| Patents for H05K 1 - Printed circuits (98,583) |
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| 03/17/1994 | WO1994006155A1 Surface mountable clock oscillator module and method for fabricating such modules |
| 03/17/1994 | WO1994006057A1 Polyimide precursor and photosensitive composition containing the same |
| 03/17/1994 | DE4312881C1 Semi finished substrate for opto electrical hybrid circuit - has bonded optically transparent substrate and ceramic substrate segments |
| 03/16/1994 | EP0587382A2 Aluminum nitride circuit board and method of producing it |
| 03/16/1994 | EP0587296A1 Tab tape and method for producing it |
| 03/16/1994 | EP0587294A1 Semiconductor package |
| 03/16/1994 | EP0587144A2 Liquid crystal display apparatus, structure for mounting semiconductor device, method of mounting semiconductor device, electronic optical apparatus and electronic printing apparatus |
| 03/16/1994 | EP0586888A2 Three-dimensional multichip module |
| 03/16/1994 | EP0526484B1 Method for assembling a coil on a printed circuit |
| 03/16/1994 | EP0355133B1 Chip carrier sockets having improved contact terminals |
| 03/16/1994 | CN1083883A Process for preparing strong aromater Polyamide papers of high porosity |
| 03/16/1994 | CN1083779A Pattern formation in photohardenable dielectric layers |
| 03/16/1994 | CA2105211A1 Reinforced poly(arylene sulfide) resins having reduced flash |
| 03/15/1994 | USRE34563 Heat-stable copolycondensate molding materials |
| 03/15/1994 | US5295214 Optical module with tolerant wave soldered joints |
| 03/15/1994 | US5295089 Soft, foldable consumer electronic products |
| 03/15/1994 | US5294897 Microwave IC package |
| 03/15/1994 | US5294826 Integrated circuit package and assembly thereof for thermal and EMI management |
| 03/15/1994 | US5294755 Printed wiring board having shielding layer |
| 03/15/1994 | US5294751 High frequency signal transmission line structure having shielding conductor unit |
| 03/15/1994 | US5294637 Fluoro taxols |
| 03/15/1994 | US5294567 Method for forming via holes in multilayer circuits |
| 03/15/1994 | US5294477 Functionally gradient circuit board |
| 03/15/1994 | US5294290 Computer and electromagnetic energy based mass production method for the continuous flow make of planar electrical circuits |
| 03/15/1994 | US5294039 Plated compliant lead |
| 03/15/1994 | CA2046355C Liquid crystal display |
| 03/10/1994 | DE4329693A1 Satellite transmission receiver with microstrip input stage - has alternate circuit configurations for different types of tuner on same circuit board. |
| 03/10/1994 | DE4230851C1 Screened stripline for integrated microwave circuit - with mixture of adhesive and dielectric granules in free spaces between conductors sandwiched between dielectric layers |
| 03/10/1994 | DE4229778A1 Flexible conductor path foil with tension restraint - comprises rectangular plastics material element with elongate reception slot for foil and openings for projecting conductor path terminal |
| 03/10/1994 | DE4229727A1 Vehicle electrical switch or control device - uses PCB with flexible part rolled into coil and accommodated in insulating jacket or envelope |
| 03/09/1994 | EP0586069A2 Memory module and packing method |
| 03/09/1994 | EP0586010A1 High frequency circuit device and method for making the same |
| 03/09/1994 | EP0585876A1 Aluminum nitride sintered body and method of preparing the same |
| 03/09/1994 | EP0585602A2 Formation of inorganic conductive coatings on substrates |
| 03/09/1994 | EP0354225B1 Process for adapting the frequency band of an oscillating circuit made from a metal-plastic-metal sandwich foil useful as an identification label |
| 03/09/1994 | CN1083626A Surface mountable clock oscillator module and method for fabrication such modules |
| 03/09/1994 | CN1083498A One pack self curable epoxy resin composition |
| 03/08/1994 | US5293636 Module for insertion into a multi-module system having electronic keying for preventing power to improperly connected modules with improperly configured diode connections |
| 03/08/1994 | US5293509 Sintered body of aluminum nitride |
| 03/08/1994 | US5293504 Multilayer ceramic substrate with capped vias |
| 03/08/1994 | US5293302 Electronic part assembly |
| 03/08/1994 | US5293145 Power transformer apparatus |
| 03/08/1994 | US5293140 Transmission line structure |
| 03/08/1994 | US5293025 Method for forming vias in multilayer circuits |
| 03/08/1994 | US5293005 Electronic device having high-density wiring |
| 03/08/1994 | US5293004 Printed circuit board having an electromagnetic shielding layer |
| 03/08/1994 | US5292927 Fluorinated resins with low dielectric constant |
| 03/08/1994 | US5292861 Trifunctional cyanate esters, polymers thereof; use and preparation thereof |
| 03/08/1994 | US5292694 Method of producing low temperature firing dielectric ceramic composition containing B2 O3 |
| 03/08/1994 | US5292574 Ceramic substrate having wiring of silver series |
| 03/08/1994 | US5292552 Metal paste of tungsten with SiO2, CaO, and Al2O3, firing |
| 03/08/1994 | US5291653 Manufacturing printed wiring boards having electromagnetic wave shielding |
| 03/08/1994 | CA2027025C Method of manufacturing circuit board |
| 03/08/1994 | CA2014917C Miniature mobile radio communication equipment having a shield structure |
| 03/06/1994 | CA2105448A1 Aluminum nitride circuit board and method of producing same |
| 03/03/1994 | WO1994005141A1 Composite molded product having three-dimensional multi-layered conductive circuits and method of its manufacture |
| 03/03/1994 | WO1994005140A1 Method of manufacturing a multilayer printed wire board |
| 03/03/1994 | WO1994005134A1 Electronic component |
| 03/03/1994 | WO1994005092A1 Apparatus and method for crosstalk cancellation in data correctors |
| 03/03/1994 | WO1994005082A1 Method for transmission of a high frequency logical signal by means of inductive coupling with high galvanic isolation |
| 03/03/1994 | WO1994004985A1 Method of reducing the surface requirements, on a circuit board, of a power-supply net connecting consumers with the power supply |
| 03/03/1994 | DE4328270A1 Polyimide and polyamic acid compsns. modified with polyarylene ether - used in prodn. of flexible laminate with metal foil esp. for printed circuit with good solvent resistance and low thermal expansion coefft. |
| 03/03/1994 | DE4327293A1 Oriented syndiotactic polystyrene film with specified roughness and air permeability rate - used for capacitor dielectric, wrapping, photomechanical process, laminate, adhesive tape or printed circuit. |
| 03/03/1994 | DE4228818A1 Electrical switching control unit for motor vehicle - has flexible circuit board foil located between opposing heat sink plates sandwiched around sealing frame |
| 03/03/1994 | CA2142267A1 Method of manufacturing a multilayer printed wire board |
| 03/02/1994 | EP0585205A2 Curable compositions of furylallylnovolaks and bismaleimides |
| 03/02/1994 | EP0584863A1 One pack self curable epoxy resin composition |
| 03/02/1994 | EP0584691A1 Binder removal from multilayer ceramic structures |
| 03/02/1994 | EP0584577A1 Surface mounted electrical connector for printed circuit boards |
| 03/02/1994 | EP0584386A1 Printed circuit board and method of producing printed circuit boards |
| 03/02/1994 | EP0584349A1 Process and device for three-dimensional interconnection of housings for electronic components |
| 03/02/1994 | EP0382751B1 Styrene terminated multifunctional oligomeric phenols as new thermosetting resins for composites |
| 03/02/1994 | CN1083267A Large ceramic article and method of manufacturing |
| 03/01/1994 | US5291375 Printed circuit board and electric device configured to facilitate bonding |
| 03/01/1994 | US5291373 Terminal block arrangement for a timer device or the like |
| 03/01/1994 | US5291372 Integral heat sink-terminal member structure of hybrid integrated circuit assembly and method of fabricating hybrid integrated circuit assembly using such structure |
| 03/01/1994 | US5291180 LC structure useful in radio frequency security systems |
| 03/01/1994 | US5291072 Crosstalk-reduced transmission device |
| 03/01/1994 | US5291063 High-power RF device with heat spreader bushing |
| 03/01/1994 | US5290986 Thermally assisted shorts removal process for glass ceramic product using an RF field |
| 03/01/1994 | US5290971 Printed circuit board provided with a higher density of terminals for hybrid integrated circuit and method of fabricating the same |
| 03/01/1994 | US5290909 Adhesive-free |
| 03/01/1994 | US5290624 Heat-conductive adhesive films, laminates with heat-conductive adhesive layers and the use thereof |
| 03/01/1994 | US5290606 Method for manufacturing a substrate for a printed circuit board |
| 03/01/1994 | US5290597 Partially curing, degreasing, treating with oxidizing agent, applying electroless copper or nickel, curing, applying secondary metal |
| 03/01/1994 | US5290586 Method to monitor Meta-Paete cure on metallized substrates |
| 03/01/1994 | US5290396 Trench planarization techniques |
| 03/01/1994 | US5290191 Interface conditioning insert wafer |
| 03/01/1994 | US5289629 Apparatus for joining a conductor track foil to an electrical component |
| 03/01/1994 | CA1327410C Dual personal computer architecture peripheral adapter board and circuit |
| 02/27/1994 | CA2104726A1 Curable compositions |
| 02/24/1994 | DE4227667A1 Assembly accuracy evaluation system for circuit board component checking - uses two glass plates acting as test circuit board and component dummy |
| 02/23/1994 | EP0583407A1 Integrated circuit packages using tapered spring contact leads for direct mounting to circuit boards |
| 02/23/1994 | CN1082725A A method for forming a patterned polyimide coating film on a substrate |
| 02/23/1994 | CN1082628A Method for dyeing copper surface by organic dyestuff |
| 02/23/1994 | CN1082560A 聚合薄膜 Polymeric films |
| 02/23/1994 | CN1082541A Fluoro taxols |
| 02/22/1994 | US5289340 Structure of an electronic device including a number of printed circuit boards |
| 02/22/1994 | US5289339 Portable electronic device with memory card unit having symmetrical terminals |
| 02/22/1994 | US5289032 Tape automated bonding(tab)semiconductor device and method for making the same |