| Patents for H05K 1 - Printed circuits (98,583) |
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| 06/23/1992 | US5124633 Dual sided printed circuit board test system |
| 06/23/1992 | US5124523 Process for adapting the frequency band of an oscillating circuit made from a metal-plastic-metal sandwich foil useful as an identification label, and sandwich foil for implementing the process |
| 06/23/1992 | US5124508 Application of sheet batteries as support base for electronic circuits |
| 06/23/1992 | US5124282 Thermally matched to alumina substrate |
| 06/23/1992 | US5124175 Method of patterned metal reflow on interconnect substrates |
| 06/23/1992 | US5123851 Integrated connector module with conductive elastomeric contacts |
| 06/23/1992 | US5123789 Method of and apparatus for machining printed circuit board |
| 06/23/1992 | US5123164 Hermetic organic/inorganic interconnection substrate for hybrid circuit manufacture |
| 06/23/1992 | CA1304182C2 Composition and method for sealing electronic parts |
| 06/23/1992 | CA1304062C2 Stacked circuit cards and guided vehicle configurations |
| 06/20/1992 | CA2058016A1 Norbornene dicarboximide polymer dielectric devices |
| 06/18/1992 | CA2057420A1 Tetrapolyimide film containing oxydiphthalic dianhydride |
| 06/18/1992 | CA2057408A1 Aromatic polyimides derived from aromatic dianhydrides and chlorinated aromatic diamines |
| 06/18/1992 | CA2057398A1 Tetrapolyimide film containing benzophenone tetracarboxylic dianhydride |
| 06/18/1992 | CA2053044A1 Deposition of electroactive polymers |
| 06/17/1992 | EP0490586A1 Method and apparatus for punching holes in a substrate |
| 06/17/1992 | EP0490530A2 Flexible circuit board |
| 06/17/1992 | EP0490211A2 Electronic circuit packages with tear resistant organic cores |
| 06/17/1992 | EP0489995A1 Flexible printed circuit package and flexible printed circuit for incorporation into such a package |
| 06/17/1992 | EP0489963A1 Means for handling green ceramic cards |
| 06/17/1992 | EP0489958A1 Circuit board for electronic control apparatus and method of making this circuit board |
| 06/16/1992 | US5123074 Substrate for mounting optical components and electric circuit components thereon and method for making same |
| 06/16/1992 | US5122930 For high speed signal tranmissions |
| 06/16/1992 | US5122929 Method of achieving selective inhibition and control of adhesion in thick-film conductors |
| 06/16/1992 | US5122691 Integrated backplane interconnection architecture |
| 06/16/1992 | US5122215 Screen printing a mixed dielectric paint as thin strips pattern, press bonding, desolventizing |
| 06/16/1992 | CA1303712C Optical semiconductor device |
| 06/16/1992 | CA1303436C Nickel particle plating system |
| 06/11/1992 | WO1992010079A1 Cubic molded article with built-in cubic conductor circuit and production method thereof |
| 06/11/1992 | WO1992010011A1 Device carrying a wire through the wall of a housing while maintaining a leaktight seal |
| 06/11/1992 | WO1992009665A1 Coating solution for forming transparent electrically conductive film, method of preparation thereof, electrically conductive substrate, method of preparation thereof, and display device having transparent electrically conductive substrate |
| 06/10/1992 | EP0489637A1 Procedure for the fabrication of a fibrous preform made of fire-resistant fibres in order to produce a composite material |
| 06/10/1992 | EP0489522A2 Display devices |
| 06/10/1992 | EP0489429A1 Method of producing flexible printed-circuit board covered with cover layer |
| 06/10/1992 | EP0489384A2 Method for orienting at least one electronic component placed on a printed circuit board |
| 06/10/1992 | EP0489163A1 Printed board for branching signal lines from numeric controller |
| 06/10/1992 | EP0489118A1 Multi-layer circuit board that suppresses radio frequency interference from high frequency signals. |
| 06/10/1992 | EP0229850B1 Connection terminals between substrates and method of producing the same |
| 06/09/1992 | US5121298 Controlled adhesion conductor |
| 06/09/1992 | US5121297 Flexible printed circuits |
| 06/09/1992 | US5121290 Circuit pack cooling using perforations |
| 06/09/1992 | US5120591 Conductive pattern board and method for producing the same |
| 06/09/1992 | US5120579 Bonding glass to dielectric |
| 06/09/1992 | US5120573 Coating polyamic acid alkyl ester on metallic film and curing it by heating |
| 06/09/1992 | US5120572 Integrated resistors and capacitors |
| 06/09/1992 | US5120473 Metallizing composition for use with ceramics |
| 06/09/1992 | US5120384 Method of manufacturing multilayer laminate |
| 06/09/1992 | US5120339 Method for fabricating a low thermal expansion coefficient glass fiber-reinforced polymer matrix composite substrate and composite substrate |
| 06/09/1992 | CA1303243C Method for manufacturing metal core printed circuit boards |
| 06/09/1992 | CA1303242C Mounting and connection system for electrical communications equipment |
| 06/09/1992 | CA1303240C Printed-wiring board |
| 06/09/1992 | CA1303235C Three-dimensional printed circuit board |
| 06/09/1992 | CA1302947C Copper-chromium-polyimide composite |
| 06/04/1992 | DE4038394A1 Anordnung zur dichten durchfuehrung eines leiters durch die wand eines gehaeuses Arrangement for the sealed conductors through the wall of a housing |
| 06/03/1992 | EP0488894A1 Connection system for removable device |
| 06/03/1992 | EP0488581A2 Flexible welding board for battery pack |
| 06/03/1992 | EP0488580A2 Process for spot-welding a flexible welding board to a battery cell |
| 06/03/1992 | EP0488535A2 Method and apparatus for manufacturing electrodes for multilayer ceramic capacitors |
| 06/03/1992 | EP0488057A1 Integrated backplane interconnection architecture |
| 06/03/1992 | EP0487950A1 Multilayer circuit board using the micro wiring technology |
| 06/03/1992 | EP0487857A2 Enhancement of polyimide adhesion on reactive metals |
| 06/03/1992 | EP0487640A1 Capacitor laminate for printed circuit board. |
| 06/02/1992 | USRE33947 Expansion laser beam; focusing; forming grooves |
| 06/02/1992 | US5119466 Control motor integrated with a direct current motor and a speed control circuit |
| 06/02/1992 | US5119286 Modular circuit board |
| 06/02/1992 | US5119273 High speed parallel backplane |
| 06/02/1992 | US5119272 Circuit board and method of producing circuit board |
| 06/02/1992 | US5119174 Light emitting diode display with PCB base |
| 06/02/1992 | US5119070 Resonant tag |
| 06/02/1992 | US5118643 Low dielectric inorganic composition for multilayer ceramic package containing titanium silicate glass |
| 06/02/1992 | US5118458 Method for molding an article integrated with a multi-layer flexible circuit and an apparatus for carrying out the method |
| 06/02/1992 | US5118386 Covering;, electroplating; etching; controlling height and diameter |
| 06/02/1992 | US5118028 Positioning insert; high frequency induction heating |
| 05/29/1992 | WO1992009186A1 Process for the production of copper-coated substrates |
| 05/29/1992 | WO1992008630A1 Elastomeric seating member |
| 05/27/1992 | EP0487338A1 A thin film conductive device and method of manufacture thereof |
| 05/27/1992 | CN1061491A Thermal stress-relieved composite microelectronic device |
| 05/26/1992 | US5117331 Bus control signal routing and termination |
| 05/26/1992 | US5117330 Fixture for circuit components |
| 05/26/1992 | US5117327 Conductors, thermoplastic |
| 05/26/1992 | US5117300 Electrical circuit device with different types of conductor paths |
| 05/26/1992 | US5117282 Stacked configuration for integrated circuit devices |
| 05/26/1992 | US5117069 Circuit board fabrication |
| 05/26/1992 | US5117068 Surface mount package for R.F. devices |
| 05/26/1992 | US5116700 Connected terminal pieces with planar base portion bonded to respective terminal and planar top end portion twisted perpendicular to base portion, each base facing in parallel with other base, top being outside element's outer perimeter |
| 05/26/1992 | US5116670 Composed of polybasic acid and polyhydric alcohol; ester bonded to one terminal; electronics |
| 05/26/1992 | US5116663 Ceramic substrate material containing an amorphous fluorine resin |
| 05/26/1992 | US5116657 Spheroid copper and copper oxide particles coated with organic titanium compound; printed circuit substrates |
| 05/26/1992 | US5116646 Method of metallizing oxide ceramic with excellent hermetic sealing and brazing properties |
| 05/26/1992 | US5116642 Thick film forming process |
| 05/26/1992 | US5116641 Method for laser scribing substrates |
| 05/26/1992 | US5116472 Process for coating substrates with an insulating coating |
| 05/26/1992 | US5116440 Process for manufacturing multilayer printed wiring board |
| 05/26/1992 | US5115964 Method for bonding thin film electronic device |
| 05/26/1992 | CA1301951C Surface mount connector |
| 05/22/1992 | CA2052414A1 Substrate with thin film conductive layer with highly conductive bus bar and method |
| 05/21/1992 | DE4036802A1 Verfahren zur herstellung von kupferkaschierten basismaterialtafeln A process for producing base materials copper-clad |
| 05/21/1992 | DE4036801A1 Copper@ covered circuit board continuous prodn. in double band press - at temp. no higher than glass transition temp. of cured prepreg resin to reduce undulation |
| 05/21/1992 | DE4036302A1 Support for electronic components - made of water setting gypsum or cement |
| 05/20/1992 | EP0486392A1 Hybrid circuit formed by two circuits whose tracks are joined by electrical connection balls |