| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 04/13/1994 | EP0591604A2 Via fill compositions |
| 04/13/1994 | EP0591126A1 Process for making noble metal coated metallic particles, and resulting conductive materials |
| 04/13/1994 | CN1085343A Via fill compositions |
| 04/13/1994 | CN1085156A A method of manufacturing a composite laminate comprising unidirectional reinforcing fibres, for use in printed wire boards |
| 04/12/1994 | US5303122 Printed circuit board having a commonized mounting pad which different sized surface mounted devices can be mounted |
| 04/12/1994 | US5303121 Multi-chip module board |
| 04/12/1994 | US5303120 Method of manufacturing inversion type IC's and IC module using same |
| 04/12/1994 | US5303119 Interconnection system for integrated circuits |
| 04/12/1994 | US5303116 Surge protector |
| 04/12/1994 | US5302854 Packaging structure of a semiconductor device |
| 04/12/1994 | US5302627 For polysiloxanes |
| 04/12/1994 | US5302557 Automotive glass thick film conductor paste |
| 04/12/1994 | US5302547 Systems for patterning dielectrics by laser ablation |
| 04/12/1994 | US5302467 Halogenated polyimide composition having improved adhesion characteristic and articles obtained therefrom |
| 04/12/1994 | CA1328528C Thermosetting resin composition, printed circuit board using the resin composition and process for producing printed circuit board |
| 04/12/1994 | CA1328520C Copper-type conductive coating composition |
| 04/07/1994 | DE4233403A1 Prodn. of multilayer hybrids - comprising green ceramic foils having conducting pathways and through-contacts with electrical connections between them |
| 04/07/1994 | DE4233073A1 Semiconductor modular structure prodn. - by convexly shaping and bonding in single hot pressing operation |
| 04/06/1994 | EP0590643A2 Large-current circuit board and method therefor |
| 04/06/1994 | EP0590635A1 A method for producing a multi-layered printed wiring board |
| 04/06/1994 | EP0590628A1 Process for soldering components on printed circuit board and printed circuit board |
| 04/06/1994 | EP0590463A2 Halogen containing epoxy resin composition and copper-clad laminate |
| 04/06/1994 | EP0590354A1 Device with a board, a heat sink and at least one power component |
| 04/06/1994 | EP0590324A1 Power and signal distribution in electronic packaging |
| 04/06/1994 | EP0253892B1 Transfer material for printed circuit board and printed circuit board prepared using said transfer material and process for preparation thereof |
| 04/05/1994 | US5300941 Integrated MMDS antenna and down converter |
| 04/05/1994 | US5300917 Junction box having integrally formed shunt |
| 04/05/1994 | US5300899 Thin, flexible, stripline flex cable having two shielding ground planes formed as grids having mutually offset grid patterns |
| 04/05/1994 | US5300627 Heat resistant silicon modified polyimide |
| 04/05/1994 | US5300619 Polyimide resin film and method of making said film |
| 04/05/1994 | US5300364 Metal-clad laminates and method for producing same |
| 04/05/1994 | US5299956 Low cross talk electrical connector system |
| 04/05/1994 | US5299435 Locked inlay knit fabrics |
| 04/05/1994 | CA2026206C Electrically conductive paste composition and method of curing same |
| 03/31/1994 | WO1994007350A1 Hermetically sealed circuit modules having conductive cap anchors |
| 03/31/1994 | WO1994007349A1 Magnetic vias within multi-layer, 3-dimensional structures/substrates |
| 03/31/1994 | WO1994007348A1 Dielectric vias within multilayer 3-dimensional structures/substrates |
| 03/31/1994 | WO1994007347A1 Field control and stability enhancement in multilayer, 3-dimensional structures |
| 03/31/1994 | WO1994006585A1 Method for making a ceramic metal composite |
| 03/31/1994 | DE4232844A1 Exposure method for optical projection lithography used in integrated circuit mfr. - applying imaged structure to non-planar surface of exposure mask to increase image sharpness |
| 03/31/1994 | DE4232622C1 Kontaktiervorrichtung zum Anschluß einer mehrere Kontaktleiterbahnen aufweisenden Leiterfolie Contactor for connecting a plurality of contact strip conductors having conductive foil |
| 03/31/1994 | DE4232268A1 Surface mounted component with several input and output terminals - has input terminal divided into several groups, each at one component outer surface |
| 03/31/1994 | DE4232267A1 Circuit board layout for high data rate coupling field - has parallel connections for two SMDs on opposite sides of circuit board provided by vias |
| 03/31/1994 | DE4232266A1 Circuit board structure with two through-contacted surfaces - has SMD components on top and bottom sides of circuit board for parallel input terminals above each other |
| 03/31/1994 | DE4231180A1 Producing adjustment structure for PCB - providing structured window in solder stop mark overlying metal zone applied to circuit board surface |
| 03/31/1994 | CA2145161A1 Method for making a ceramic metal composite |
| 03/31/1994 | CA2144088A1 Hermetically sealed circuit modules having conductive cap anchors |
| 03/31/1994 | CA2124197A1 Dielectric vias within multi-layer 3-dimensional structural/substrates |
| 03/30/1994 | EP0589813A1 Multilayer ceramic substrate with graded vias |
| 03/30/1994 | EP0589786A1 Connection device for signal transmission equipment |
| 03/30/1994 | EP0589529A1 Dispersion of electrically conductive particles in a dispersing medium |
| 03/30/1994 | EP0589241A2 Photosensitive dielectric sheet composition and multilayer interconnect circuits |
| 03/30/1994 | EP0589092A1 Inclination and acceleration sensor operating by means of capacitive detection of the position of a ball |
| 03/30/1994 | EP0588834A1 Electrical connectors. |
| 03/30/1994 | CN1084676A Connector for electrical components |
| 03/29/1994 | US5299094 IC card including multiple substrates bearing electronic components |
| 03/29/1994 | US5299091 Packaged semiconductor device having heat dissipation/electrical connection bumps and method of manufacturing same |
| 03/29/1994 | US5298687 High-density multilayer interconnection system on a ceramic substrate for high current applications and method of manufacture |
| 03/29/1994 | US5298686 System and method for implementing wiring changes in a solderless printed wiring board module |
| 03/29/1994 | US5298685 Interconnection method and structure for organic circuit boards |
| 03/29/1994 | US5298684 Circuit board having a lateral conductive pattern and shielded regions as well as a method of manufacturing such a board |
| 03/29/1994 | US5298664 Method for preparing aryl ketones |
| 03/29/1994 | US5298536 Residues of one silicon-containing compound and at least one polycylic polyene compound linked through carbon-silicon bond |
| 03/29/1994 | US5298460 Substrate for packaging a semiconductor device |
| 03/29/1994 | US5298331 Metal clad laminates for printed circuits and tape automated bonding |
| 03/29/1994 | US5298330 Thick film paste compositions for use with an aluminum nitride substrate |
| 03/29/1994 | US5298279 Method for connecting terminals of heat seal film substrate |
| 03/29/1994 | US5298114 Thin film circuit substrate and process for the manufacture thereof |
| 03/29/1994 | US5298110 Trench planarization techniques |
| 03/29/1994 | US5297975 Terminal bank for the telecommunication and data technology |
| 03/25/1994 | CA2106730A1 Dispersion of electrically conductive particles in a dispersing medium |
| 03/24/1994 | DE4326989A1 Circuit board for signals in GHz range - uses spaces between contact sleeves inserted through circuit board layers for dual signal line |
| 03/24/1994 | DE4324213A1 Circuit board relay with auxiliary terminals - provided by conductive contact rails attached to insulating sidewall of relay housing |
| 03/24/1994 | DE4231427A1 Continuous chromatographic sepn of material mixt - using stack of oppositely rotating alternate discs of two different sorbents |
| 03/24/1994 | DE4231140A1 Electronic control appts. module - has power component mounted on circuit board with flexible section allowing it to contact heat sink element |
| 03/24/1994 | CA2106643A1 Pcb relay having an improved terminal structure |
| 03/23/1994 | EP0588648A1 Glass-cloth epoxy sheet and method and apparatus for manufacturing the same |
| 03/23/1994 | EP0588591A1 Reinforced poly(arylene sulfide)resins having reduced flash |
| 03/23/1994 | EP0588136A2 Polymer thick film resistor compositions |
| 03/23/1994 | EP0588093A1 Method of treating surface of wiring on circuit board |
| 03/23/1994 | EP0587644A1 Printed wire boards and method of making same. |
| 03/23/1994 | EP0587634A1 Method of manufacturing a multilayer printed wire board. |
| 03/23/1994 | CA2106709A1 Epoxy resin composition and copper-clad laminate |
| 03/22/1994 | US5297107 Interconnect arrangement for electronic components disposed on a circuit board |
| 03/22/1994 | US5297007 E/M shielded RF circuit board |
| 03/22/1994 | US5296831 Coil arrangement for a focusing or track control circuit |
| 03/22/1994 | US5296782 Front mask of display device and manufacturing method thereof |
| 03/22/1994 | US5296748 Clock distribution system |
| 03/22/1994 | US5296651 Flexible circuit with ground plane |
| 03/22/1994 | US5296649 Pads wuth solder layers |
| 03/22/1994 | US5296567 Thermocurable compositions |
| 03/22/1994 | US5296414 Containing lead, zinc, boron, germanium, silicon, tin oxides, metal oxide colorant |
| 03/22/1994 | US5296413 A paste for applying patterns to glass windows, containing silver, glass frits and lead borosilicates or lead silicates with oxides of manganese, iron and cobalt |
| 03/22/1994 | US5296259 Coating substrate with salt solution, drying, heating, forming tacky patterned adhesive layer, applying metal powder, firing to remove adhesive and sinter powder |
| 03/22/1994 | US5296189 Ball milling mixture of particles and additive, jet impact milling to form powder with uniformly distributed additive |
| 03/22/1994 | US5296074 Method for bonding small electronic components |
| 03/22/1994 | US5295869 Electrically balanced connector assembly |
| 03/22/1994 | US5295838 Raised feature/gold dot pressure interconnections of rigid-flex circuits and rigid circuit boards |
| 03/22/1994 | CA1327896C Low wear resistor card for use in a liquid fuel sender circuit |
| 03/17/1994 | WO1994006216A1 Method and apparatus for crosstalk cancellation in data connectors |