| Patents for H05K 1 - Printed circuits (98,583) |
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| 09/29/1993 | EP0562670A1 Method of manufacturing a plate of electrically insulating material having a pattern of apertures and/or cavities |
| 09/29/1993 | EP0562571A2 Printed circuit module |
| 09/29/1993 | EP0562569A2 Anisotropic adhesive for fixing an electronic component to a printed circuit module |
| 09/29/1993 | EP0562546A1 Electronic part assembly |
| 09/29/1993 | EP0562438A1 SDM type thermal protector |
| 09/29/1993 | EP0562340A2 Dimple interconnect for flat cables and printed wiring boards |
| 09/29/1993 | EP0562308A2 Charge plate connectors and method of making |
| 09/28/1993 | US5249098 Semiconductor device package with solder bump electrical connections on an external surface of the package |
| 09/28/1993 | US5248950 High frequency signal processing apparatus with biasing arrangement |
| 09/28/1993 | US5248853 Semiconductor element-mounting printed board |
| 09/28/1993 | US5248852 Resin circuit substrate and manufacturing method therefor |
| 09/28/1993 | US5248745 Copolymerization of dicyclopentadiene with norbornene derivatives |
| 09/28/1993 | US5248625 Techniques for forming isolation structures |
| 09/28/1993 | US5248530 Heat sealable coextruded lcp film |
| 09/28/1993 | US5248519 Coating with a polyimide solution which contains a lanthanide metal compound |
| 09/28/1993 | US5248451 Electrically conductive copper composition |
| 09/28/1993 | US5247735 Electrical wire deletion |
| 09/28/1993 | CA1322624C Polyimide film and its manufacturing method |
| 09/23/1993 | DE4209072A1 Stress free liquid crystal display system - embeds connections from conductors to printed circuit board leads in e.g. epoxy] resin which is cured in UV and unheated |
| 09/22/1993 | EP0561527A1 Solder application to a circuit board |
| 09/22/1993 | EP0561052A1 Heat resistant electrolaminates, preparation and use thereof |
| 09/22/1993 | EP0561048A2 Superior thermal transfer adhesive |
| 09/21/1993 | US5247423 Stacking three dimensional leadless multi-chip module and method for making the same |
| 09/21/1993 | US5247291 Display with improved frame surrounding display element |
| 09/21/1993 | US5247248 Burn-in apparatus and method of use thereof |
| 09/21/1993 | US5246564 Method of manufacturing copper-polyimide substrate |
| 09/21/1993 | US5246538 Adhesive bonding of poly(arylene sulfide) surfaces |
| 09/21/1993 | US5246386 Structure for and method of making a terminal plug |
| 09/21/1993 | US5245750 Method of connecting a spaced ic chip to a conductor and the article thereby obtained |
| 09/21/1993 | CA2019615C Wire scribed circuit boards and methods of their manufacture |
| 09/16/1993 | WO1993018549A1 Process and device for three-dimensional interconnection of housings for electronic components |
| 09/16/1993 | WO1993018077A1 Rigid-rod polymers |
| 09/16/1993 | WO1993018076A1 Rigid-rod polymers |
| 09/16/1993 | WO1993017860A1 Cyanate ester microwave circuit material |
| 09/16/1993 | DE4307600A1 Ceramic compsn. based on borosilicate glass, used in ceramic circuit board - contg. alumina filler and cordierite to control sintering temp., thermal expansion, dielectric constant and flexural strength |
| 09/15/1993 | EP0560718A2 Electronic read-only memory |
| 09/15/1993 | EP0560585A2 Circuit board for optical element |
| 09/15/1993 | EP0560502A2 Electronic circuit device and manufacturing method thereof |
| 09/15/1993 | EP0560384A1 Elastomeric metallized fabric and process of making same |
| 09/15/1993 | EP0560380A1 Elastic metallized film and process for making same |
| 09/15/1993 | EP0560084A2 Mechanically enhanced, high impact strength triazine resins, and method of preparing same |
| 09/15/1993 | EP0560077A2 Multichip module substrate and method of manufacture thereof |
| 09/15/1993 | EP0559876A1 Attenuation of polymer substrate degradation due to ultraviolet radiation |
| 09/15/1993 | EP0559863A1 Method for forming solder bump interconnections to a solder-plated circuit trace |
| 09/15/1993 | EP0540657A4 Shaped articles containing copolymers of polybenzazoles |
| 09/15/1993 | EP0398917B1 Ethers of the condensation products of phenoldicyclopentadiene adducts as thermosetting resins |
| 09/14/1993 | US5245509 Printed circuit board arrangement with surface-mounted connector strip and a method for manufacturing the arrangement |
| 09/14/1993 | US5245505 Capacitor element |
| 09/14/1993 | US5245269 Battery temperature sensing apparatus |
| 09/14/1993 | US5244999 Polyimide from diamine and bismaleimide having azole ring |
| 09/14/1993 | US5244833 Method for manufacturing an integrated circuit chip bump electrode using a polymer layer and a photoresist layer |
| 09/14/1993 | US5244712 Laminated diamond substrate |
| 09/14/1993 | CA1322083C Multiaxially oriented thermotropic polymer substrate for printed wire board |
| 09/13/1993 | CA2073783A1 Elastomeric metallized fabric and process to make the same |
| 09/09/1993 | DE4208594A1 Prefabricated electrical component fixing to PCB - serially mfg. unitary circuits for selective imposition on regions of circuit board requiring rectification or extension |
| 09/08/1993 | EP0559607A2 Epoxy resins based on triglycidyl isocyanurate |
| 09/08/1993 | EP0559384A2 Devices with tape automated bonding |
| 09/08/1993 | EP0559366A1 Stackable three-dimensional multiple chip semiconductor device and method for making the same |
| 09/08/1993 | EP0558855A2 Circuit board stack with novel cross-over cells |
| 09/08/1993 | EP0558841A1 Copper ink for aluminium nitride |
| 09/08/1993 | EP0558738A1 System for electrically interconnecting a plurality of daughter boards |
| 09/08/1993 | EP0290598B1 Ceramic/organic multilayer interconnection board |
| 09/07/1993 | US5243547 Limiting parasitic signal coupling between conductors |
| 09/07/1993 | US5243320 Resistive metal layers and method for making same |
| 09/07/1993 | US5243218 Cooling structure for electronics devices |
| 09/07/1993 | US5243144 Wiring board and process for producing the same |
| 09/07/1993 | US5243143 Solder snap bar |
| 09/07/1993 | US5243142 Printed wiring board and process for producing the same |
| 09/07/1993 | US5243130 Housing provided with conductive wires therein |
| 09/07/1993 | US5242991 Electronic circuits and molding materials |
| 09/07/1993 | US5242867 Composition for making multilayer ceramic substrates and dielectric materials with low firing temperature |
| 09/07/1993 | US5242641 Method for forming filled holes in multi-layer integrated circuit packages |
| 09/07/1993 | US5242623 Screen-printable thick film paste composition |
| 09/07/1993 | US5242535 Copper and copper oxides on ceramics formed by reduction of copper oxide and masking |
| 09/07/1993 | US5242511 Copper alloy compositions |
| 09/07/1993 | US5242100 Plated-through interconnect solder thief |
| 09/07/1993 | CA2026195C Isothermal termination block having a multi-layer thermal conductor |
| 09/02/1993 | WO1993017535A1 Housing for control devices |
| 09/02/1993 | WO1993017457A1 Substrate for mounting semiconductor and method of producing the same |
| 09/02/1993 | WO1993017069A1 Isotropic polyimide film and process for its preparation |
| 09/02/1993 | WO1993017063A1 Crosslinkable carbosilane polymer formulations |
| 09/02/1993 | WO1993017052A1 Fluorinated resins with low dielectric constant |
| 09/02/1993 | CA2131027A1 Fluorinated resins with low dielectric constant |
| 09/01/1993 | EP0558325A1 Raised feature on substrate for flip chip interconnection |
| 09/01/1993 | EP0558149A1 Epoxy resin and epoxy resin composition |
| 09/01/1993 | EP0557883A1 Laminated electronic module assembly |
| 09/01/1993 | EP0557812A2 Printed circuit substrate with projected electrode and connection method |
| 09/01/1993 | EP0455714B1 A method of manufacturing a substrate for placement of electrical and/or electronic components |
| 09/01/1993 | EP0360811B1 Solder connector device |
| 08/31/1993 | US5241454 Mutlilayered flexible circuit package |
| 08/31/1993 | US5241216 Ceramic-to-conducting-lead hermetic seal |
| 08/31/1993 | US5241145 Operation device for electronic apparatus |
| 08/31/1993 | US5241137 Flexible circuit board with an electrically insulating adhesive layer |
| 08/31/1993 | US5241040 Microwave processing |
| 08/31/1993 | US5240738 Method of applying solder to a flexible circuit |
| 08/31/1993 | US5240737 Method of manufacturing printed circuit boards |
| 08/31/1993 | US5240671 Method of forming recessed patterns in insulating substrates |
| 08/31/1993 | US5240588 Method for electroplating the lead pins of a semiconductor device pin grid array package |
| 08/31/1993 | US5240551 Preparing circuit pattern, connected by bridges, on a ceramic bonding circuit pattern to base and removing bridges by etching |
| 08/31/1993 | US5240422 Connector |