| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 12/28/1993 | US5273460 Electrical parts for surface mounting |
| 12/28/1993 | US5273440 Pad array socket |
| 12/28/1993 | US5273203 Ceramic-to-conducting-lead hermetic seal |
| 12/28/1993 | US5272980 Alignment method for transfer and alignment device |
| 12/23/1993 | WO1993026146A1 Thermal layout of thermoconductors |
| 12/23/1993 | WO1993026143A1 Process for producing printed circuit boards using a semi-finished product with extremely dense wiring for signal conduction |
| 12/23/1993 | WO1993026142A1 Three-dimensional printed circuit board, electronic circuit package using this board, and method for manufacturing this board |
| 12/23/1993 | WO1993026028A1 Thermal protection device and process for activating the same |
| 12/23/1993 | WO1993025968A1 A modular computer based on reconfigurable logic |
| 12/23/1993 | WO1993025898A1 Mediators to oxidoreductase enzymes |
| 12/23/1993 | DE4229001C1 Selectively metallising monolithic ceramic microwave filter - by electroplating, using ceramic foil as mask |
| 12/23/1993 | DE4220097A1 Photolithographic mask mfr. for multilayer printed circuit - involves deep-drawing of combined plastic film for laser irradiation of carbon black areas confined to thinner constituent |
| 12/23/1993 | CA2115052A1 Mediators to oxidoreductase enzymes |
| 12/23/1993 | CA2114954A1 Process for producing printed circuit boards using a semi-finished product with extremely dense wiring for signal conduction |
| 12/22/1993 | EP0575292A1 Process for manufacturing substrates with through-holes |
| 12/22/1993 | EP0574956A1 Metallized circuit substrate comprising nitride type ceramics |
| 12/22/1993 | EP0574934A1 Method for forming a patterned polyimide coating film on a substrate |
| 12/22/1993 | EP0574715A1 Method of forming a conductive end portion on a flexible circuit member |
| 12/22/1993 | EP0455658B1 Method and device for fastening an electronic circuit substrate onto a support |
| 12/22/1993 | CN1079827A Photoenhanced diffusion patterning for organic polymer films |
| 12/21/1993 | US5272664 High memory capacity DRAM SIMM |
| 12/21/1993 | US5272600 Electrical interconnect device with interwoven power and ground lines and capacitive vias |
| 12/21/1993 | US5272597 Attachment for surface-mounting a resonator crystal on a circuit board |
| 12/21/1993 | US5272596 Personal data card fabricated from a polymer thick-film circuit |
| 12/21/1993 | US5272307 Method and apparatus for laser soldering of microelectronic lead-pad assemblies on ceramic substrates |
| 12/21/1993 | US5272292 Irreversible arrangement for interrupting the functioning of an apparatus controlled by an electronic system |
| 12/21/1993 | US5272247 Polyimide precursor, cured product thereof, and processes for producing them |
| 12/21/1993 | US5272194 Process for preparing a strengthened polyimide film containing organometallic compounds for improving adhesion |
| 12/21/1993 | US5272186 Concentration of fluoropolymer dispersions using acrylic polymers of high acid content |
| 12/21/1993 | US5271962 Metallic composition and methods for making and using the same |
| 12/21/1993 | US5271887 Method of fabricating complex micro-circuit boards, substrates and microcircuits and the substrates and microcircuits |
| 12/21/1993 | US5271150 Method for fabricating a ceramic multi-layer substrate |
| 12/20/1993 | CA2098454A1 Housing assembly and conduit connections therewith |
| 12/18/1993 | CA2098426A1 Polymeric film |
| 12/16/1993 | WO1993026144A1 Process for producing subsequently conditionable contact points on circuit substrates and circuit substrates with such contact points |
| 12/16/1993 | DE4319045A1 Low porosity fluoro-polymer electric substrate material - comprises coated ceramic filler in matrix contg. both PTFE and another fluoro:polymer of lower melt viscosity |
| 12/16/1993 | DE4219554A1 Thermosicherung und Verfahren zu ihrer Aktivierung Thermal fuse and method for its activation |
| 12/16/1993 | DE4218883A1 Film gas sensor and measurement circuit assembly - mounts each sensor on ceramic carrier in aperture of printed circuit card for thermal decoupling and electrically connects carrier to card by wire bonding. |
| 12/16/1993 | CA2114792A1 Process for producing subsequently conditionable contact points on circuit substrates and circuit substrates with such contact points |
| 12/16/1993 | CA2098411A1 Method for producing substrates with passages |
| 12/15/1993 | EP0574286A1 Method for assembling hybrid circuits by vacuum bonding and assemblies produced by this method |
| 12/15/1993 | EP0574207A2 Multilayer printed circuit board and method for manufacturing the same |
| 12/15/1993 | EP0574206A2 Multilayer printed circuit board and method for manufacturing the same |
| 12/15/1993 | EP0574133A2 Switching midplane and interconnection sytem for interconnecting large numbers of signals |
| 12/15/1993 | EP0573714A2 Electrical connector circuit wafer |
| 12/15/1993 | EP0573595A1 Integral solid state embedded power supply |
| 12/15/1993 | EP0573534A1 Powder coating method for producing circuit board laminae and the like |
| 12/14/1993 | US5270964 Single in-line memory module |
| 12/14/1993 | US5270673 Surface mount microcircuit hybrid |
| 12/14/1993 | US5270672 Connecting arrangement for providing a releasable connection between two striplines |
| 12/14/1993 | US5270493 Printed circuit board having electromagnetic wave shield layer and self-contained printed resistor |
| 12/14/1993 | US5270485 High density, three-dimensional, intercoupled circuit structure |
| 12/14/1993 | US5270453 Aromatic bistriazene compounds |
| 12/14/1993 | US5270403 Epoxy resin hardener and epoxy resin composition |
| 12/14/1993 | US5270268 Aluminum borate devitrification inhibitor in low dielectric borosilicate glass |
| 12/14/1993 | US5270104 Containing maleinized dicyclopentadiene |
| 12/14/1993 | US5269863 Continuous process for the manufacture of substrates for printed wire boards |
| 12/14/1993 | US5269708 For transmitting telecommunication signals |
| 12/14/1993 | US5269693 Connector for printed circuit boards |
| 12/09/1993 | WO1993024956A1 Process for the manufacture of a solid-state device including at least one chip, and corresponding device |
| 12/09/1993 | WO1993024939A1 Laminated conductive material, multiple conductor cables and methods of manufacturing such cables |
| 12/09/1993 | WO1993024934A1 Electrically conductive pastes |
| 12/09/1993 | WO1993024925A1 Ceramic substrate and its manufacture, and substrate vacuum-clamping device using ceramic vacuum-clamping board |
| 12/09/1993 | WO1993024314A1 Thermally conductive printed circuit board |
| 12/09/1993 | WO1993024313A1 Printed circuit substrates |
| 12/09/1993 | DE4318162A1 Polyamide-polyimide block copolymers - have good temp. stability and low thermal expansion coefficients, and are useful for prodn. of flexible printed circuit boards |
| 12/09/1993 | DE4218419A1 PCB having metallic core in thermal contact with components - uses heat conduction from each component into metallic bolt in threaded bore through plate between component side and solder side |
| 12/08/1993 | EP0572925A1 Recording medium cassette and a recording/reproducing apparatus |
| 12/08/1993 | EP0572815A2 Circuit card interconnecting structure |
| 12/08/1993 | CN1079235A Concentration of fluoropolymer dispersions using acrylic polymers of high acid content |
| 12/07/1993 | US5268820 Mother board assembly |
| 12/07/1993 | US5268819 Circuit board assembly |
| 12/07/1993 | US5268813 Flexible printed circuit package and flexible printed circuit for incorporating in such a package |
| 12/07/1993 | US5268558 Temperature-controlled electronic circuit |
| 12/07/1993 | US5268536 Method of connecting a lead of a mounting part with a land of a circuit substrate |
| 12/07/1993 | US5268535 Printed wiring board |
| 12/07/1993 | US5268410 Aromatic thermotropic liquid crysatlline polymer and alkali earth metal carbonate |
| 12/07/1993 | US5268232 Dicyclopentadiene polymers with heat-resistant dimensional integrity and high Tg |
| 12/07/1993 | US5268193 Coating solution of polyamic acid on substrate; curing |
| 12/07/1993 | US5268064 Copper clad epoxy printed circuit board suitable for microwave frequencies encountered in GPS receivers |
| 12/07/1993 | US5268024 Formation of inorganic conductive coatings on substrates |
| 12/07/1993 | US5267379 Method of fabricating surface mountable clock oscillator module |
| 12/07/1993 | CA1324924C Flexible copper-applied substrates |
| 12/02/1993 | DE4317719A1 Prodn. of laminated electronic constructional element - by sintering ceramic layers and inner electrodes in mixed gas contg. carbon di:oxide and mon:oxide |
| 12/02/1993 | DE4217425A1 Assembly carrier used to construct electronic circuits - comprising conducting pathways of resistance material to electrically connect individual electrical assemblies to carrier |
| 12/01/1993 | EP0572343A1 Ceramic via composition, multilayer ceramic circuit containing same, and process for using same |
| 12/01/1993 | EP0572289A1 Network line sections ordering especially for the calculation of cross-talksbetween lines. |
| 12/01/1993 | EP0572268A1 Backplane |
| 12/01/1993 | EP0572232A2 A multilayer printed circuit board and method for manufacturing same |
| 12/01/1993 | EP0572177A1 Electrical insulation laminate |
| 12/01/1993 | EP0571998A1 Soft, foldable consumer electronic products |
| 12/01/1993 | EP0571756A2 High density, three-dimensional, intercoupled circuit structure |
| 12/01/1993 | EP0571749A1 Stacking semiconductor multi-chip module and method for making the same |
| 12/01/1993 | CN1079072A Method of manufacturing a plate of electrically insulating material having a pattern of apertures and/or cavities |
| 11/30/1993 | US5267124 Controlling apparatus with terminal arrangement |
| 11/30/1993 | US5266912 Inherently impedance matched multiple integrated circuit module |
| 11/30/1993 | US5266904 Printed circuit board with through-holes including a test land having two current measuring lands and two resistance measuring lands |
| 11/30/1993 | US5266821 Chip decoupling capacitor |
| 11/30/1993 | US5266748 Printed wiring board having through-holes covered with ink layer and method of manufacture thereof |
| 11/30/1993 | US5266747 Pad footprint for generic circuit board layouts for a package circuit |