H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
01/1981
01/07/1981	EP0020477A1 Dynamic random access memory.
01/07/1981	EP0020412A1 Semiconductor device
01/07/1981	EP0020336A1 Semiconductor device comprising at least two semiconductor elements
01/06/1981	US4244002 Semiconductor device having bump terminal electrodes
01/06/1981	US4243998 Safety circuit for a semiconductor element
01/06/1981	US4243894 Solid state motor control universal assembly means and method
01/06/1981	US4243729 Metallic hermetic sealing cover for a container
12/1980
12/30/1980	US4242698 Maximum density interconnections for large scale integrated circuits
12/30/1980	US4242157 Using a curable dielectric adhesive which remains tacky during testing
12/30/1980	US4241829 Means for containing electrostatic sensitive electronic components
12/30/1980	CA1092726A1 Structure and fabrication method for integrated circuits with polysilicon lines having low sheet resistance
12/30/1980	CA1092724A1 Semiconductor pressure mounting
12/30/1980	CA1092721A1 Wiring substrate for a matrix circuit
12/24/1980	WO1980002891A1 Semiconductor device
12/23/1980	US4241436 Method of manufacturing of electronic modules for timepieces and electronic module obtained by carrying out this method
12/23/1980	US4241360 Series capacitor voltage multiplier circuit with top connected rectifiers
12/23/1980	US4240880 Method and apparatus for selectively plating a material
12/23/1980	US4240195 Doped polycrystalline silicon semiconductor
12/23/1980	CA1092253A1 Field effect transistors and fabrication of integrated circuits containing the transistors
12/16/1980	US4240099 Semiconductor device plastic jacket having first and second annular sheet metal strips with corrugated outer edges embedded in said plastic jacket
12/16/1980	US4240097 Field-effect transistor structure in multilevel polycrystalline silicon
12/16/1980	US4240095 Grooving and glassivating method for semiconductor wafers
12/16/1980	US4240094 Laser-configured logic array
12/16/1980	US4240092 Random access memory cell with different capacitor and transistor oxide thickness
12/16/1980	US4239867 Hard, clear castings for electronic components
12/16/1980	US4239312 Parallel interconnect for planar arrays
12/10/1980	EP0020179A1 Process for producing a semiconductor device using a crystalline insulating substrate
12/10/1980	EP0020135A1 Three-dimensional integration by graphoepitaxy
12/10/1980	EP0020116A1 Masterslice semiconductor device and method of producing it
12/10/1980	EP0019915A1 Method for preventing the corrosion of Al and Al alloys
12/10/1980	EP0019887A1 Semiconductor component with passivated semiconductor body
12/10/1980	EP0019883A2 Semiconductor device comprising a bonding pad
12/10/1980	EP0019781A2 Method to produce a metal thin film pattern
12/10/1980	EP0019780A1 Cooling device for electronic circuit modules
12/09/1980	US4238839 Laser programmable read only memory
12/09/1980	US4238759 Monolithic Peltier temperature controlled junction
12/09/1980	US4238528 Coating electronic circuits with a polyamide, solvent, and nonionic fluorocarbon surfactant; curing to a polyimide
12/09/1980	US4238527 Method of providing metal bumps on an apertured substrate
12/09/1980	US4237607 Silicon, copper, lamination, etching
12/09/1980	US4237606 Method of manufacturing multilayer ceramic board
12/09/1980	US4237600 Lamination, etching
12/09/1980	CA1091360A1 Normalized interconnection patterns
12/02/1980	US4237522 Chip package with high capacitance, stacked vlsi/power sheets extending through slots in substrate
12/02/1980	US4237472 High performance electrically alterable read only memory (EAROM)
12/02/1980	US4237382 Photocoupler device
12/02/1980	US4237086 Method for releasably mounting a substrate on a base providing heat transfer and electrical conduction
12/02/1980	US4236832 Strain insensitive integrated circuit resistor pair
12/02/1980	US4236777 Integrated circuit package and manufacturing method
12/02/1980	US4236294 High performance bipolar device and method for making same
11/1980
11/26/1980	EP0019391A1 Improvement in method of manufacturing electronic device having multilayer wiring structure
11/26/1980	EP0019280A1 Identity card with an integrated circuit component
11/26/1980	EP0019003A1 Method of manufacturing semiconductor laser devices
11/25/1980	US4236171 High power transistor having emitter pattern with symmetric lead connection pads
11/25/1980	US4235944 Process for producing gold conductors
11/25/1980	US4235645 Process for forming glass-sealed multichip semiconductor devices
11/25/1980	US4235644 Thick film silver metallizations for silicon solar cells
11/25/1980	US4235285 Self-fastened heat sinks
11/25/1980	US4235283 Multi-stud thermal conduction module
11/25/1980	CA1090477A1 Method of forming conductive tracks on a semiconductor device
11/18/1980	US4234889 Metal-to-moat contacts in N-channel silicon gate integrated circuits using discrete second-level polycrystalline silicon
11/18/1980	US4234888 Multi-level large scale complex integrated circuit having functional interconnected circuit routed to master patterns
11/18/1980	US4234666 Carrier tapes for semiconductor devices
11/18/1980	US4234367 Method of making multilayered glass-ceramic structures having an internal distribution of copper-based conductors
11/18/1980	US4234362 Method for forming an insulator between layers of conductive material
11/18/1980	US4234357 Process for manufacturing emitters by diffusion from polysilicon
11/18/1980	CA1090002A1 High performance integrated circuit semiconductor package and method of making
11/12/1980	EP0018890A1 Electrical insulating support with low thermal resistance, and base or box for power component, comprising such a support
11/12/1980	EP0018764A1 A semiconductor memory device in which soft errors due to alpha particles are prevented
11/12/1980	EP0018730A2 Semiconductor device having a high breakdown voltage
11/12/1980	EP0018489A2 A module for an array of integrated circuit chips, accomodating discretionary fly wire connections
11/12/1980	EP0018363A1 Semiconductor device comprising two semiconductor elements
11/11/1980	US4233645 Semiconductor package with improved conduction cooling structure
11/11/1980	US4233620 Sealing of integrated circuit modules
11/11/1980	US4233619 Light detector housing for fiber optic applications
11/11/1980	US4233337 Method for forming semiconductor contacts
11/11/1980	US4233133 Consisting of an organic solvent, an amine and a hydrohalogenic acid
11/11/1980	US4233103 Bonding semiconductor die to substrate
11/11/1980	US4233091 V-groove isolation structure
11/11/1980	US4232815 Integrated circuit lead coupling device and method
11/11/1980	US4232814 Method and apparatus for fabricating a sealing cover unit for a container for a semiconductor device
11/11/1980	CA1089205A1 Method of making a heat sink mounting
11/04/1980	US4232326 Chemically sensitive field effect transistor having electrode connections
11/04/1980	US4231901 Destaticizing packaged electronic components using an open-cell foam impregnated with particles and a binder
11/04/1980	US4231154 Electronic package assembly method
11/04/1980	CA1089112A1 Method of forming a compact multi-level interconnection metallurgy system for semiconductor devices
10/1980
10/30/1980	WO1980002343A1 Ceramic base
10/29/1980	EP0018250A1 Encapsulation housing for an electronic component, and component comprising such a housing
10/29/1980	EP0018175A2 Process for producing an electrode on a semiconductor device
10/29/1980	EP0018174A1 High frequency semiconductor device on an insulating substrate
10/29/1980	EP0018173A1 A programmable read-only memory device
10/29/1980	EP0018091A1 A semiconductor device having a plurality of semiconductor chip portions
10/29/1980	EP0017978A1 Semiconductor component with a disc-shaped housing
10/29/1980	EP0017934A2 Method of manufacturing insulated-gate field-effect transistors
10/29/1980	EP0017697A1 Interconnection device for integrated semiconductor circuits, and process for its manufacture
10/28/1980	US4231108 Semiconductor integrated circuit device
10/28/1980	US4231059 Technique for controlling emitter ballast resistance
10/28/1980	US4231058 Tungsten-titanium-chromium/gold semiconductor metallization
10/28/1980	US4230901 Housing for semiconductor device
10/28/1980	US4230754 Bonding electronic component to molded package
10/21/1980	US4229758 Package for semiconductor devices with first and second metal layers on the substrate of said package

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