| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 11/03/1993 | EP0568087A2 Reflow mounting of electronic component on mounting board |
| 11/03/1993 | EP0568064A2 Pb/Bi-containing high-dielectric constant oxides using a non-Pb/Bi-containing perovskite as a buffer layer |
| 11/03/1993 | EP0567993A1 Thermosetting imide oligomer and manufacturing method of heat resistant laminated sheet using the same |
| 11/03/1993 | EP0567772A1 Method for producing metal powder with a uniform distribution of dispersants, method of uses thereof and structures fabricated therewith |
| 11/03/1993 | EP0401341B1 Low temperature cofired ceramic packages for microwave and millimeter wave gallium arsenide integrated circuits |
| 11/03/1993 | CN1022663C Function unit |
| 11/02/1993 | US5258890 Device for connecting the connection pins of an integrated circuit mounted in a dual-in-line (DIL) package to printed circuitry on a printed circuit board in n different ways |
| 11/02/1993 | US5258887 Electrical device cooling system using a heat sink attached to a circuit board containing heat conductive layers and channels |
| 11/02/1993 | US5258866 Method of connecting liquid crystal display and circuit board with thermal expansion compensation |
| 11/02/1993 | US5258522 Imidazole-silane compounds and metal surface finishing agent containing the same |
| 11/02/1993 | US5258335 Low dielectric, low temperature fired glass ceramics |
| 11/02/1993 | US5258218 Laser scored |
| 11/02/1993 | US5257718 Method of bending and soldering corners of a folding printed-circuit board |
| 11/02/1993 | CA1323750C Method of manufacturing ceramic laminate |
| 10/31/1993 | CA2094752A1 Plated printed circuit |
| 10/28/1993 | WO1993021749A1 Dielectric substrate for ultrahigh frequences |
| 10/28/1993 | DE4312409A1 Electronic component or adjustable capacitor mfg. system - has concave section formed by burning off spaced films in thickness of ceramic laminate to form spaced thin layers which are then collapsed |
| 10/28/1993 | CA2094754A1 Multilayer board and fabrication method thereof |
| 10/27/1993 | EP0567403A1 Help panel for control and/or power supply of electrical elements in a vehicle |
| 10/27/1993 | EP0567209A2 Liquid crystal panel module and tape carrier package for liquid crystal driver IC |
| 10/27/1993 | EP0567016A2 Multi layered wiring board and method for manufacturing the same |
| 10/27/1993 | EP0426665B1 Method for manufacturing printed circuit boards |
| 10/27/1993 | EP0380545B1 Improved circuit board material and electroplating bath for the production thereof |
| 10/26/1993 | US5257165 Pin grid array adaptor mounting hardware |
| 10/26/1993 | US5257004 Variable passive element |
| 10/26/1993 | US5256900 Package for semiconductor device with at least one through hole |
| 10/26/1993 | US5256718 Flame retardant polyamide thermoplastic resin composition |
| 10/26/1993 | US5256470 Fired at low temperature; coefficient of thermal expansion; dielectric constant |
| 10/26/1993 | US5256247 Liquid etchant composition for thin film resistor element |
| 10/26/1993 | US5256235 Method for forming long thin flexible laminates |
| 10/26/1993 | US5256234 Laminate and process for producing it |
| 10/26/1993 | US5255929 Blade for ice skate |
| 10/26/1993 | US5255431 Method of using frozen epoxy for placing pin-mounted components in a circuit module |
| 10/26/1993 | CA1323693C Easily installable and easily expandable electromechanical memory assembly |
| 10/26/1993 | CA1323673C Low voltage lighting strip and method for producing same |
| 10/26/1993 | CA1323480C Heat-resistant stretched film and production process thereof |
| 10/21/1993 | DE4212950A1 Conductive pigment contg. lamellar and non-lamellar components - used in lacquer, printing ink, plastics system or coating, giving higher conductivity than either component alone |
| 10/20/1993 | EP0566360A1 Process for the production of substrate for printed wiring |
| 10/20/1993 | EP0566354A1 A flexible printed circuit sensor assembly for detecting optical pulses |
| 10/20/1993 | EP0566206A1 Electrical connection device |
| 10/20/1993 | EP0566043A2 Method of producing boards for printed wiring |
| 10/20/1993 | EP0495035A4 Method of applying metallized contacts to a solar cell |
| 10/20/1993 | CN1022511C Isothermal Termination block having multi-layer thermal conductor |
| 10/19/1993 | US5255155 Structure of electric circuit panel for instrument panel of automobile and method for forming the same |
| 10/19/1993 | US5254819 High-frequency heating apparatus with copper for grounding layer surrounding electromagnetic wave antenna |
| 10/19/1993 | US5254811 Hybrid microchip bonding article |
| 10/19/1993 | US5254493 Method of fabricating integrated resistors in high density substrates |
| 10/19/1993 | US5254361 Method for producing printed circuit boards |
| 10/19/1993 | US5253816 Material crushing roller construction |
| 10/19/1993 | CA1323462C Halogenated epoxy resins and advanced resins prepared therefrom |
| 10/14/1993 | WO1993020673A1 Circuit board connections |
| 10/14/1993 | WO1993020615A1 1.6 TO 3 GHz OSCILLATOR |
| 10/14/1993 | WO1993020562A1 Conductor-filled thermosetting resin |
| 10/14/1993 | WO1993020560A1 High-density double-sided multi-string memory module |
| 10/14/1993 | WO1993020519A1 Future bus bus termination network |
| 10/14/1993 | WO1993020517A1 Universal bus motherboard using a universal-to-specific bus translator card |
| 10/14/1993 | DE4211882A1 Conducting pathway layer structure for PCBs - comprising electrically conducting metallic conducting layers sepd. by metallic diffusion barrier layer |
| 10/14/1993 | CA2132842A1 Circuit board connections |
| 10/13/1993 | EP0565352A2 Aromatic diamine and polyimde, and preparation process of same |
| 10/13/1993 | EP0565151A2 Manufacture of multi-layer ceramic interconnect structures |
| 10/13/1993 | EP0565033A1 Method for fabricating a ceramic multi-layer substrate |
| 10/13/1993 | EP0564693A1 Film carrier type substrate and method of manufacturing the same |
| 10/13/1993 | EP0564652A1 Manufacture of multilayer ceramic part, and multilayer ceramic part |
| 10/12/1993 | US5253228 Interval timer |
| 10/12/1993 | US5253146 Earthed intermediate frame for circuit boards |
| 10/12/1993 | US5253144 Device housing having an integrated circuit board |
| 10/12/1993 | US5252988 Insulating substrate of heat resistance resin, heat releasing copper film, thermistors, electrodes, connectors, thermal accumulating layer |
| 10/12/1993 | US5252914 Radio communication transceiver |
| 10/12/1993 | US5252858 Glass frit fired with metal oxide filler and binder |
| 10/12/1993 | US5252782 Apparatus for providing RFI/EMI isolation between adjacent circuit areas on a single circuit board |
| 10/12/1993 | US5252781 Substrate member having electric lines and apertured insulating film |
| 10/12/1993 | US5252687 Thermosetting resin composition and use thereof for an electronic part |
| 10/12/1993 | US5252519 Multilayered ceramic substrate and method of manufacturing the same |
| 10/12/1993 | US5252503 Techniques for forming isolation structures |
| 10/12/1993 | US5252383 Metallized fluororesin with hydrophilic macromolecular film adhered |
| 10/12/1993 | CA2029818C Surface-mount filter |
| 10/12/1993 | CA2024383C Hermetic package for an electronic device and method of manufacturing same |
| 10/07/1993 | DE4205721A1 Conductor shrouding - uses a deposited plastics to give a semi=finished circuit ribbon or circuit board |
| 10/06/1993 | EP0564019A2 Multilayer thermoplastic electronic package and method of making same |
| 10/06/1993 | EP0563247A1 Photodefinable interlevel dielectrics |
| 10/06/1993 | EP0312607B1 Power circuit board and manufacturing method |
| 10/06/1993 | EP0242369B1 Surface mountable integrated circuit packages having solder bearing leads |
| 10/05/1993 | US5251108 Laminated electronic device with staggered holes in the conductors |
| 10/05/1993 | US5250816 Multichip system and method of supplying clock signal therefor |
| 10/05/1993 | US5250759 Surface mount component pads |
| 10/05/1993 | US5250758 Methods and systems of preparing extended length flexible harnesses |
| 10/05/1993 | US5250757 Printed wiring board having a connecting terminal |
| 10/05/1993 | US5250595 Flame-retardant resin composition |
| 10/05/1993 | US5250470 Method for manufacturing a semiconductor device with corrosion resistant leads |
| 10/05/1993 | US5250469 IC mounting circuit substrate and process for mounting the IC |
| 10/05/1993 | US5250394 Screen printing thick film paste in pattern; drying; firing to form conductive layer; repeating with metallorganic conductive noble metal paste |
| 10/05/1993 | US5250347 Mechanically enhanced, high impact strength triazine resins, and method of preparing same |
| 10/05/1993 | US5250229 A mixture of finely divided particle of oxides of bismuth, copper, lead, zinc and transition metal; thick films |
| 10/05/1993 | US5250130 Heating body and applying pressure in uniaxial direction |
| 10/05/1993 | US5249973 Card type junction box |
| 10/05/1993 | US5249355 Method of fabricating a multilayer electrical circuit structure |
| 09/30/1993 | WO1993019576A1 Method and apparatus for connecting fine pitch leaded electronic components to printed circuit boards |
| 09/30/1993 | WO1993019500A1 Low cross talk electrical connector system |
| 09/30/1993 | WO1993019432A1 Low-neighborhood three-dimensional interconnect |
| 09/29/1993 | EP0562725A2 Adaptor element for modifying electrical connections to an electrical component |