| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 01/03/2001 | EP1064699A1 High frequency bus system |
| 01/03/2001 | EP1064421A1 Base webs for printed circuit board production using the foam process and aramid fibers |
| 01/03/2001 | EP0876306B1 Method of applying a silver layer to a glass substrate |
| 01/03/2001 | CN1278609A Anti-interference electronic flasher for disposable camera |
| 01/03/2001 | CN1060308C Printed circuit board used as connectors |
| 01/02/2001 | US6169663 Integrated circuit connection using an electrically conductive adhesive |
| 01/02/2001 | US6169530 Display apparatus and assembly of its driving circuit |
| 01/02/2001 | US6169328 Semiconductor chip assembly |
| 01/02/2001 | US6169254 Three axis sensor package on flexible substrate |
| 01/02/2001 | US6168971 Method of assembling thin film jumper connectors to a substrate |
| 01/02/2001 | US6168898 Positive acting photodielectric composition |
| 01/02/2001 | US6168855 Polyolefin composites for printed circuit board and antenna base material |
| 01/02/2001 | US6168854 Method of making a printed circuit board having a tin/lead coating |
| 01/02/2001 | US6168703 Copper foil and laminate containing a hydrogen inhibitor |
| 01/02/2001 | US6168474 Communications connector having crosstalk compensation |
| 01/02/2001 | US6168459 Flex support and seal apparatus for a disc drive |
| 01/02/2001 | US6168068 Method for preventing a gold plate connector on a PCB from being contaminated |
| 01/02/2001 | US6167615 Method for producing circuit board assemblies using surface mount components with finely spaced leads |
| 01/02/2001 | US6167614 Method of manufacturing and testing an electronic device, and an electronic device |
| 01/02/2001 | CA2111352C Electrical connectors |
| 01/02/2001 | CA2027697C Organosilicon materials |
| 12/28/2000 | WO2000079850A1 A method and apparatus for interconnecting multiple devices on a circuit board |
| 12/28/2000 | WO2000079848A1 Method for producing circuit-forming board, circuit-forming board, and carbon sheet |
| 12/28/2000 | WO2000079847A1 Transition between asymmetric stripline and microstrip in cavity |
| 12/28/2000 | WO2000079846A1 Transition between symmetric stripline and asymmetric stripline |
| 12/28/2000 | WO2000079845A1 An arrangement for mounting chips in multilayer printed circuit boards |
| 12/28/2000 | WO2000079668A1 High voltage transient voltage surge suppression fuse link system |
| 12/28/2000 | WO2000079639A1 Electrical transmission arrangement |
| 12/28/2000 | WO2000079638A1 Electrical transmission arrangement |
| 12/28/2000 | WO2000079637A1 Electrical transmission arrangement |
| 12/28/2000 | WO2000079370A1 Microprocessor module with integrated voltage regulators |
| 12/28/2000 | WO2000078873A1 Process for preparing green pigment composition containing no halogen |
| 12/28/2000 | DE19953841A1 Dual processor adapter card has two processor sockets with some interconnected pins and other pins corresponding to pins in a processor socket in a main circuit board |
| 12/28/2000 | DE19927046A1 Keramik-Metall-Substrat, insbesondere Mehrfachsubstrat A ceramic-metal substrate, in particular multiple substrate |
| 12/28/2000 | DE10016060A1 Motherboard structure has linearly distributed through-holes which are mutually formed at predetermined interval such that through-holes on alternate linearity are linear |
| 12/28/2000 | CA2340635A1 High voltage transient voltage surge suppression fuse link system |
| 12/27/2000 | EP1063873A2 Process for manufacturing substrates with patterned metallizations and holding and fixing element used in the process |
| 12/27/2000 | EP1063872A2 Electrical circuit arrangements |
| 12/27/2000 | EP1063733A2 Apparatus for providing controlled impedance in an electrical contact |
| 12/27/2000 | EP1063716A2 Carbon fibers containing non-woven fibre web for use as gas diffusion electrode substrate in fuel cells |
| 12/27/2000 | EP1063700A2 Substrate for high voltage modules |
| 12/27/2000 | EP1063699A1 Base sheet for semiconductor module, method for manufacturing base sheet for semiconductor module, and semiconductor module |
| 12/27/2000 | EP1063663A1 Method and arrangement for customizing electronic circuit interrupters |
| 12/27/2000 | EP1063547A1 Plastic packaged optoelectronic device |
| 12/27/2000 | EP1063334A1 Non-woven fibre webs |
| 12/27/2000 | EP1063262A1 Thermosetting polyphenylene ether resin composition, cured resin composition obtained therefrom, and laminated structure |
| 12/27/2000 | EP1063211A1 Silicon nitride sintered body and method of producing the same |
| 12/27/2000 | EP1062851A1 Modular power output stage |
| 12/27/2000 | EP1062849A1 Circuit board features with reduced parasitic capacitance and method therefor |
| 12/27/2000 | EP1062848A2 Integrated circuit connection using an electrically conductive adhesive |
| 12/27/2000 | EP1062695A1 Method for fabricating double sided ceramic circuit boards using a titanium support substrate |
| 12/27/2000 | EP1062634A1 Chip card equipped with a loop antenna, and associated micromodule |
| 12/27/2000 | EP1062545A1 Positive acting photodielectric composition |
| 12/27/2000 | EP1062289A1 Luminescent electroconductive adhesive |
| 12/27/2000 | EP0818061B1 Process for producing electrically conductive connecting structures |
| 12/27/2000 | CN1278369A Edge interface electrical connectors |
| 12/27/2000 | CN1277917A Mat under printed circuit board, and its processing art |
| 12/27/2000 | CN1059913C Method of adhesion to a polymide surface by formation of covalent bonds |
| 12/26/2000 | US6167149 Inspecting apparatus of mounting state of component or printing state of cream solder in mounting line of electronic component |
| 12/26/2000 | US6167083 Computer system and process for capture editing and playback of motion video compressed using interframe and intraframe techniques |
| 12/26/2000 | US6166915 Electronic circuits and circuit boards |
| 12/26/2000 | US6166894 PCB based protector cartridge |
| 12/26/2000 | US6166888 Low noise flexible printed circuit cable for a disk drive carriage unit |
| 12/26/2000 | US6166872 Storage apparatus |
| 12/26/2000 | US6166711 Plasma addressed electro-optical display |
| 12/26/2000 | US6166620 Resistance wiring board and method for manufacturing the same |
| 12/26/2000 | US6166554 Flexible electrical test fixture for integrated circuits on prototype and production printed circuit boards |
| 12/26/2000 | US6166464 Power module |
| 12/26/2000 | US6166457 Printed-circuit assembly |
| 12/26/2000 | US6165892 Method of planarizing thin film layers deposited over a common circuit base |
| 12/26/2000 | US6165820 Package for electronic devices |
| 12/26/2000 | US6165658 Nonlinear image distortion correction in printed circuit board manufacturing |
| 12/26/2000 | US6165629 Compensator with metal layer having etched opening with knife edge configuration and conforming polymer coating; dimensional stability |
| 12/26/2000 | US6165596 Multi-layer insulated metal substrate printed wiring board having improved thermal coupling of components |
| 12/26/2000 | US6165595 Component mounting board, process for producing the board, and process for producing the module |
| 12/26/2000 | US6165386 Conductive paste comprising photosetting resin and conductive powder containing both dendritic and scaly powders in specified weight ratio |
| 12/26/2000 | US6165309 Method for improving the adhesion of metal films to polyphenylene ether resins |
| 12/26/2000 | US6165278 Providing substantially water free solution comprising alcohol and neutral ammonium salt of organic acid; immersing electronic card in water-free solution for predetermined period of time to remove thermal grease |
| 12/26/2000 | US6165247 Methods for producing platinum powders |
| 12/26/2000 | US6165028 Card connector and a method of mounting the same on an associated printed circuit board |
| 12/26/2000 | US6165018 Connector having internal crosstalk compensation |
| 12/26/2000 | US6164993 Zero insertion force sockets using negative thermal expansion materials |
| 12/26/2000 | US6164982 IC socket for holding IC having multiple parallel pins |
| 12/26/2000 | US6164979 System for providing a removable high density electrical interconnect for flexible circuits |
| 12/26/2000 | US6164797 End mount ballast- socket bridge |
| 12/26/2000 | US6164520 Robust thick film conductors |
| 12/26/2000 | US6163957 Multilayer laminated substrates with high density interconnects and methods of making the same |
| 12/25/2000 | CA2311179A1 Plastic packaged optoelectronic device |
| 12/21/2000 | WO2000078111A1 Power controller and compressor for refrigeration system |
| 12/21/2000 | WO2000078107A1 High density substrate and methods for manufacturing same |
| 12/21/2000 | WO2000078106A1 Printed circuit board with a non-discrete capacitive element and method of manufacture |
| 12/21/2000 | WO2000078105A1 Multi-connection via |
| 12/21/2000 | WO2000078104A1 Split via surface mount connector and related techniques |
| 12/21/2000 | WO2000077907A1 Universal multi-functional common conductive shield structure for electrical circuitry and energy conditioning |
| 12/21/2000 | WO2000077883A1 Ablative method for forming rf ceramic block filters |
| 12/21/2000 | WO2000077649A1 Method for marking a hardware variant of an electrical or electronic hardware unit |
| 12/21/2000 | WO2000077563A1 A display module |
| 12/21/2000 | WO2000077116A1 Adhesive bonding laminates |
| 12/21/2000 | WO2000077112A1 Pressure-sensitive adhesive tape for provisionally fixing green sheet for ceramic electronic part and process for producing ceramic electronic part |
| 12/21/2000 | WO2000076938A1 Glass ceramics composition and electronic parts and multilayered lc multiple component using the same |