| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/31/1981 | US4259366 Field effect transistors |
| 03/31/1981 | US4258652 DIP Top coating apparatus |
| 03/25/1981 | EP0025717A2 A semiconductor device comprising two insulating films and process for producing the same |
| 03/25/1981 | EP0025647A2 Electrical device and method for particle entrapment |
| 03/25/1981 | EP0025612A1 Semiconductor power component with an encasement |
| 03/24/1981 | US4258383 Minimum pressure drop liquid cooled structure for a semiconductor device |
| 03/24/1981 | US4258382 Expanded pad structure |
| 03/24/1981 | US4258381 Lead frame for a semiconductor device suitable for mass production |
| 03/24/1981 | US4258078 Laser melting to eliminate sharp edges |
| 03/18/1981 | EP0025347A2 Semiconductor devices having fuses |
| 03/18/1981 | EP0025325A2 Semiconductor memory device and the process for producing the same |
| 03/18/1981 | EP0025261A1 A method of manufacturing a semiconductor device |
| 03/18/1981 | EP0025210A2 Protection cap |
| 03/18/1981 | EP0025130A2 High-density read-only memory |
| 03/18/1981 | EP0025057A1 Thermo-compression bonding a semiconductor to strain buffer. |
| 03/17/1981 | US4257061 Thermally isolated monolithic semiconductor die |
| 03/17/1981 | US4257058 Package for radiation triggered semiconductor device and method |
| 03/17/1981 | US4256792 Thermoconductivity, casting, sintering |
| 03/17/1981 | US4255851 Method and apparatus for indelibly marking articles during a manufacturing process |
| 03/17/1981 | CA1097825A1 High performance bipolar device and method for making same |
| 03/17/1981 | CA1097788A1 Gas encapsulated cooling module |
| 03/11/1981 | EP0024905A2 Insulated-gate field-effect transistor |
| 03/11/1981 | EP0024775A2 A silver containing thick film conductor composition, a method for producing such a composition, a method of preparing a solar cell comprising screen printing said composition on an n-type layer of a semiconductor wafer and the solar cells thus obtained |
| 03/11/1981 | EP0024572A2 Electrically conductive contact or metallizing structure for semiconductor substrates |
| 03/10/1981 | US4255755 Heterostructure semiconductor device having a top layer etched to form a groove to enable electrical contact with the lower layer |
| 03/10/1981 | US4255229 Stripping fuses and connectors, etching raised doped oxide layer |
| 03/10/1981 | US4255210 Method for manufacturing a read-only memory device |
| 03/10/1981 | US4254548 Method of fabricating electrode plate for supporting semiconductor device |
| 03/03/1981 | US4254447 Integrated circuit heat dissipator |
| 03/03/1981 | US4254445 Discretionary fly wire chip interconnection |
| 03/03/1981 | US4254431 Restorable backbond for LSI chips using liquid metal coated dendrites |
| 03/03/1981 | US4254426 Pretreatment with carbon-containing film |
| 03/03/1981 | US4253518 Cooling installation working through a change in phase |
| 03/03/1981 | US4253515 Integrated circuit temperature gradient and moisture regulator |
| 03/03/1981 | CA1096594A1 Method of assembling a microcircuit with face-mounted leads |
| 02/25/1981 | EP0024185A2 Soldering apparatus |
| 02/24/1981 | US4252991 Multi-layer printed circuit |
| 02/24/1981 | US4252864 Lead frame having integral terminal tabs |
| 02/24/1981 | US4252582 Evaporation, dopes |
| 02/19/1981 | WO1981000489A1 Semiconductor embedded layer technology |
| 02/17/1981 | US4251876 Extremely low current load device for integrated circuit |
| 02/17/1981 | US4251852 Integrated circuit package |
| 02/17/1981 | CA1096024A1 Package fpr light-triggered thyristor |
| 02/11/1981 | EP0023850A1 Cryostat for photon detector and its use in a borehole logging tool |
| 02/11/1981 | EP0023818A2 Semiconductor integrated circuit device including a master slice and method of making the same |
| 02/11/1981 | EP0023810A1 Method of electron beam exposure |
| 02/11/1981 | EP0023791A1 CMOS semiconductor device |
| 02/11/1981 | EP0023534A2 Semiconductor device mounting structure and method of mounting |
| 02/10/1981 | US4250520 Flip chip mounted diode |
| 02/10/1981 | US4250347 Method of encapsulating microelectronic elements |
| 02/10/1981 | US4249941 Iron, tin, and phosphorus |
| 02/10/1981 | US4249299 Edge-around leads for backside connections to silicon circuit die |
| 02/04/1981 | EP0023400A1 Leadless packages for semiconductor devices |
| 02/04/1981 | EP0023324A1 Coating process |
| 02/04/1981 | EP0023294A2 Method for repairing integrated circuits |
| 02/04/1981 | EP0023241A2 Low-ohmic conductor for a semiconductor device and process for its manufacture |
| 02/03/1981 | US4249196 Integrated circuit module with integral capacitor |
| 02/03/1981 | US4249193 LSI Semiconductor device and fabrication thereof |
| 02/03/1981 | US4249034 Semiconductor package having strengthening and sealing upper chamber |
| 02/03/1981 | US4248920 Phenolic resin containing silica particles |
| 02/03/1981 | CA1095182A1 Integrated semiconductor crosspoint arrangement |
| 02/03/1981 | CA1095178A1 Microwave semiconductor device with improved thermal properties |
| 01/28/1981 | EP0023165A1 Lead frame carrier, in particular for integrated circuit housing, and housing comprising such a carrier |
| 01/28/1981 | EP0023146A2 Method of manufacturing a semiconductor device wherein first and second layers are formed |
| 01/27/1981 | US4247862 Ionization resistant MOS structure |
| 01/27/1981 | US4247623 Blank beam leads for IC chip bonding |
| 01/27/1981 | US4246697 Method of manufacturing RF power semiconductor package |
| 01/27/1981 | CA1094693A1 Thyristor |
| 01/27/1981 | CA1094692A1 Semiconductor device with layer of refractory material |
| 01/22/1981 | WO1981000172A1 Semiconductor contact shim and attachment method |
| 01/20/1981 | US4246626 Mechanical protection of electrical connectors of electronic power assemblies cooled by a fluorinated hydrocarbon |
| 01/20/1981 | US4246597 Air cooled multi-chip module having a heat conductive piston spring loaded against the chips |
| 01/20/1981 | US4246596 High current press pack semiconductor device having a mesa structure |
| 01/20/1981 | US4246595 Electronics circuit device and method of making the same |
| 01/20/1981 | US4246556 Low parasitic shunt diode package |
| 01/20/1981 | US4245877 Circuit package receptacle with movable base separation means |
| 01/14/1981 | EP0022359A1 Semiconductor contact shim, attachment method and semiconductor device including a contact shim |
| 01/14/1981 | EP0022176A1 Integrated-circuit chips module |
| 01/13/1981 | US4245273 Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices |
| 01/13/1981 | US4245232 Over-voltage clipping diode |
| 01/13/1981 | US4245165 Reversible electrically variable active parameter trimming apparatus utilizing floating gate as control |
| 01/13/1981 | US4244125 Label system for making integrated circuit diagrams and printed circuit boards |
| 01/13/1981 | CA1093704A1 Semiconductor device and method of enveloping the semiconductor device |
| 01/13/1981 | CA1093702A1 Semiconductor device and method of manufacturing same |
| 01/13/1981 | CA1093699A1 Conduction-cooled circuit package and method for making same |
| 01/07/1981 | EP0021818A1 Improved electronic device having multilayer wiring structure |
| 01/07/1981 | EP0021661A1 Semiconductor master-slice device |
| 01/07/1981 | EP0021643A1 Semiconductor device having a soft-error preventing structure |
| 01/07/1981 | EP0021480A1 Self-propelled translation lift apparatus |
| 01/07/1981 | EP0021402A2 Integrated circuit board |
| 01/07/1981 | EP0021400A1 Semiconductor device and circuit |
| 01/07/1981 | EP0021269A2 Cooling box for disc-type semiconductor components |
| 01/07/1981 | EP0021139A2 Process for producing a solder connection between a semiconductor device and a carrier substrate, and a semiconductor device made by such method |
| 01/07/1981 | EP0021133A2 Semiconductor device comprising an interconnection electrode and method of manufacturing the same |
| 01/07/1981 | EP0021025A1 Arrangement of Schottky diodes |
| 01/07/1981 | EP0020981A1 Arrangement for abducting heat from large-scale integrated semiconductor circuits |
| 01/07/1981 | EP0020911A2 Multi-chip modules capable of being air cooled |
| 01/07/1981 | EP0020857A1 Method and device for manufacturing a planar semiconductor element |
| 01/07/1981 | EP0020787A1 High frequency semiconductor unit |
| 01/07/1981 | EP0020665A1 Three-dimensionally structured microelectronic device. |