pin grid array package |
| 04/07/1992 | US5102749 Electronic package comprising aluminum nitride and aluminum nitride-borosilicate glass composite |
| 04/07/1992 | US5102722 Functional film comprised of thermoplastic resin base substrate and coating layer |
| 04/07/1992 | US5102719 Ceramic, circuit substrate and electronic circuit substrate by use thereof and process for producing ceramic |
| 04/07/1992 | US5102352 High frequency electrical connector comprising multilayer circuit board |
| 04/07/1992 | CA1298619C Microwave converter |
| 04/07/1992 | CA1298451C Surface-roughened film and sheet, and process for production and use thereof |
| 04/03/1992 | CA2046086A1 Method and apparatus for burn-in testing of a printed circuit |
| 04/02/1992 | WO1992005677A1 Process for manufacturing circuits |
| 04/02/1992 | WO1992005206A1 Flame-retardant thermosetting resin composition |
| 04/02/1992 | DE4132169A1 Rigid polymer laminate with smooth outer surface for stamping - useful as printed circuit board substrate with glass fibre filled core of thermoplastic aryl ether¨ sulphone¨ polymer |
| 04/02/1992 | DE4030532A1 Hybrid multilevel circuit with metal substrate - bonded directly to glass-ceramic layer of lowest circuit level |
| 04/01/1992 | EP0478449A2 Screen printing ink and method of making a superconducting thick film by using this ink |
| 04/01/1992 | EP0478368A1 Integrated circuits and processes of manufacture |
| 04/01/1992 | EP0478320A2 Method for manufacturing printed circuit board |
| 04/01/1992 | EP0478313A2 A multilayer printed circuit board and manufacturing method therefor |
| 04/01/1992 | EP0478218A2 Structure of electric circuit for instrument panel of automobile and method for forming the same |
| 04/01/1992 | EP0478121A2 Signal routing in a stacked array of multiprocessor boards |
| 04/01/1992 | EP0478051A2 Method for the manufacture, in a continuous process, of substrates for printed wire boards, and printed wire boards so manufactured |
| 04/01/1992 | EP0478010A2 Process for producing a continuous web of an electrically insulated metallic substrate |
| 04/01/1992 | EP0477981A2 Multi-layer circuit substrate having a non-planar shape, and a method for the manufacture thereof |
| 04/01/1992 | EP0477881A2 Ceramic electrical component with terminal metallizations for electrical connection through conductive adhesives |
| 04/01/1992 | EP0477543A2 Method for conditioning halogenated polymeric materials and structures fabricated therewith |
| 04/01/1992 | EP0477291A1 Liquid crystal polymer film |
| 04/01/1992 | EP0477170A1 Method for the manufacture of multilayer printed circuit boards |
| 04/01/1992 | EP0464144A4 A multilayer film and laminate for use in producing printed circuit boards |
| 04/01/1992 | EP0275433B1 Method for mounting electronic components on a substrate, foil to carry out the method and method to produce the foil |
| 03/31/1992 | US5101324 Structure, method of, and apparatus for mounting semiconductor devices |
| 03/31/1992 | US5101323 Component-connecting device and functional module for the use thereof |
| 03/31/1992 | US5101322 Arrangement for electronic circuit module |
| 03/31/1992 | US5101177 Voltage controlled oscillator mounted on laminated printed circuit board |
| 03/31/1992 | US5100722 Glass fiber-reinforced resin composite materials |
| 03/31/1992 | US5100695 Improved adhesion of electroconductive inks, terminal portion has uneven surface, projections or depressions |
| 03/31/1992 | US5100523 Use of amorphous carbon to promote adhesion between electroactive polymer films and conductive substrates |
| 03/31/1992 | US5100492 Punching, reinsertion |
| 03/31/1992 | CA1298421C Unitary tuning structure |