Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
11/2000
11/22/2000CN1274173A Method of mfg. carrying band and carrying band type semiconductor device
11/22/2000CN1058834C Support drawer of circuit board
11/22/2000CN1058741C Aqueous silver compsn.
11/21/2000US6151235 Card type semiconductor memory device for storing analog image signals in separate analog memory card units
11/21/2000US6151221 Printed circuit board having wire clamps for securing component leads
11/21/2000US6151220 Mounting structure for electronic part
11/21/2000US6151215 Single mount and cooling for two two-sided printed circuit boards
11/21/2000US6150895 Circuit board voltage plane impedance matching
11/21/2000US6150813 Method of connecting heads of a data storage system to a testing apparatus
11/21/2000US6150729 Routing density enhancement for semiconductor BGA packages and printed wiring boards
11/21/2000US6150614 Conducting foil for conductively connecting electric and/or electronic components
11/21/2000US6150456 High dielectric constant flexible polyimide film and process of preparation
11/21/2000US6150255 Method of planarizing a curved substrate and resulting structure
11/21/2000US6150186 Method of making a product with improved material properties by moderate heat-treatment of a metal incorporating a dilute additive
11/21/2000US6150074 Method of forming electrically conductive wiring pattern
11/21/2000US6150071 Fabrication process for flex circuit applications
11/21/2000US6150061 Placing mask around the perimeter of a plated through hole (pth); the clover leaf shaped opening maintains the necessary barrier between the pth and adjacent lands while providing additional clearance around the pth
11/21/2000US6150041 Thick-film circuits and metallization process
11/21/2000US6149988 Method and system of laser processing
11/21/2000US6148900 Connecting board for connection between base plate and mounting board
11/21/2000US6148505 System and method for wiring electronic components in a three-dimensional manner
11/20/2000CA2308943A1 Surface mount millimeter wave ic package
11/16/2000WO2000069239A1 Method for manufacturing a printed circuit board with integrated heat sink for semiconductor package
11/16/2000WO2000069237A1 Method for producing contact between two circuit layers separated by an insulating layer
11/16/2000WO2000069236A1 A thermally enhanced via/bga microwave circuit ceramic package
11/16/2000WO2000069234A1 Wiring method and wiring device
11/16/2000WO2000069233A1 Arrangement, method and positioning board in a rack of a cross connect node
11/16/2000WO2000069232A1 Thermosetting polymer systems and electronic laminates
11/16/2000WO2000069028A1 Printed circuit board connector
11/16/2000WO2000068996A1 Surface mount ic stacking method and device
11/16/2000WO2000068972A2 Method of creating an electrical interconnect device bearing an array of electrical contact pads
11/16/2000WO2000068960A1 Polymer thick-film resistor printed on planar circuit board surface
11/16/2000WO2000031163A3 Poly(arylene ether) homopolymer compositions and methods of manufacture thereof
11/16/2000DE19912519A1 Method of electrically connecting circuit boards
11/16/2000DE19901107C1 Lumineszierender elektrisch leitender Klebstoff Luminescent electrically conductive adhesive
11/16/2000CA2373154A1 Thermosetting polymer systems and electronic laminates
11/16/2000CA2368141A1 Printed circuit board connector
11/16/2000CA2337809A1 Method for producing contact between two circuit layers separated by an insulating layer
11/15/2000EP1052736A1 Electrical connecting system for flat cable
11/15/2000EP1052732A2 Solderless pin connection
11/15/2000EP1052696A2 Electrical interconnection medium
11/15/2000EP1052695A2 Tape carrier and manufacturing method of tape carrier type semiconductor device
11/15/2000EP1051885A1 Thin film transferable electric components
11/15/2000EP1051884A2 Embedded energy storage device
11/15/2000EP1051748A1 A vertical connector based packaging solution for integrated circuits
11/15/2000CN1273762A Printed circit board material and method of manufacturing board material and intermediate block body for board material
11/15/2000CN1273695A Semiconductor device, method of manufacture thereof, circuit board and electronic device
11/15/2000CN1273694A Semiconductor device, method of manufacture thereof circuit board and electronic device
11/15/2000CN1273501A No-welding needle connection
11/15/2000CN1058581C Method of manufacturing a plate of electrically insulating material having a pattern of apertures and/or cavities
11/14/2000US6147876 Multi-chip module having printed wiring board comprising circuit pattern for IC chip
11/14/2000US6147871 Low profile computer assembly using paired back-to-back peripheral card connectors that support different bus form factors and are mounted on a riser card
11/14/2000US6147870 Printed circuit assembly having locally enhanced wiring density
11/14/2000US6147840 One-piece load beam and gimbal flexure using flexible circuit
11/14/2000US6147583 Transformer assembly
11/14/2000US6147565 Piezo-oscillator with heater and temperature control circuit
11/14/2000US6147419 Output-motor assembly
11/14/2000US6147019 Borate glass based ceramic tape
11/14/2000US6146813 Method and shunting and deshunting an electrical component and a shuntable/shunted electrical component
11/14/2000US6146778 Solid-state energy storage module employing integrated interconnect board
11/14/2000US6146749 Having a matrix resin and crosslinked resin particles of cross-linking monomers and non-cross-linking monomers; circuit boards with high reliability in high frequency range; dielectric constant =/<3
11/14/2000US6146743 Barrier metallization in ceramic substrate for implantable medical devices
11/14/2000US6146189 Flexible printed circuit board mounting structure and recording/reproducing apparatus using the same
11/14/2000CA2176789C Wiring board for mounting electronic devices with high-density terminals and method for producing wiring board
11/14/2000CA2049180C High modulus silicones as toughening agents for epoxy resins
11/09/2000WO2000067546A1 Method and device for placing components on substrates, and corresponding substrate
11/09/2000WO2000067539A1 An apparatus comprising electronic and/or optoelectronic circuitry and method for realizing said circuitry
11/09/2000WO2000067538A1 Method for manufacturing solderless high density electronic modules
11/09/2000WO2000067005A1 A method and apparatus for inspecting solder paste deposits on substrates
11/09/2000WO2000066674A1 Dielectric material including particulate filler
11/09/2000DE19919781A1 Leiterplatte und Verfahren zu ihrer Anbringung Circuit board and method of installation
11/09/2000DE19918084A1 High load capacity controller for electrical components, e.g. for electric motor, has flat structure between electrical actuator and circuit board to uniformly distribute heat
11/09/2000DE19918024A1 Circuit board with glass optical layers e.g. for information and communication-equipment
11/09/2000DE10018346A1 Stromkreisanordnung für die Elektrik eines Kraftfahrzeuges Circuit arrangement for the electrical system of a motor vehicle
11/09/2000CA2373172A1 Dielectric material including particulate filler
11/08/2000EP1051062A2 Circuit board mounting system and releasable connector therefor
11/08/2000EP1051061A1 Low dielectric composition, insulating material, sealing material, and circuit board
11/08/2000EP1050888A1 Conductive paste, conductive structure using the same, electronic part, module, circuit board, method for electrical connection, method for manufacturing circuit board, and method for manufacturing ceramic electronic part
11/08/2000EP1050093A1 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
11/08/2000EP1050089A1 Secondary electric power distribution cabinet in an aeroplane
11/08/2000EP1050077A1 High-density computer modules with stacked parallel-plane packaging
11/08/2000EP0883977B1 Non-ohmic energy coupling for cross talk reduction
11/08/2000CN1272963A Mounting structure of piezoelectric transformer and method of mounting piezoelectric transformer
11/08/2000CN1272892A Conductor track structures arranged on nonconductive material, espectially fine conductor track structure, and method for producing the same
11/08/2000CN1272692A Semiconductor module
11/08/2000CN1272424A Composite base laminated board covered with copper foil and its production method
11/08/2000CN1058225C Ink jet recording head, ink jet recording head cartridge and recording apparatus using same
11/07/2000US6144571 Semiconductor module, power converter using the same and manufacturing method thereof
11/07/2000US6144559 Process for assembling an interposer to probe dense pad arrays
11/07/2000US6144558 Parts installation structure having electronic part connected to flexible sheet with conductive and non-conductive adhesives
11/07/2000US6144557 Self-locking conductive pin for printed wiring substrate electronics case
11/07/2000US6144278 Transformer assembling method, transformer, transformer-mounted substrate, power supply unit having transformer-mounted substrate, and recording apparatus including power supply unit
11/07/2000US6144213 Ball grid array probing technique
11/07/2000US6144090 Ball grid array package having electrodes on peripheral side surfaces of a package board
11/07/2000US6144013 Local humidity control system for low temperature electronic module
11/07/2000US6143992 Circuit board with terminals having a solder lead portion
11/07/2000US6143991 Bump electrode with adjacent pad and insulation for solder flow stopping
11/07/2000US6143990 Printed wiring board with two ground planes connected by resistor
11/07/2000US6143989 Active alignment/contact verification system
11/07/2000US6143475 Polyimide precursor, polyimide and their use
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