| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 08/10/1999 | US5935452 Resin composition and its use in production of multilayer printed circuit board |
| 08/10/1999 | US5935365 Manufacturing method and manufacturing apparatus for ceramic electronic components |
| 08/10/1999 | US5934914 Microelectronic contacts with asperities and methods of making same |
| 08/10/1999 | CA2072262C Semiconductor device and method for manufacturing the same |
| 08/05/1999 | WO1999039556A1 Method for recycling used plates and composite plate produced with the same |
| 08/05/1999 | WO1999039555A1 Circuit board |
| 08/05/1999 | WO1999039554A2 Embedded energy storage device |
| 08/05/1999 | DE4244971C2 Integrated laminated microwave circuit for motor vehicle communication system |
| 08/05/1999 | DE19903602A1 Monolithic ceramic substrate is produced especially for an LSI |
| 08/05/1999 | DE19903585A1 Semiconductor sensor for medical or automotive industries, or other areas, e.g. for measuring and calibration |
| 08/05/1999 | DE19903342A1 Multiple chip module |
| 08/05/1999 | DE19820358C1 Optoelectronics sensor, esp. for use as a light barrier or light sensor |
| 08/05/1999 | CA2320897A1 Embedded energy storage device |
| 08/04/1999 | EP0933816A2 Hybrid module and methods for manufacturing and mounting thereof |
| 08/04/1999 | EP0933813A2 Semiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said package |
| 08/04/1999 | EP0933681A1 Positive-tone photoimageable crosslinkable coating |
| 08/04/1999 | EP0933385A2 Flame retardant epoxy resin for printed board, prepreg, and metal foil clad laminate using the same |
| 08/04/1999 | EP0933010A1 Printable compositions, and their application to dielectric surfaces used in the manufacture of printed circuit boards |
| 08/04/1999 | EP0932880A1 Chip card with a contact zone and method of producing such a chip card |
| 08/04/1999 | EP0932500A1 Method to control cavity dimensions of fired multilayer circuit boards on a support |
| 08/04/1999 | CN1224912A High frequency switching device |
| 08/03/1999 | US5933343 Multi-deck power converter module |
| 08/03/1999 | US5933329 Board for mounting display element |
| 08/03/1999 | US5933327 Wire bond attachment of a integrated circuit package to a heat sink |
| 08/03/1999 | US5933324 Apparatus for dissipating heat from a conductive layer in a circuit board |
| 08/03/1999 | US5933307 Printed circuit board sparkgap |
| 08/03/1999 | US5933121 Antenna array for sensing signals on conductors |
| 08/03/1999 | US5933116 Chip antenna |
| 08/03/1999 | US5932891 Semiconductor device with test terminal and IC socket |
| 08/03/1999 | US5932637 Fireproofing laminate consists of an epoxy resin, a maleimide compound, a curing agent having amino group and a phosphorus ester and a substrate; halogen-free and non-deterioration |
| 08/03/1999 | US5932496 Composite materials |
| 08/03/1999 | US5932351 Heat resistant resin composition and adhesive sheet using the same |
| 08/03/1999 | US5932345 Thermally fusible adhesive copolymer, articles made therefrom, and method for producing the same |
| 08/03/1999 | US5932326 Ceramic wiring boards and method for their manufacture |
| 08/03/1999 | US5932324 Material for producing electrically conducting connections in thermoplastic moldings |
| 08/03/1999 | US5932280 Printed circuit board having printed resistors and method of making printed resistors on a printed circuit board using thermal transfer techniques |
| 08/03/1999 | US5932047 Circuitized structure including flexible circuit with elastomeric member bonded thereto and method of making |
| 08/03/1999 | US5932043 Method for flat firing aluminum nitride/tungsten electronic modules |
| 08/03/1999 | US5931703 Low crosstalk noise connector for telecommunication systems |
| 08/03/1999 | US5931692 Connector for an array of electrical cables |
| 08/03/1999 | US5931682 Connector connecting structure |
| 08/03/1999 | US5931577 Display device and method for making the same |
| 07/30/1999 | CA2243727A1 Positive-tone photoimageable crosslinkable coating |
| 07/29/1999 | WO1999038366A1 Multilayered substrate |
| 07/29/1999 | WO1999038229A1 Robust, small scale electrical contactor |
| 07/29/1999 | WO1999037704A1 Heat-resistant insulating film, raw substrate for printed wiring board using the same and method for producing the substrate |
| 07/29/1999 | DE19859119A1 Thermally conductive insulating circuit board for a power module useful in electrically driven vehicles |
| 07/29/1999 | DE19802243A1 Multilayer substrate especially a multilayer circuit board with digital circuits |
| 07/29/1999 | DE19802089A1 Connector socket for multilayer circuit boards, especially for testing SMD boards |
| 07/28/1999 | EP0932328A1 Substrate for mounting electronic part and process for manufacturing the same |
| 07/28/1999 | EP0932255A2 MCM with high Q overlapping resonator |
| 07/28/1999 | EP0932199A2 Electronic circuit package with diamond film heat conductor |
| 07/28/1999 | EP0932178A2 High frequency switching device |
| 07/28/1999 | EP0931816A1 Norbornene polymer composition |
| 07/28/1999 | EP0931346A1 Microelectronic component with a sandwich design |
| 07/28/1999 | EP0775716B1 Novel heat-fusible copolymer, and powder, film, laminated heat insulator, electronic module, and capacitor produced from said copolymer, and process for producing the same |
| 07/28/1999 | CN1224565A Thick-film conductor circuit and production method therefor |
| 07/28/1999 | CN1224326A Conductive formation and electronic equipment using such conductive formation |
| 07/28/1999 | CN1224038A Water-based thick film conductive compositions |
| 07/27/1999 | US5930676 Multilayered interconnection substrate and process for fabricating the same |
| 07/27/1999 | US5930601 From a heat dissipating circuit |
| 07/27/1999 | US5930119 Backplane having reduced LC product |
| 07/27/1999 | US5930112 Circuit board architecture for a motor controller |
| 07/27/1999 | US5929746 Surface mounted thin film voltage divider |
| 07/27/1999 | US5929743 Mounting structure for thermistor with positive resistance-to-temperature characteristic |
| 07/27/1999 | US5929733 Multi-layer printed substrate |
| 07/27/1999 | US5929729 Printed lumped element stripline circuit ground-signal-ground structure |
| 07/27/1999 | US5929627 Surface mount polarized electrical components on a printed circuit board and method thereof |
| 07/27/1999 | US5929518 Circuit board and method |
| 07/27/1999 | US5929375 EMI protection and CTE control of three-dimensional circuitized substrates |
| 07/27/1999 | US5929246 N-aminoalkyldibenzothiophenecarboxamides; new dopamine receptor subtype specific ligands |
| 07/27/1999 | US5929208 Combinatorial synthesis of biopolymers by contacting substrate with solution of monomer a, selectively biasing locations to specifically concentrate monomer a, removing unreacted monomer a, repeating with other monomers |
| 07/27/1999 | US5929199 Polycyanurates |
| 07/27/1999 | US5928970 Dustfree prepreg and method for making an article based thereon |
| 07/27/1999 | US5928791 Low dielectric constant material with improved dielectric strength |
| 07/27/1999 | US5928769 Aluminum nitride wiring substrate and method for production thereof |
| 07/27/1999 | US5928767 Conductive film composite |
| 07/27/1999 | US5928757 Polyimide |
| 07/27/1999 | US5928727 Etching a surface of said article with an etching solution comprising trivalent chromium ions, hexavalent chromium ions and chromic acid-sulfuric acid, catalyzing surface with noble metal salt solution, electrolessly depositing metal layer |
| 07/27/1999 | US5928568 Limiting leaching and diffusion during high temperature operation, limiting formation of an intermetallic region |
| 07/27/1999 | US5928567 Solvent free liquid conductive material for printed circuit boards |
| 07/27/1999 | US5928001 Surface mountable flexible interconnect |
| 07/27/1999 | US5927193 Process for via fill |
| 07/27/1999 | US5926951 Method of stacking electronic components |
| 07/26/1999 | CA2258438A1 Electronic circuit package with diamond film heat conductor |
| 07/22/1999 | WO1999037018A1 Piezo-oscillator |
| 07/22/1999 | WO1999037008A1 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| 07/22/1999 | WO1999036962A1 Semiconductor component with several substrate layers and at least one semiconductor chip and method for producing a semiconductor component |
| 07/22/1999 | WO1999036959A1 High-density computer modules with stacked parallel-plane packaging |
| 07/22/1999 | WO1999036958A1 Semiconductor device and method of production thereof and semiconductor mounting structure and method |
| 07/22/1999 | WO1999036454A1 Modified polyimide resin and thermosetting resin composition containing the same |
| 07/22/1999 | WO1999036126A1 Implantable defibrillator with stacked transistor subassemblies |
| 07/22/1999 | DE19902125A1 Thick film circuit board useful as an IC substrate installed in an automobile engine compartment |
| 07/22/1999 | DE19842800A1 Surface mountable casing for high frequency integrated circuits |
| 07/22/1999 | DE19801312A1 Semiconductor element with semiconductor chip for multi-chip module |
| 07/22/1999 | DE19758197A1 Semiconductor memory chip stacking arrangement for large memory capacity computer application |
| 07/22/1999 | CA2318083A1 Implantable defibrillator with stacked transistor subassemblies |
| 07/21/1999 | EP0930812A2 Surface mount holding feature |
| 07/21/1999 | EP0930601A2 Method of fabrication of a dot matrix display device |
| 07/21/1999 | EP0930393A1 Heat-resistant fiber paper |