| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 01/25/1994 | US5281466 Adhesive for laminating layers of a multilayer circuit, alkali resistance |
| 01/25/1994 | US5281441 Impinging woven material with jets of pressurized water to loosen and spread filaments, impregnating with resin |
| 01/25/1994 | US5281389 Vaporizable liquid vehicle, sinterable palladium powder dispersed in vehicle, titanium dioxide, strontium calcium titanate compound |
| 01/25/1994 | US5280850 Method of manufacturing circuit board |
| 01/25/1994 | CA1326412C Composite materials |
| 01/21/1994 | CA2100277A1 Sealing porous electronic substrates |
| 01/20/1994 | WO1994001987A1 Component module |
| 01/20/1994 | WO1994001984A1 Interconnection method and structure for organic circuit boards |
| 01/20/1994 | WO1994001889A1 Fitting unit for multilayer hybrid circuit with power components |
| 01/20/1994 | WO1994001876A1 Electrical devices |
| 01/20/1994 | WO1994001377A1 Ceramic green sheet |
| 01/20/1994 | DE4223371A1 Electronic component mounting method for circuit board assembly - with openings in cover layer overlapping each component receiving conductive paste providing required electrical connections |
| 01/19/1994 | EP0579346A1 Apparatus for providing RFI/EMI isolation between adjacent circuit areas on a single circuit board |
| 01/19/1994 | EP0579293A1 Hybrid amplifier |
| 01/19/1994 | EP0578974A2 Raveling-preventing agent for glass fiber woven fabric, and glass fiber woven fabric to which the agent is applied |
| 01/19/1994 | EP0578881A1 Circuit board edge connector |
| 01/19/1994 | EP0578880A1 Plated D-shell connector |
| 01/19/1994 | EP0578737A1 Contact device for an electrical or electronic component. |
| 01/19/1994 | EP0578652A1 High k dielectric compositions with fine grain size. |
| 01/19/1994 | EP0397802B1 Complete ether capping of oligomeric polyphenols |
| 01/18/1994 | US5280413 Hermetically sealed circuit modules having conductive cap anchors |
| 01/18/1994 | US5280409 For efficiently dissipating heat generated by integrated circuits |
| 01/18/1994 | US5280262 Thermal overlaod fuse of surface mount compatible construction |
| 01/18/1994 | US5280139 Multilayer; dielectric, adhesive and electroconductive layer |
| 01/18/1994 | US5279895 Containing hollow spheres |
| 01/18/1994 | CA1326320C Aromatic polysulfone resin composition having excellent plating characteristics |
| 01/13/1994 | DE4222474A1 Montageeinheit für Mehrlagenhybrid mit Leistungsbauelementen Mounting unit for multilayer hybrid with power devices |
| 01/13/1994 | DE4222163A1 Signal transmission for circuit board analogue or digital signals - using strip lines formed on board with transmitter line coupled by impedance matching network to several receiver lines |
| 01/13/1994 | DE4220966A1 Mfg. carrier plate for electrical components - providing through opening for heat sink element in form of press-fitting cylindrical plug of metal to contact electronic device |
| 01/12/1994 | EP0578487A1 Electrical pin field |
| 01/12/1994 | EP0578061A1 Device to withdraw, superimpose and anchor foils for green-tape circuits |
| 01/12/1994 | EP0577836A1 Polyamino-oligomer and polymaleimide compound |
| 01/12/1994 | EP0577779A1 Multichip integrated circuit module and method of fabrication |
| 01/12/1994 | EP0577754A1 Three-dimensional multichip module systems and methods of fabrication |
| 01/12/1994 | EP0577743A1 Photodefinable interlevel dielectrics |
| 01/12/1994 | EP0445221B1 Styrene terminated multifunctional oligomeric phenols as new thermosetting resins for composites |
| 01/12/1994 | EP0397719B1 Ethers of oligomeric phenol-dialdehyde condensation products as thermosetting resins for composites |
| 01/12/1994 | CN1023542C Printed circuit board, method of its fabrication and of attaching electronic elements thereto |
| 01/12/1994 | CN1023528C Miniature motor |
| 01/11/1994 | US5278727 High density electrical interconnection device and method therefor |
| 01/11/1994 | US5278725 Foldable electronic apparatus having a hollow hinge assembly through which a flexible cable is routed |
| 01/11/1994 | US5278724 Electronic package and method of making same |
| 01/11/1994 | US5278535 Electrical overstress pulse protection |
| 01/11/1994 | US5278528 Air insulated high frequency filter with resonating rods |
| 01/11/1994 | US5278524 Multi-layered printed circuit board with transmission line capabilities |
| 01/11/1994 | US5278385 Method of producing flexible printed circuits, printed circuit produced by this method and device for carrying out this method |
| 01/11/1994 | US5278259 Epoxy resin composition, epoxy resin cured material, and laminated sheet lined with copper |
| 01/11/1994 | US5278023 Propellant-containing thermal transfer donor elements |
| 01/11/1994 | US5277930 Method of fabricating a substrate for an optical surface mount circuit |
| 01/11/1994 | US5277787 Method of manufacturing printed wiring board |
| 01/11/1994 | US5277725 Process for fabricating a low dielectric composite substrate |
| 01/11/1994 | US5277601 In an electrical connector assembly |
| 01/11/1994 | US5277591 Extended card edge connector and socket |
| 01/11/1994 | US5276963 Process for obtaining side metallization and articles produced thereby |
| 01/06/1994 | WO1994000969A1 Self-aligning electrical contact array |
| 01/06/1994 | WO1994000966A1 Ceramic substrates with highly conductive metal vias |
| 01/06/1994 | WO1994000801A1 Color filter, material thereof and resin |
| 01/06/1994 | WO1994000800A1 Photosensitive resin composition |
| 01/06/1994 | CA2138032A1 Self-aligning electrical contact array |
| 01/05/1994 | EP0577484A1 Method of forming a bond between copper and a non-oxide ceramic substrate for power-electronics |
| 01/05/1994 | EP0577187A1 Method of providing a metal pattern on glass in an electroless process |
| 01/05/1994 | EP0577083A1 7,8-cyclopropataxanes with antitumor action |
| 01/05/1994 | EP0577082A1 Fluoro taxols with antitumor activity |
| 01/05/1994 | EP0577067A2 Glass, dielectric composition, multilayer wiring substrate, and multilayer ceramic capacitor |
| 01/05/1994 | EP0576872A1 A new diffusion joining method and a paste used therefor |
| 01/05/1994 | EP0576560A1 Low noise optical probe |
| 01/05/1994 | EP0414872B1 Electrically conductive feedthrough and process for manufacturing it |
| 01/05/1994 | DE4320883A1 Fixing device for flexible circuit plate in compact camera - uses deformable fixing element around which circuit board is folded inserted in mounting aperture in holding element |
| 01/05/1994 | DE4220690A1 Electronic ballast circuit for compact fluorescent lamp - has SMD devices mounted on circuit board with height profile matching shape of socket |
| 01/04/1994 | US5276590 Flex circuit electronic cards |
| 01/04/1994 | US5276572 Magnetic disk apparatus |
| 01/04/1994 | US5276418 Flexible substrate electronic assembly |
| 01/04/1994 | US5276414 Moistureproof structure for module circuits |
| 01/04/1994 | US5276290 Electroplating process and composition |
| 01/04/1994 | US5276106 Decreasing viscosity with increasing temperature up to dissolution temperature, then increasing viscosity with temperature, rheology control |
| 01/04/1994 | US5275897 Precisely aligned lead frame using registration traces and pads |
| 01/04/1994 | US5275889 Multi-layer wiring board |
| 01/04/1994 | US5275878 Secondary particles formed by agglomerating primary particles which are sintered to be mutually coupled |
| 01/04/1994 | US5275770 aluminum oxide surface layer; compressed powder layers; finish-baked to be self-supporting |
| 01/04/1994 | US5275330 Solder ball connect pad-on-via assembly process |
| 01/04/1994 | US5274916 Method of manufacturing ceramic multilayer electronic component |
| 01/04/1994 | US5274912 Method of manufacturing a multilayer circuit board |
| 01/04/1994 | CA2012029C Method for wiring connection of a display device and structure for wiring connection to be used therefor |
| 12/30/1993 | CA2097947A1 Apparatus for providing rfi/emi isolation between adjacent circuit areas on a single circuit board |
| 12/29/1993 | EP0576318A1 Matrix distribution, printed circuit board and method for distribution management |
| 12/29/1993 | EP0576182A1 A semiconductor device |
| 12/29/1993 | EP0576169A2 Polymeric film |
| 12/29/1993 | EP0575892A1 Semiconducteur power module |
| 12/29/1993 | EP0575850A2 Direct laser imaging for three-dimensional circuits and the like |
| 12/29/1993 | EP0575849A2 Conformal photomask for three-dimensional printed circuit board technology |
| 12/29/1993 | EP0575806A2 Package for integrated circuit chips |
| 12/28/1993 | US5274570 Integrated circuit having metal substrate |
| 12/28/1993 | US5274352 Thick film resistive element, thick film printed circuit board and thick film hybrid integrated circuit device and their production methods |
| 12/28/1993 | US5274270 Multichip module having SiO2 insulating layer |
| 12/28/1993 | US5274195 Laminated conductive material, multiple conductor cables and methods of manufacturing such cables |
| 12/28/1993 | US5274026 A curing agent activated at a temperature in excess of the glass transition temperature of the polycycloolefin to crosslink |
| 12/28/1993 | US5274022 Polyarylene sulfide and the rubber having a glass transtion temperature below-10 degrees C. |
| 12/28/1993 | US5273823 Shaped articles containing copolymers of polybenzazoles |
| 12/28/1993 | US5273816 Laminate board possessing improved dimensional stability |
| 12/28/1993 | US5273798 Facing of heat-resistant polymer film, curable adhesive of phenolic resin blend with nitrile-containing rubber, silicone release layer and carrier |