| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 12/21/2000 | WO2000076812A1 Electrical distribution box for vehicles having two networks with different voltage levels |
| 12/21/2000 | WO2000076764A1 Epoxy resin, styrene-maleic anhydride copolymer and flexibilizer |
| 12/21/2000 | WO2000047025A3 Method for forming printed circuit board electrical interconnects |
| 12/21/2000 | DE19944518A1 Soldering integrated circuit or integrated circuit housing onto circuit board having conducting pathway uses lacquer or film mask with non-circular openings |
| 12/21/2000 | DE19926746A1 Multiple arrangement of circuit boards fitted with LEDs has connecting elements with electrical wiring conductor(s) via which circuits on adjacent boards are electrically connected |
| 12/21/2000 | DE19911522A1 Circular lamp for homogenous illumination, incorporates LEDs fitted on a printed circuit board with a photo lens in the region of its center opening for industrial image processing |
| 12/21/2000 | DE10009042A1 Sheet metal component for dual pattern conductor connection for PCB,has conducting, coupling, top regions, region to be soldered in one piece, and conducting region passes through connecting hole |
| 12/21/2000 | CA2374863A1 High density substrate and methods for manufacturing same |
| 12/20/2000 | EP1061784A1 Radio-electronic unit |
| 12/20/2000 | EP1061783A2 Ceramic-metal substrate, particularly multiple substrate |
| 12/20/2000 | EP1061608A2 Board to board electrical connectors |
| 12/20/2000 | EP1061577A2 High frequency multi-layered circuit component |
| 12/20/2000 | EP1061569A2 Method for manufacturing ceramic substrate and non-fired ceramic substrate |
| 12/20/2000 | EP1060648A1 Memory module |
| 12/20/2000 | EP1060647A1 Method of making microwave, multifunction modules using fluoropolymer composite substrates |
| 12/20/2000 | EP1060646A1 Method for manufacturing a resistor |
| 12/20/2000 | EP1060645A1 Electric conductor with a surface structure in the form of flanges and etched grooves |
| 12/20/2000 | EP1060644A2 Backplane having reduced lc product |
| 12/20/2000 | EP1060557A1 Electric drive unit for units of a motor vehicle |
| 12/20/2000 | EP1060213A1 Hybrid materials employing ppe/polystyrene/curable epoxy mixtures |
| 12/20/2000 | EP1060145A1 Inorganic lubricant-coated glass fiber strands and products including the same |
| 12/20/2000 | EP1060144A1 Glass fiber-reinforced laminates, electronic circuit boards and methods for assembling a fabric |
| 12/20/2000 | EP1060143A1 Methods for inhibiting abrasive wear of glass fiber strands |
| 12/20/2000 | EP1060142A1 Glass fiber strands coated with thermally conductive inorganic particles and products including the same |
| 12/20/2000 | EP1060141A1 Impregnated glass fiber strands and products including the same |
| 12/20/2000 | EP0815622A4 Cross-connect method and apparatus |
| 12/20/2000 | CN1277796A Thin-laminate panels for capacative printed-circuit boards ance methods for making the same |
| 12/20/2000 | CN1277736A Method for producing electrically conductive cross connections between two layers of wiring on a substrate |
| 12/20/2000 | CN1277448A Slotted contact for making required voltage of electrofusion fuse minimum |
| 12/20/2000 | CN1277242A Liquid crystal polyester composition and moulded forming products therefrom |
| 12/19/2000 | US6163464 Apparatus for interconnecting logic boards |
| 12/19/2000 | US6163462 Stress relief substrate for solder ball grid array mounted circuits and method of packaging |
| 12/19/2000 | US6163459 Semiconductor mounting system and semiconductor chip |
| 12/19/2000 | US6163456 Hybrid module and methods for manufacturing and mounting thereof |
| 12/19/2000 | US6163443 Actuator having MR element protecting means |
| 12/19/2000 | US6163233 Waveguide with signal track cross-over and variable features |
| 12/19/2000 | US6163069 Semiconductor device having pads for connecting a semiconducting element to a mother board |
| 12/19/2000 | US6163028 Imaging support for removably mounting an imaging device |
| 12/19/2000 | US6162997 Circuit board with primary and secondary through holes |
| 12/19/2000 | US6162996 Insulating foil circuit board with rigid and flexible sections |
| 12/19/2000 | US6162993 Signal conductor |
| 12/19/2000 | US6162889 Curable resin composition for overcoat of flexible circuit |
| 12/19/2000 | US6162876 Cyanate ester based thermoset compositions |
| 12/19/2000 | US6162580 Photosensitive polyimide precursor compositions processable by exposure to short wavelength light |
| 12/19/2000 | US6161915 Identification of thermal inkjet printer cartridges |
| 12/19/2000 | US6161889 Ribbed trim panel for thermal spraying of electrical circuit |
| 12/19/2000 | US6161281 Battery mounting apparatuses, electronic devices, and methods of forming electrical connections |
| 12/19/2000 | CA2101354C Modular jack |
| 12/14/2000 | WO2000076281A1 Multilayer printed wiring board and method of manufacturing multilayer printed wiring board |
| 12/14/2000 | WO2000076280A1 Pattern design for electronic components on a 400 micron copper layer in printed circuits |
| 12/14/2000 | WO2000075991A1 Power feed and heat dissipating device for power semiconductor devices |
| 12/14/2000 | WO2000075932A1 Aqueous carbon composition and method for coating a non conductive substrate |
| 12/14/2000 | WO2000075796A1 Isolated high-speed communication bus |
| 12/14/2000 | DE4109363C2 Klebverbindung zwischen einem elektronischen Bauteil und einem Substrat sowie Verfahren zur Herstellung der Klebverbindung Adhesive connection between an electronic component and a substrate and methods for producing the adhesive bond |
| 12/14/2000 | DE19835517C1 Contact device for automobile control device or electrical component uses plug rail with projecting contacts inserted in circuit board bores via intermediate guide plate |
| 12/14/2000 | DE10018511A1 Electronic module e.g. for telemetry station, has solar cell with concentrator cooled by coolant which passes through heat exchanger on circuit board |
| 12/14/2000 | CA2372440A1 Power feed and heat dissipating device for power semiconductor devices |
| 12/13/2000 | EP1059833A2 Heat transferring printed wiring board |
| 12/13/2000 | EP1059367A2 Manufacturing method of electrodeposited copper foil, electrodeposited copper foil, copper-clad laminate and printed wiring board |
| 12/13/2000 | EP1059333A1 Aqueous polytetrafluoroethylene dispersion composition |
| 12/13/2000 | EP1059324A1 Polyamidic acid-containing and fine particles-dispersed composition and production process therefor |
| 12/13/2000 | EP1059271A1 Composition for ceramic substrate and ceramic circuit component |
| 12/13/2000 | EP1058717A1 Conductive ink or paint |
| 12/13/2000 | CN1276699A Electronic module |
| 12/13/2000 | CN1276442A Electrodeposit copper foil and its mfg method, copper coated laminate and PC board |
| 12/12/2000 | US6160967 Camera having flexible printed circuit board |
| 12/12/2000 | US6160958 Tamper resistant electronic flash unit for one-time-use camera |
| 12/12/2000 | US6160718 Multi-chip package with stacked chips and interconnect bumps |
| 12/12/2000 | US6160716 Motherboard having one-between trace connections for connectors |
| 12/12/2000 | US6160714 Molded electronic package and method of preparation |
| 12/12/2000 | US6160713 Circuit in a selective call radio with improved electromechanical interconnects |
| 12/12/2000 | US6160710 Capacitive mounting arrangement for securing an integrated circuit package to a heat sink |
| 12/12/2000 | US6160647 Optoelectronic transmitter with improved control circuit and laser fault latching |
| 12/12/2000 | US6160469 Large value buried inductors in low temperature co-fired ceramic circuit boards |
| 12/12/2000 | US6160276 Double-sided programmable interconnect structure |
| 12/12/2000 | US6160223 Heat pipe attached to a printed wiring board |
| 12/12/2000 | US6160081 Used as a surface-protecting film or layer insulation film for a semiconductor device |
| 12/12/2000 | US6159883 Ceramic dielectric compositions |
| 12/12/2000 | US6159770 Method and apparatus for fabricating semiconductor device |
| 12/12/2000 | US6159611 Used in electronic circuitry and electronic components such as multilayer printed circuits, flexible circuits, semiconductor packaging and buried film capacitors |
| 12/12/2000 | US6159322 Photosensitive ceramic green sheet, ceramic package, and process for producing the same |
| 12/12/2000 | US6159267 A polycrystallinge metallic phase of >10 weight percent palladium and weight average size 0.1-4 microns; a maximum weight gain of <40% for upon oxidation in air; capacitors; catalysts; electrical thick films |
| 12/12/2000 | US6158341 Method for transferring a picture to a surface |
| 12/12/2000 | US6158268 Measuring sensor |
| 12/12/2000 | US6158119 Circuit board panel test strip and associated method of assembly |
| 12/12/2000 | US6158118 Method and apparatus for aligning surface mounted optoelectric semiconductor devices on a printed circuit board |
| 12/07/2000 | WO2000074449A1 Main board with printed circuit board mounted thereon |
| 12/07/2000 | WO2000074447A1 Method and apparatus for reducing electrical resonances and noise propagation in power distribution circuits employing plane conductors |
| 12/07/2000 | WO2000074446A1 Intelligent power module |
| 12/07/2000 | WO2000074445A1 Sandwich-structured intelligent power module |
| 12/07/2000 | WO2000074436A2 Mounting of the coil in an electroacoustic transducer |
| 12/07/2000 | WO2000074277A1 Method and apparatus for improved optical elements for vertical pcb fiber optic modules |
| 12/07/2000 | WO2000074197A1 A multi-functional energy conditioner |
| 12/07/2000 | WO2000074142A1 Multiple level spiral inductors used to form a filter in a printed circuit board |
| 12/07/2000 | WO2000073855A1 Production device for printed board, production method for printed board and printed board |
| 12/07/2000 | WO2000073832A1 Optoelectronic substrate, circuit board, and method of manufacturing optoelectronic substrate |
| 12/07/2000 | WO2000073234A1 Sizing compositions, fiber strands, fabrics and methods for cleaning sized fiber glass strands |
| 12/07/2000 | WO2000073232A1 Glass fiber composition |
| 12/07/2000 | WO2000073047A1 Method and apparatus for making resin-impregnated fiber substrates |
| 12/07/2000 | DE19923446A1 Line connections for hybrids and modules |