Patents for H05K 1 - Printed circuits (98,583)
07/1999
07/21/1999EP0929999A2 A protective device for shielding an electrical apparatus against environmental conditions
07/21/1999EP0929998A1 Method for metallizing at least one printed circuit board or at least one pressed screen and at least one hybrid
07/21/1999EP0929428A1 Valve control device with tridimensional printed board in mid technology
07/21/1999EP0901696A4 Smart card computer adaptor
07/21/1999CN1223543A Vias and method for making the same in organic board and chip carriers
07/21/1999CN1223541A Printed circuit boards for mounting semiconductor integrated circuit die
07/21/1999CN1044306C Circuit board arrangement including shielding grids, and constructing thereof
07/20/1999US5926731 Method for controlling solder bump shape and stand-off height
07/20/1999US5926696 Ball grid array plastic package
07/20/1999US5926440 Electro-luminescent night light and time piece
07/20/1999US5926379 Electronic card assembly by means of solder connections
07/20/1999US5926378 Low profile riser card assembly using paired back-to-back peripheral card connectors mounted on universal footprints supporting different bus form factors
07/20/1999US5926377 Multilayer printed board
07/20/1999US5926376 Printed circuit board card for mounting packages in faces thereof
07/20/1999US5926375 Surface mounting structure
07/20/1999US5926371 Heat transfer apparatus which accommodates elevational disparity across an upper surface of a surface-mounted semiconductor device
07/20/1999US5926358 Lead frame capacitor and capacitively-coupled isolator circuit using same
07/20/1999US5926171 Coordinate data input device
07/20/1999US5926075 Antenna switch
07/20/1999US5926003 Battery charger
07/20/1999US5925948 Axial flow fan motor
07/20/1999US5925451 Sintered substrate with thermosetting resin impregnated into pores; low dielectric constant
07/20/1999US5925445 Printed wiring board
07/20/1999US5925443 Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias
07/20/1999US5925402 Depositing resin powder on substrate, exposing it to laser beam to form fused patterns, removing excess powder, then covering patterns with uniform thickness of removable coating powder, fusing and/or curing second layer
07/20/1999US5924899 Modular connectors
07/20/1999US5924873 Flexible circuit board interconnect with strain relief
07/20/1999US5924623 Diffusion patterned C4 bump pads
07/20/1999CA2130225C Interconnection structure for crosstalk reduction to improve off-chip selectivity
07/15/1999WO1999035725A1 An improved connector scheme for a power pod power delivery system
07/15/1999WO1999035712A2 Electric connector
07/15/1999WO1999035697A1 Infrared receiver having improved spatial coverage
07/15/1999WO1999035689A1 Semiconductor package converter module
07/15/1999WO1999035687A1 Low-inductance, gate-controlled thyristor
07/15/1999WO1999035686A1 A vertical connector based packaging solution for integrated circuits
07/15/1999WO1999025165A3 Modular and multifunctional structure
07/15/1999DE19900175A1 Wire harness system for motor vehicle wiring
07/15/1999DE19800707A1 Elektrische Steckverbindung Electrical plug connection
07/15/1999DE19800691A1 Material for making multilayer circuit boards
07/15/1999DE19800469A1 Niederinduktiv angesteuerter, gategesteuerter Thyristor Low inductance is overdriven, gate-controlled thyristor
07/15/1999DE19753148A1 Metal-ceramic substrate for electrical circuit
07/14/1999EP0929208A2 A flexible chemically-milled circuit assembly with multiple conductor layers and method of making same
07/14/1999EP0929207A2 Multi-layer ceramic substrate and method for producing the same
07/14/1999EP0929123A1 Heavy-current flowing circuit substrate, a method for producing the heavy-current flowing circuit substrate, and an assembled unit of a heavy-current flowing circuit substrate and a printed circuit substrate
07/14/1999EP0756540B1 Composite article and method for making same
07/14/1999CN1223014A Substrate with conductor formed of low-resistance aluminum alloy
07/14/1999CN1222824A Heavy-current flowing circuit substrate, and assembled unit and manufacturing method thereof
07/14/1999CN1222744A Hybrid circuit device with overload protection
07/14/1999CN1222686A Flexible printed board
07/14/1999CN1044163C Leading-out terminal electric units for surface fastening
07/13/1999US5923620 Module structure and electronic device
07/13/1999US5923540 Semiconductor unit having semiconductor device and multilayer substrate, in which grounding conductors surround conductors used for signal and power
07/13/1999US5923539 Multilayer circuit substrate with circuit repairing function, and electronic circuit device
07/13/1999US5923538 Support member for mounting a microelectronic circuit package
07/13/1999US5923535 Electronic device assembly
07/13/1999US5923531 Enhanced circuit board arrangement for a computer
07/13/1999US5923529 Card slot unit for a personal computer
07/13/1999US5923519 Surge protection device
07/13/1999US5923501 Carriage structure for disk device
07/13/1999US5923393 Liquid crystal display
07/13/1999US5923239 Electrical assembly
07/13/1999US5923232 Electrical apparatus for use at high altitudes
07/13/1999US5923218 Device with amplifier means including safety means, and with filter means connected to the amplifier means
07/13/1999US5923115 Low mass in the acoustic path flexible circuit interconnect and method of manufacture thereof
07/13/1999US5923084 Semiconductor device for heat discharge
07/13/1999US5922989 Electronic part and method for inhibiting intrusion of soldering flux
07/13/1999US5922627 Low resistivity palladium-silver compositions
07/13/1999US5922514 Thick film low value high frequency inductor, and method of making the same
07/13/1999US5922453 Ceramic-filled fluoropolymer composite containing polymeric powder for high frequency circuit substrates
07/13/1999US5922448 Multifunctional cyanate ester and epoxy blends
07/13/1999US5922403 Adding encapsulant to highly dispersed colloidal suspension of solid particles to encapsulate individual particles; agglomerating; isolating encapsulated particles by separation from solvent layer
07/13/1999US5922397 Metal-plating of cured and sintered transient liquid phase sintering pastes
07/13/1999US5922245 A mixture comprising an electrically conductive metal powder and a calcined material capable of forming a crystal phase during sintering, a calcined material of kaolin and an alkaline metal or alkaline earth metal carbonate
07/13/1999US5922168 Apparatus for making laminated electrical and electronic devices
07/13/1999US5922059 Circuit board connector
07/13/1999US5921820 Passive component
07/13/1999US5921818 Low crosstalk electrical connector
07/13/1999US5921817 Multipin plug connector adapter
07/13/1999US5921087 Method and apparatus for cooling integrated circuits using a thermoelectric module
07/13/1999US5920972 Interconnection method for a multilayer transducer array
07/13/1999CA2098330C Electrical device cooling system using a heat sink attached to a circuit board containing heat conductive layers and channels
07/09/1999CA2240511A1 Heavy-current flowing circuit substrate, a method for producing the heavy-current flowing circuit substrate, and an assembled unit of a heavy-current flowing circuit substrate anda printed circuit substrate
07/08/1999WO1999034657A2 Hybrid circuit with a heat dissipation system
07/08/1999WO1999034656A1 Molded electronic package, method of preparation and method of shielding
07/08/1999WO1999034655A1 Multilayer printed wiring board
07/08/1999WO1999034654A1 Multilayer printed wiring board
07/08/1999WO1999034556A2 Method and system for packaging service logic programs in an advanced intelligent network
07/08/1999WO1999034380A2 Flat electrolytic capacitor
07/08/1999WO1999034373A1 Cable and method of manufacturing it
07/08/1999WO1999034112A2 Apparatus for routing electrical signals in an engine
07/08/1999DE19758200A1 Modular computer arrangement
07/08/1999DE19757612C1 Hybridschaltung mit einem System zur Wärmeableitung Hybrid circuit with a system for heat dissipation
07/08/1999DE19757227A1 Production of polyester impregnating resin giving self-extinguishing product and avoiding emissions
07/07/1999EP0928050A2 Electrical connector for circuit card assemblies
07/07/1999EP0928029A2 Multi-layer circuit board layout
07/07/1999EP0928026A1 Plastic Moulded Package for a Semiconductor Device
07/07/1999EP0928025A2 Wiring board and process for the production thereof
07/07/1999EP0927502A1 Modularized hearing aid circuit structure
07/07/1999EP0647251B1 Surface mount conductive adhesives
07/06/1999US5920789 Technique for producing interconnecting conductive links