Patents for H05K 1 - Printed circuits (98,583)
11/1993
11/30/1993US5266746 Flexible printed circuit board having a metal substrate
11/30/1993US5266745 Thick film hybrid arrangement with outer contacts
11/30/1993US5266386 Etchable metal suppored on web of microwave transparent material
11/30/1993US5266385 For inspection of printed circuit patterns
11/30/1993US5266380 Method and apparatus for visual verification of proper assembly and alignment of layers in a multi-layer printed circuit board
11/30/1993US5266059 Generic rotatable connector assembly for testing integrated circuit packages
11/30/1993US5266036 Reduction of radio frequency emissions through terminating geometrically induced transmission lines in computer products
11/30/1993US5265322 Electronic module assembly and method of forming same
11/29/1993CA2096890A1 Soft, foldable consumer electronic products
11/25/1993WO1993023979A1 Substrate for printed circuit boards and method of making it
11/25/1993WO1993023801A1 Flexible wearable computer
11/25/1993WO1993023620A1 Process for preparing strong aromatic polyamide papers of high porosity
11/25/1993WO1993023246A1 Thin film metallization and brazing of aluminum nitride
11/25/1993CA2135771A1 Flexible wearable computer
11/25/1993CA2134340A1 Thin film metallization and brazing of aluminum nitride
11/24/1993EP0571236A1 Flexible welding board for battery pack
11/24/1993EP0571235A1 Process for spot-welding a flexible welding board to a battery cell
11/24/1993EP0571092A2 Single in-line memory module
11/24/1993EP0570709A2 Integrated circuit comprising shield lives
11/24/1993CN1078684A Epoxy glass fibre insulating material and its preparation method
11/23/1993US5264998 Electric lamp having a cap of synthetic resin
11/23/1993US5264664 Programmable chip to circuit board connection
11/23/1993US5264403 Dielectric ceramic composition containing ZnO-B2 O3 -SiO2 glass
11/23/1993US5264399 High purity amorphous silica fibers in borosilicate glass material, A glass ceremic material matrix or mixtures; high porosity strength and low dielectric constant
11/23/1993US5264388 Sintered body of aluminum nitride
11/23/1993US5264125 Process for manufacturing continuous supported ion selective membranes using non-polymerizable high boiling point solvents
11/23/1993US5264065 Printed circuits and base materials having low Z-axis thermal expansion
11/23/1993US5263868 Flexible circuit interface for coplanar printed circuit boards
11/23/1993US5263247 Method of fastening a busbar to a large-current printed circuit board
11/23/1993US5263245 Method of making an electronic package with enhanced heat sinking
11/23/1993US5263244 Method of making a flexible printed circuit sensor assembly for detecting optical pulses
11/23/1993US5263243 Method for producing multilayer printed wiring boards
11/23/1993US5263240 Method of manufacturing printed wiring boards for motors
11/20/1993CA2094312A1 Electric maze learning device or game apparatus and printed circuit switch and method of fabricating same
11/18/1993EP0570205A1 A method for producing metal wirings on an insulating substrate
11/18/1993EP0569801A1 Multilayer circuit board
11/18/1993EP0569762A1 Pattern formation in photohardenable dielectric layers
11/18/1993EP0569528A1 Electrical connectors
11/18/1993EP0569509A1 Electrical connectors
11/18/1993EP0538457A4 Fabrication of metal matrix composites by vacuum die casting
11/18/1993DE4215575A1 Stable solns. or dispersions for electronic circuit mfr. - comprises epoxy] resin using partially methylolated, partially etherified N-contg. base as flame retardant
11/18/1993DE4215553A1 SMD module with screen printed ohmic resistors - is produced from resistance paste mounted on PCB base material by screen or stencil and hardened by heat application
11/17/1993CN1078374A A flexible printed circuit sensor assembly for detecting optical pulses
11/17/1993CN1022746C Polynorbornene laminates and manufacturing method thereof
11/16/1993US5262922 Heat radiation structure for semiconductor device
11/16/1993US5262921 Directly cooled circuit board for an electronic power circuit
11/16/1993US5262754 Overvoltage protection element
11/16/1993US5262614 Circuit board and sealing structure and methods for manufacturing the same
11/16/1993US5262601 Printed circuit board switch with flexible armature or contact arm
11/16/1993US5262596 Printed wiring board shielded from electromagnetic wave
11/16/1993US5262595 Dielectric ceramic body including TiO2 dispersion in crystallized cordierite matrix phase, method of producing the same, and circuit board using the same
11/16/1993US5262594 Multilayer rigid-flex printed circuit boards for use in infrared reflow oven and method for assembling same
11/16/1993US5262590 Impedance controlled flexible circuits with fold-over shields
11/16/1993US5262507 Amine terminated siloxanes for curing epoxy resins
11/16/1993US5262501 Oligomers for laminates for copper printed circuits
11/16/1993US5262491 High performance curable PPO/monomeric epoxy compositions with tin metal salt compatibilizing agent
11/16/1993US5262227 Adhesive-free, heat and solder resistance, flexible printed circuits
11/16/1993US5262226 Anisotropic conductive film
11/16/1993US5261989 Straddle mounting an electrical conductor to a printed circuit board
11/16/1993US5261986 Method of fabricating ceramic laminated electronic component
11/16/1993US5261950 Composition for metalizing ceramics
11/16/1993US5261593 Direct application of unpackaged integrated circuit to flexible printed circuit
11/16/1993US5261158 Forming an electrical connector component
11/16/1993US5261155 Method for bonding flexible circuit to circuitized substrate to provide electrical connection therebetween using different solders
11/16/1993US5261153 In situ method for forming a capacitive PCB
11/11/1993WO1993022834A1 Circuit for the fast turning off of a field effect transistor
11/11/1993WO1993022774A1 Electromagnetic shielding materials
11/11/1993WO1993022352A1 Concentration of fluoropolymer dispersions using acrylic polymers of high acid content
11/10/1993EP0569242A2 Process for the production of copper-clad laminate
11/10/1993EP0568963A2 Chassis for television receiver
11/10/1993EP0568960A2 Energy dissipation resistor for implantable defibrillator
11/10/1993EP0568930A2 Method of manufacturing organic substrate used for printed circuits
11/10/1993EP0568853A1 Photoenhanced diffusion patterning for organic polymer films
11/10/1993EP0568733A2 Low profile copper foil and process and apparatus for making bondable metal foils
11/10/1993EP0559876A4 Attenuation of polymer substrate degradation due to ultraviolet radiation
11/10/1993CN1022691C Composition of free redical polymerization
11/09/1993US5261115 Multi-board system with shift board selection
11/09/1993US5260892 Computer memory module
11/09/1993US5260854 Modular circuit board placement system
11/09/1993US5260602 Hybrid integrated-circuit device having an asymmetrical thermal dissipator
11/09/1993US5260519 Multilayer ceramic substrate with graded vias
11/09/1993US5260518 Multilayer circuit board for mounting ICs and method of manufacturing the same
11/09/1993US5260408 Low thermal expansion coefficient polyimides with improved elongation
11/09/1993US5260407 Stretching, pyromellitic acid and 4,4'-bis(3-aminophenoxy) biphenyl
11/09/1993US5260377 With polycyclic polyene Diels-Alder cyclopentadiene reaction product, low dielectric constant, low moisture absorption, electronic devices
11/09/1993US5260168 Application specific tape automated bonding
11/09/1993US5260163 Photoenhanced diffusion patterning for organic polymer films
11/09/1993US5260130 Adhesive layer containing epoxy resin, nitrile rubber containing carboxy groups, curing agent and curing accelerator
11/09/1993US5260119 Sintered borosilicate and high silica glass mixture; printed circuits
11/09/1993US5259920 Involving an indicator layer of metal formed on surface of monitor substrate
11/09/1993US5259784 Printed circuit board assembly of vertical and horizontal printed boards
11/09/1993US5259436 Fabrication of metal matrix composites by vacuum die casting
11/09/1993US5259110 Method for forming a multilayer microelectronic wiring module
11/09/1993CA2016851C Method of manufacturing thick-film devices
11/04/1993DE4313980A1 Integrated hybrid circuit avoiding electrical disturbances - comprises conductor frame electrically connected to electronic components by silver paste with electroless plated coating on frame
11/03/1993EP0568392A2 Assembly structure and assembling method of flat type display device and apparatus and method for supplying and curing resin therefor
11/03/1993EP0568364A2 Plated printed circuit
11/03/1993EP0568224A2 Method of metallizing halogenated polyimide substrates
11/03/1993EP0568223A2 Metallized halogenated polyimide substrates
11/03/1993EP0568222A2 Method of producing modified polyimide layer having improved adhesion to metal