| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 12/07/2000 | DE19922553A1 Low temperature co-fired ceramic circuit support is produced using the high glass content of a ceramic substrate to create adhesion to a low glass content conductive paste on firing |
| 12/07/2000 | DE19922468A1 Method of producing 3D conductor structure, involves metallising hollow channel for connecting conducting layers in free area of insulating layer using metal particles as seeds |
| 12/07/2000 | DE19921659A1 Microvalve assembly, e.g. for pneumatic system, has housing with molded interconnect device structure for electrically connecting electronic drive components and microvalves |
| 12/07/2000 | DE19921021A1 Leiterplatten-Steckverbinder PCB Connectors |
| 12/07/2000 | DE19823685C2 Elektronisches Steuergerät für ein Kraftfahrzeug Electronic control unit for a motor vehicle |
| 12/07/2000 | CA2375135A1 A multi-functional energy conditioner |
| 12/07/2000 | CA2375015A1 Glass fiber composition |
| 12/06/2000 | EP1058492A2 Method of forming distortion-free circuits |
| 12/06/2000 | EP1058491A2 Printed wiring board structure with integral metal matrix composite core |
| 12/06/2000 | EP1058490A2 Printed wiring board structure with integral organic matrix composite core |
| 12/06/2000 | EP1058307A1 Electronic unit effectively utilizing circuit board surface |
| 12/06/2000 | EP1057656A1 Three-layer polyester resin sheet for cards and polyester resin laminates made by using the same |
| 12/06/2000 | EP1057384A1 Electronic control device |
| 12/06/2000 | EP1057221A1 Infrared receiver having improved spatial coverage |
| 12/06/2000 | EP1056699A1 Preparation of polyindanebisphenols and polymers derived therefrom |
| 12/06/2000 | EP0882086A4 Composition exhibiting improved fluorescent response |
| 12/06/2000 | CN1276091A Package substrate |
| 12/06/2000 | CN1275881A Method for producing circuit board |
| 12/06/2000 | CN1275880A Copper foil for printed-circuit board |
| 12/06/2000 | CN1275800A Semiconductor device and making method thereof |
| 12/05/2000 | US6157541 Stack arrangement for two semiconductor memory chips and printed board for accepting a plurality of such stack arrangements |
| 12/05/2000 | US6157534 Backplane having strip transmission line ethernet bus |
| 12/05/2000 | US6157476 Transceiver component for data transmission |
| 12/05/2000 | US6157251 Method and apparatus for clock uncertainty minimization |
| 12/05/2000 | US6157250 Method and apparatus for clock uncertainty minimization with a clean power source |
| 12/05/2000 | US6156980 Flip chip on circuit board with enhanced heat dissipation and method therefor |
| 12/05/2000 | US6156831 Modified cyanate ester group curable resin composition and varnish, prepreg, metal clad laminated board, film, printed circuit board, and multilayered circuit board using the same |
| 12/05/2000 | US6156686 Porous composite ceramic sintered bodies and a production process thereof |
| 12/05/2000 | US6156672 Method of forming dielectric thin film pattern and method of forming laminate pattern comprising dielectric thin film and conductive thin film |
| 12/05/2000 | US6156587 Method of attaching solid state imaging device |
| 12/05/2000 | US6156414 Carrier film and process for producing the same |
| 12/05/2000 | US6156408 Device for reworkable direct chip attachment |
| 12/05/2000 | US6156256 By means of a generated plasma and chemically assisted catalysis. |
| 12/05/2000 | US6156237 Conductive paste and circuit substrate formed by use of the paste |
| 12/05/2000 | US6156138 Method of and structure for fixing a flexible electrical conductor |
| 12/05/2000 | US6156094 Reacting alkaline hydroxide, hydrazine or hydrate with metallic salt in alcoholic solvent; reduction, precipitation |
| 12/05/2000 | US6155119 Arrangement comprising an electrical printed-circuit board and an electrical pressure pick-up |
| 12/05/2000 | CA2232842C Reduced cross talk electrical connector |
| 11/30/2000 | WO2000072647A1 Insulation barrier on a printed circuit board |
| 11/30/2000 | WO2000072645A1 Laser machining of plastic film of circuit board, and method of manufacturing circuit board |
| 11/30/2000 | WO2000072644A1 Sheet for printed wiring board, method of forming via, resin sheet having filled via, printed wiring board and method of manufacturing the same |
| 11/30/2000 | WO2000072643A1 Fabrication of unidirectional laminate prepregs using tape casting methods and equipment |
| 11/30/2000 | WO2000072407A1 Surface mountable connector assembly including a printed circuit board |
| 11/30/2000 | WO2000072163A1 High-speed digital distribution system |
| 11/30/2000 | WO2000047660A3 Electrically conductive flexible composition, methods of making same |
| 11/30/2000 | WO2000042679A3 A printed circuit board |
| 11/30/2000 | DE19930609A1 Manufacturing method for electronic device e.g. voltage controlled oscillators, involves forming structure of 3 conductive, 2 insulating layers, and connecting components on first conductive layer to third structured conductive layer |
| 11/30/2000 | DE19917554A1 Circuit board position location arrangement especially for optical coupler |
| 11/30/2000 | DE10014108A1 Automotive electrical connector for flexible printed circuits has flexible PCB wrapped around rigid card which is inserted along guide channel into cavity in back plane where it contacts second flexible PCB |
| 11/30/2000 | CA2374453A1 Insulation barrier on a printed circuit board |
| 11/29/2000 | EP1056320A2 Copper foil for printed wiring board |
| 11/29/2000 | EP1056318A2 Improvements relating to electrical circuits |
| 11/29/2000 | EP1056133A1 Rf circuit module |
| 11/29/2000 | EP1055708A1 Resin composition, molded article thereof, and process for producing resin composition |
| 11/29/2000 | EP1055650A1 Carbon-based metal composite material, method for preparation thereof and use thereof |
| 11/29/2000 | EP1055255A1 Method and apparatus for coupling circuit components |
| 11/29/2000 | EP1055194A1 Device arranged for contactless communication and provided with a data carrier with fully enclosed holding means for holding a chip and a passive component |
| 11/29/2000 | EP1055190A2 Flat carrier with a display device |
| 11/29/2000 | EP1054844A2 Composite |
| 11/29/2000 | EP1054770A1 Method for transferring a picture to a surface |
| 11/29/2000 | EP0854759A4 Flip chip underfill system and method |
| 11/29/2000 | CN1275306A Printed circuit boards |
| 11/29/2000 | CN1275259A Piezoelectric vibratok container, piezoelectric vibrator using it and circuit board mounting piezoelectric vibrator thereon and production method for piezoelectric vibrator |
| 11/29/2000 | CN1275246A Semiconductor device, method of manufacture, circuit board and electronic device |
| 11/29/2000 | CN1275047A Method for assembling coil on integrated circuit on small-sized electronic component by soldering |
| 11/28/2000 | US6154834 Detachable processor module containing external microcode expansion memory |
| 11/28/2000 | US6154373 High density cross-connection system |
| 11/28/2000 | US6154372 Multichip module for surface mounting on printed circuit boards |
| 11/28/2000 | US6154371 Printed circuit board assembly and method |
| 11/28/2000 | US6154370 Recessed flip-chip package |
| 11/28/2000 | US6154367 Heat sink for printed circuit board |
| 11/28/2000 | US6154118 Circuit protective device with positive temperature coefficient element and electric junction box with the device |
| 11/28/2000 | US6154112 Chip inductor |
| 11/28/2000 | US6153834 Flexible circuit with tabs for connection to battery cells |
| 11/28/2000 | US6153832 Z-fold printhead carriage trailing cable for optimized panelization |
| 11/28/2000 | US6153721 Preparation of polyindanebisphenols and polymers derived therefrom |
| 11/28/2000 | US6153508 Multi-layer circuit having a via matrix interlayer connection and method for fabricating the same |
| 11/28/2000 | US6153290 Multi-layer ceramic substrate and method for producing the same |
| 11/28/2000 | US6153078 Providing unfired ferrite substrate; coating conductive material comprising silver/palladium particles, ferrite particles, cellulose-based binder, solvent; firing substrate; electroplating copper using copper pyrophosphate bath |
| 11/28/2000 | US6152568 Lighting apparatus and display apparatus having the same |
| 11/28/2000 | US6152033 Mechanically printing onto substrate an electroconductive frit transferred from recesses of an fine intaglio patterned surface while curing frit |
| 11/28/2000 | US6151775 Multilayer circuit board and method of producing the same |
| 11/28/2000 | CA2041062C Demetallizing procedure |
| 11/23/2000 | WO2000070676A1 High-density electronic package, and method for making same |
| 11/23/2000 | WO2000070672A1 Creation of a corner of an electric strip conductor, in particular, consisting of copper, which has been produced by damascene work on a substrate |
| 11/23/2000 | WO2000070616A1 Magnetic tape cassette |
| 11/23/2000 | WO2000044066A3 Remote entry integrally molded transmitter |
| 11/23/2000 | DE19955570A1 Stromrichteranordnung Converter assembly |
| 11/23/2000 | DE19923055A1 Transparent package for ball grid array integrated circuit consists of transparent material with channels for connections and contacts to integrated circuit |
| 11/22/2000 | EP1054498A1 Stator structure of motor |
| 11/22/2000 | EP1054447A1 Surface mount millimeter wave IC package |
| 11/22/2000 | EP1054445A1 Electronic package on circuit board and its manufacture |
| 11/22/2000 | EP1054429A1 Compound for producing electrodes and process for forming electrodes |
| 11/22/2000 | EP1054316A1 Security device for electronic circuits against unauthorised access |
| 11/22/2000 | EP1054037A2 Liquid crystal polyester resin composition and molded article thereof |
| 11/22/2000 | EP1053580A1 An improved connector scheme for a power pod power delivery system |
| 11/22/2000 | EP1053507A1 Integral thin-film metal resistor with improved tolerance and simplified processing |
| 11/22/2000 | EP1053214A1 Polymer compound, the production and use thereof, and sintered compacts produced therefrom |
| 11/22/2000 | CN1274516A Substrate for formation of special pattern, and method of manufacture of substrate |
| 11/22/2000 | CN1274270A Fabric or garmet with integrated flexible information infrastructure |