| Patents for H05K 1 - Printed circuits (98,583) |
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| 05/17/1994 | US5312442 Energy dissipation resistor for implantable defibrillation circuitry |
| 05/11/1994 | WO1994010824A1 Backplane printed circuit board for a module frame |
| 05/11/1994 | EP0596721A1 Noise filter |
| 05/11/1994 | EP0596582A1 Bonded ceramic-metal composite substrate and circuit board constructed therewith |
| 05/11/1994 | DE4337451A1 Mfr. of thermal fuse for telephone circuit overload applications - has M-shaped wire fuse of spring material with ends fixed under compression to contact pads on circuit board |
| 05/11/1994 | DE4237766A1 Repair and correction process for circuit boards - uses material coatings applied separately by metering heads |
| 05/11/1994 | DE4237611A1 Circuit board prodn. and circuit board - uses further layer of resin-impregnated fabric to cover conductive paths formed on composite baseboard |
| 05/11/1994 | DE4237496A1 Ribbon cable connection unit - has housing with contacts that are engaged by ribbon using push-in plug that locates in recess |
| 05/11/1994 | DE4237080A1 Multilayer film integrated circuit for microprocessor chip - has vapour-deposited thin film circuits laid out on flexible strip for rolling with interlayer of insulating material |
| 05/11/1994 | CN1086631A Substrate for thick-film circuit and its manufacturing method |
| 05/10/1994 | US5311406 Microstrip printed wiring board and a method for making same |
| 05/10/1994 | US5311405 Method and apparatus for aligning and attaching a surface mount component |
| 05/10/1994 | US5311403 Printed substrate for mounting high-power semiconductor chip thereon and driver component making use of the printed substrate |
| 05/10/1994 | US5311398 Housing for motor vehicle electronic system |
| 05/10/1994 | US5311396 Smart card chip-based electronic circuit |
| 05/10/1994 | US5311164 Surge absorber |
| 05/10/1994 | US5310966 Wiring boards and manufacturing methods thereof |
| 05/10/1994 | US5310363 Impedance matched reduced cross talk electrical connector system |
| 05/10/1994 | US5309632 Process for producing printed wiring board |
| 05/10/1994 | US5309629 Method of manufacturing a multilayer circuit board |
| 05/10/1994 | US5309625 Card type fuse and method of producing the same |
| 05/05/1994 | DE4237083A1 Interconnection of adjacent circuit assemblies - by solder connecting circuit lines at bent edges of flexible substrates |
| 05/05/1994 | DE4236593A1 Rückwandleiterplatte für einen Baugruppenrahmen Backplane for a shelf |
| 05/04/1994 | EP0595752A1 Interconnect structure having improved metallization |
| 05/04/1994 | EP0595600A1 Semiconductor device package |
| 05/04/1994 | EP0595068A1 Adhesive composition with functional filler |
| 05/04/1994 | EP0594987A1 Electric module |
| 05/04/1994 | EP0594932A1 Method for forming patterned transparent conducting film |
| 05/04/1994 | CN1086227A Attenuation of polymer substrate degradation due to ultraviolet radiation |
| 05/03/1994 | USH1306 Method of using an improved solder to bridge a nonmetallic gap between metallic surfaces, said improved solder, and an improved solder connection to bridge a nonmetallic gap between metallic surfaces |
| 05/03/1994 | US5309327 Apparatus and method for manufacturing printed circuit boards |
| 05/03/1994 | US5309326 Circuit module having stacked circuit boards |
| 05/03/1994 | US5309324 Device for interconnecting integrated circuit packages to circuit boards |
| 05/03/1994 | US5309316 Terminal structure of flexible printed circuit board |
| 05/03/1994 | US5309121 Signal transfer line having a din connector |
| 05/03/1994 | US5309021 Semiconductor device having particular power distribution interconnection arrangement |
| 05/03/1994 | US5309020 Packaged semiconductor device assembly including two interconnected packaged semiconductor devices mounted on a common substrate |
| 05/03/1994 | US5308928 Soldering interconnects for selective line coupling |
| 05/03/1994 | US5308927 Wiring board and a method of manufacturing |
| 05/03/1994 | US5308926 Compact isolating backplane for routing electronic signals |
| 05/03/1994 | US5308888 Heat resistant, fire retardant resin |
| 05/03/1994 | US5308686 Substrate having a multiple metal protected conductive layer and method of manufacturing the same |
| 05/03/1994 | US5308684 Burning pattern sheet |
| 05/03/1994 | US5308679 Raveling-preventing agent for glass fiber woven fabric, and glass fiber woven fabric to which the agent is applied |
| 05/03/1994 | US5308644 Method for manufacturing a printed wiring board having a shield layer |
| 05/03/1994 | US5308565 Method of preparing modified polyphenylene oxide resin systems for electrical laminates having improved solderability and solvent resistance |
| 05/03/1994 | US5308241 Surface shaping and finshing apparatus and method |
| 05/03/1994 | US5307980 Solder pad configuration for wave soldering |
| 05/03/1994 | US5307561 Method for making 3-D electrical circuitry |
| 05/03/1994 | CA2043359C Line termination adaptor convecting device |
| 04/28/1994 | WO1994009182A1 Metal powder composition for metallization and metallized substrate |
| 04/28/1994 | DE4235919A1 Thin film circuit manufacturing method - gilding remaining copper surfaces after removal of exposed parts of first relatively thin copper layer |
| 04/27/1994 | EP0594427A2 A printed circuit board mounted with electric elements thereon |
| 04/27/1994 | EP0594409A1 A connection device for a printed wiring board |
| 04/27/1994 | EP0594367A1 A display device |
| 04/27/1994 | EP0594200A2 Backplane wiring for hub in packet data communications system |
| 04/27/1994 | EP0593584A1 Electrical connection system. |
| 04/27/1994 | CN1085917A Method of preparing vegetalbe oil-modified phenolic resin and laminate produced by using the same |
| 04/27/1994 | CN1085878A Partially crystallizable low melting glass |
| 04/27/1994 | CN1024341C Method for producing thin film patterns on glass substrate |
| 04/26/1994 | US5307519 Circuit with built-in heat sink |
| 04/26/1994 | US5307503 Shielded circuit module with terminal pins arrayed on four sides for connection to a computer board |
| 04/26/1994 | US5307309 Memory module having on-chip surge capacitors |
| 04/26/1994 | US5307241 Electronic circuit board arrangements including main auxiliary circuit boards |
| 04/26/1994 | US5306967 Apparatus for improving signal transmission along parallel lines |
| 04/26/1994 | US5306961 Low-power integrated circuit with selectable battery modes |
| 04/26/1994 | US5306898 Heater for sheet material |
| 04/26/1994 | US5306874 Electrical interconnect and method of its manufacture |
| 04/26/1994 | US5306741 Method of laminating polyimide to thin sheet metal |
| 04/26/1994 | US5306670 Multi-chip integrated circuit module and method for fabrication thereof |
| 04/26/1994 | US5306602 Multistep process; press heat bonding an electrically insulative bonding suspension paint |
| 04/26/1994 | US5306571 Metal-matrix-composite |
| 04/26/1994 | US5306541 Printed circuit board and terminal board with staggered conductive pads |
| 04/26/1994 | US5305523 Method of direct transferring of electrically conductive elements into a substrate |
| 04/21/1994 | DE4335800A1 Assembly of thick-film microcircuit package to printed circuit board - involves interposition of solder plate between indium coatings on respective earth planes of corresp. dimensions |
| 04/20/1994 | EP0593155A1 Parts installation structure and method of manufacturing parts installation structure |
| 04/20/1994 | EP0592937A2 Tracking resistant material and circuit substrate using the material |
| 04/20/1994 | EP0592471A1 Method of treating the surface of moulded polyamide articles, and the articles thus obtained. |
| 04/20/1994 | CN1085686A Polymer thick film resistor compositions |
| 04/19/1994 | US5305182 Read/write unit for two integrated circuit cards |
| 04/19/1994 | US5305179 Surface-mounting type semiconductor package having an improved efficiency for heat dissipation |
| 04/19/1994 | US5305130 Connecting tape, film carrier type IC for driving a liquid crystal display panel and method for making wiring interconnections |
| 04/19/1994 | US5304922 Electrical circuit with resilient gasket support for raised connection features |
| 04/19/1994 | US5304843 Semiconductor device using film carrier |
| 04/19/1994 | US5304741 Speaker cable |
| 04/19/1994 | US5304626 Polyimide copolymers containing 3,3',4,4'-tetracarboxybiphenyl dianhydride (BPDA) moieties |
| 04/19/1994 | US5304521 Dielectric ceramic composition containing ZnO-B2 O3 -SiO2 glass, method of preparing the same, and resonator and filter using the dielectric ceramic composition |
| 04/19/1994 | US5304518 Hybrid package, glass ceramic substrate for the hybrid package, and composition for the glass ceramic substrate |
| 04/19/1994 | US5304399 Method of producing epoxy resin film |
| 04/19/1994 | US5304274 Method for manufacturing electrodes for multilayer ceramic capacitors |
| 04/19/1994 | US5303618 Via hole punch |
| 04/14/1994 | WO1994008445A1 Electromagnetic radiation reduction technique using grounded conductive traces circumscribing internal planes of printed circuit boards |
| 04/14/1994 | WO1994008443A1 Method and apparatus for fabricating printed circuit boards |
| 04/14/1994 | WO1994008366A1 Contacting device for a film with several conductor tracks |
| 04/14/1994 | DE4234022A1 Layered circuit with power resistor(s) - has extra ceramic carrier layer in heat conductive contact with power resistor |
| 04/13/1994 | EP0592145A2 Polyphenylene ether/polyepoxide resin system |
| 04/13/1994 | EP0591887A2 Printed wiring board |
| 04/13/1994 | EP0591761A2 A two-sided printed circuit board, a multi-layered printed circuit board, and a method for producing the same |
| 04/13/1994 | EP0591733A1 Method for producing multilayered ceramic substrate |
| 04/13/1994 | EP0591631A1 Power semiconductor device |