| Patents for H05K 1 - Printed circuits (98,583) |
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| 02/22/1994 | US5288986 Binary code matrix having data and parity bits |
| 02/22/1994 | US5288974 Control arrangement for a seat heater |
| 02/22/1994 | US5288959 Device for electrically interconnecting opposed contact arrays |
| 02/22/1994 | US5288951 Copper-based metallizations for hybrid integrated circuits |
| 02/22/1994 | US5288950 Flexible wiring board and method of preparing the same |
| 02/22/1994 | US5288556 Machines; vehicles |
| 02/22/1994 | US5288542 Printed circuit having one dielectric substrate core with electroconductive surface layer covered by sub-composite having rigid dielectric substrate with polyimide layer, thermal properties, miniature electronics |
| 02/22/1994 | US5288539 Tab tape with a peeling-prevention structure for the conductive layer |
| 02/22/1994 | US5288529 Liquid crystal polymer film |
| 02/22/1994 | US5288519 Insulation layer for mold; hydrolysis of polyamic acid, degreasing, curing, surface oxidation-reduction of formed polyimide |
| 02/22/1994 | US5288235 Electrical interconnects having a supported bulge configuration |
| 02/22/1994 | US5287620 Process of producing multiple-layer glass-ceramic circuit board |
| 02/22/1994 | US5287619 Method of manufacture multichip module substrate |
| 02/22/1994 | CA2008284C Multi-layer ceramic substrate with solder dam on connecting pattern |
| 02/22/1994 | CA1327148C Fiber reinforced composites with improved glass transition temperatures |
| 02/19/1994 | CA2104165A1 One pack self curable epoxy resin composition |
| 02/17/1994 | WO1994003923A1 Sealed conductive active alloy feedthroughs |
| 02/17/1994 | WO1994003913A1 Thermal cut-out and process for activating it |
| 02/17/1994 | WO1994003907A1 Speaker cable |
| 02/17/1994 | WO1994003517A1 Thermosetting resin composition and production of copper-clad laminated board therefrom |
| 02/17/1994 | WO1994003352A1 Add-on control device |
| 02/17/1994 | DE4226590A1 Verfahren zur Verringerung des Flächenbedarfs eines Stromversorgungsnetzes auf einem Schaltungsträger, welches Stromverbraucher und Stromversorger verbindet Process for reducing the space requirements of an electricity supply system on a circuit board that conducts electricity consumers and electricity suppliers connects |
| 02/16/1994 | EP0583224A2 Thermosetting resins toughened with sulfone polymers |
| 02/16/1994 | EP0582881A1 Multilayer electronic component, method of manufacturing the same and method of measuring characteristics thereof |
| 02/16/1994 | EP0582683A1 Conductive polymer compositions. |
| 02/16/1994 | EP0463105B1 High capacitance laminates |
| 02/16/1994 | CN1082306A Printed circuit board with internal capacitor |
| 02/15/1994 | US5287460 Bus interface circuit for dual personal computer architecture peripheral adapter board |
| 02/15/1994 | US5286927 Insulating substrate having groove, conductor pattern formed in groove containing electroconductive metal of copper, silver or gold and fine particles having thermal expansion coefficient different from the metal |
| 02/15/1994 | US5286814 Heat-resistant stretched film and production process thereof |
| 02/15/1994 | US5286812 High performance blends of aromatic polyimides with aromatic polyethersulfones |
| 02/15/1994 | US5286550 Process for producing a patterned metal surface |
| 02/15/1994 | US5286415 Water-based polymer thick film conductive ink |
| 02/15/1994 | US5286330 Method of producing copper-clad laminated board |
| 02/15/1994 | CA1326979C Ceramic coated metal substrates for electronic applications |
| 02/10/1994 | DE4226168A1 Electronic module mfr. using heat-conductive adhesive - making holes through pref. copper@-plated area of PCB for injection of adhesive after satisfactory in-situ functional test |
| 02/09/1994 | EP0582411A2 Electroless metal coatings |
| 02/09/1994 | EP0582197A2 Basic material and prepreg for manufacturing printed circuit boards |
| 02/08/1994 | US5285398 Flexible wearable computer |
| 02/08/1994 | US5285348 Circuit assembly for down converter for satellite communications |
| 02/08/1994 | US5285191 LC marker construction useful as an electromagnetically interrogatable transponder means |
| 02/08/1994 | US5285107 Hybrid integrated circuit device |
| 02/08/1994 | US5285057 IC card device |
| 02/08/1994 | US5285018 Power and signal distribution in electronic packaging |
| 02/08/1994 | US5285016 Wiring board provided with a heat bypass layer |
| 02/08/1994 | US5285015 Patterned circuitry with foraminous substrate and method of making |
| 02/08/1994 | US5284929 Epoxy resins with cyclohexenenorbornene moieties |
| 02/08/1994 | US5284807 Glass fiber forming composition, glass fibers obtained from the composition and substrate for circuit board including the glass fibers as reinforcing material |
| 02/08/1994 | US5284394 Ball and roller bearings and bearing components |
| 02/08/1994 | US5284189 Conductive ink packaging for printed circuit board screen printing operations |
| 02/08/1994 | US5283949 Method of producing a printed circuit board having a conductive pattern thereon |
| 02/08/1994 | US5283948 Interlocking structure allows greater height |
| 02/08/1994 | US5283947 Method of mounting electronic components on a circuit board |
| 02/08/1994 | CA1326921C Rubber-modified cyanate ester resins and polytriazines derived therefrom |
| 02/08/1994 | CA1326789C Method of making multilayered ceramic structures having an internal distribution of copper-based conductors |
| 02/03/1994 | WO1994003038A1 Packaging electrical components |
| 02/03/1994 | WO1994003036A1 Semiconductor connection components and methods with releasable lead support |
| 02/03/1994 | WO1994002970A1 Rf waveguide signal transition apparatus |
| 02/03/1994 | WO1994002310A1 Printed circuit board with internal capacitor |
| 02/03/1994 | WO1994002306A1 A method of manufacturing a ud-reinforced pwb laminate |
| 02/03/1994 | DE4228442C1 Electroless nickel@ coating of metallised ceramic - using treatment to activate only the metallised areas and avoid unwanted coating of ceramic areas |
| 02/03/1994 | DE4225358A1 Anbausteuergerät Attached control unit |
| 02/03/1994 | DE4224925A1 Multilayer circuit board with printed components |
| 02/03/1994 | DE4224835A1 Electrically high-grade base material for printed circuit boards - has substrate contg. prepregs of glass fibre sheet and prepregs of sulphur-free, partly oxidised, internally cyclised acrylonitrile] polymer |
| 02/03/1994 | CA2140756A1 A method of manufacturing a ud-reinforced pwb laminate |
| 02/02/1994 | EP0581712A2 MLC conductor pattern off-set design to eliminate line to via cracking |
| 02/02/1994 | EP0581471A1 Image control apparatus |
| 02/02/1994 | EP0581428A1 Card type fuse and method of producing the same |
| 02/02/1994 | EP0581314A2 Modified dicyanate ester resins having enhanced fracture thoughness |
| 02/02/1994 | EP0581298A2 Ink jet recording head, ink jet recording head cartridge, recording apparatus using the same and method of manufacturing the head |
| 02/02/1994 | EP0581294A2 Process for producing a circuit substrate |
| 02/02/1994 | EP0581284A2 Non-contact IC card and manufacturing and testing methods of the same |
| 02/02/1994 | EP0581268A1 Flame-retarded thermosetting resin composition, prepregs and electrical laminates made therefrom |
| 02/02/1994 | EP0581206A2 Low-temperature-cofired-ceramic (LTCC) tape structures including cofired ferromagnetic elements, drop-in components and multi-layer transformer |
| 02/02/1994 | EP0581139A1 Circuit board arrangement for computer or the like |
| 02/02/1994 | CN2155126Y Printed board |
| 02/01/1994 | US5283715 Integrated heat pipe and circuit board structure |
| 02/01/1994 | US5283677 Liquid crystal display with ground regions between terminal groups |
| 02/01/1994 | US5283210 A powder mixtures consists of cordierite, quartz and lead borosilicate glass; ceramic printed circuits, high speed transmitters |
| 02/01/1994 | US5283108 Process for producing defect free multilayer printed circuit boards |
| 02/01/1994 | US5283104 Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates |
| 02/01/1994 | US5283007 Conductive polymer compositions |
| 02/01/1994 | US5282751 Connector apparatus |
| 02/01/1994 | US5282312 Multi-layer circuit construction methods with customization features |
| 01/27/1994 | DE4309005A1 Multilayer hybrid integrated circuit mfr. from ceramic green sheets - providing contacts between conductive tracks via feedthrough(s) in holes through interposed ceramic plate which prevents shrinkage |
| 01/26/1994 | EP0580408A1 Excimer laser processing method and apparatus |
| 01/26/1994 | EP0580381A1 Sealing porous electronic substrates |
| 01/26/1994 | EP0580313A2 Surface mount microcircuit hybrid |
| 01/26/1994 | EP0580108A2 A photosensitive polyimide composition |
| 01/26/1994 | EP0580050A1 Process for making a polymer/metal or a polymer/semi-conductor band |
| 01/26/1994 | EP0579852A1 A porous fluororesin material plated with a metal |
| 01/26/1994 | EP0579644A1 Protective coatings |
| 01/26/1994 | EP0579610A1 Novel demetallizing procedure |
| 01/26/1994 | EP0323505B1 Cathode surface treatment for electroforming metallic foil or strip |
| 01/26/1994 | CN1081297A Component module |
| 01/26/1994 | CN1081189A Copolymer for use in preparing prepregs, printed circuit wiring boards prepared from such prepregs, and processes for preparing such printed circuit wiring boards |
| 01/25/1994 | US5282099 Disk drive apparatus incorporating circuitry into housing |
| 01/25/1994 | US5281772 Electrical connector having energy-formed solder stops and methods of making and using the same |
| 01/25/1994 | US5281770 Printed circuit board apparatus |
| 01/25/1994 | US5281765 Wiring assembly for equipment and a method for producing the same |